A glass stem for a highly waterproof LED filament lamp comprises an LED filament, a glass flare tube, an exhaust tube, a first lead wire having a resistance element, and a second lead wire. The first lead wire is placed in the middle of the exhaust tube. The first lead wire, the second lead wire, the top of the exhaust tube and the top of the glass flare tube are fusion-bonded together. A lower section of the exhaust tube is fused and cut off to an assembly-desired length and then fusion-sealed with the first lead wire to form a glass stem with the resistance element sealed in the middle of the exhaust tube. The first lead wire having the resistance element is disposed inside the exhaust tube, such that isolative insulation is generated between the first lead wire and a second lead wire.

The invention provides a method for producing a 3D item (1) by means of fused deposition modelling, the method comprising a 3D printing stage comprising: layer-wise depositing an extrudate (321) comprising 3D printable material (201), to provide the 3D item (1) comprising 3D printed material (202), wherein the 3D item (1) comprises a plurality of layers (322) of 3D printed material (202), wherein the 3D printable material (201) comprises core-shell 3D printable material (201) comprising (i) a core (221) comprising core material (240) and (ii) a shell (222) comprising shell material (250), wherein the core material (240) comprises a core thermoplastic material (241) and core additive material (242), wherein the shell material (250) comprises a shell thermoplastic material (251) and shell particles (252), wherein the shell material (250) is light transmissive for one or more wavelengths in the visible wavelength range, wherein the shell particles (252) comprise specularly reflective particles, wherein the core additive material (242) comprises one or more of diffuse reflective particles, white particles, black particles, colored particles, and dye molecules, and wherein the core material (240) and shell material (250) differ in one or more optical properties selected from the group of color, reflectivity, type of reflectivity, and absorption of light.

A lighting device with improved luminous performance is provided, which includes a first light path, a second light path and a plurality of first light sources and second light sources. The first light path includes a plurality of first bending portions and second bending portions arranged in staggered arrangement. Each first bending portion and each second ending portion protrude from one side and the other side of a first reference line respectively. The first light sources are distributed over the second bending portions. The second light path is connected to the first light path in parallel, and includes a plurality of third bending portions and fourth bending portions arranged in the staggered arrangement. Each third bending portion and each fourth bending portion protrude from one side and the other side of a second reference line respectively. The second light sources are distributed over the third bending portions.

A lighting device with improved luminous performance is provided, which includes a first light path, a second light path and a plurality of first light sources and second light sources. The first light path includes a plurality of first bending portions and second bending portions arranged in staggered arrangement. Each first bending portion and each second ending portion protrude from one side and the other side of a first reference line respectively. The first light sources are distributed over the second bending portions. The second light path is connected to the first light path in parallel, and includes a plurality of third bending portions and fourth bending portions arranged in the staggered arrangement. Each third bending portion and each fourth bending portion protrude from one side and the other side of a second reference line respectively. The second light sources are distributed over the third bending portions.

A circuit board, a light-emitting diode (LED) retrofit lamp for use with the circuit board and a method of manufacturing an LED retrofit lamp are described herein. A circuit board includes a body part and two longitudinal fingers symmetrically extending from the body part in a longitudinal direction of the LED retrofit lamp.

An embedded light source in a composite panel. A first electrode and a second electrode are associated with a first layer of material. A light source is positioned in electrical communication with the first electrode and the second electrode. An assembly comprising the first layer of material, the first electrode, the second electrode, and the light source is processed to form a multilayer panel with an embedded light source.

An embedded light source in a composite panel. A first electrode and a second electrode are associated with a first layer of material. A light source is positioned in electrical communication with the first electrode and the second electrode. An assembly comprising the first layer of material, the first electrode, the second electrode, and the light source is processed to form a multilayer panel with an embedded light source.

A heatsink, a light-emitting diode (LED) module and a corresponding method of manufacture are described. A heatsink includes an electrically conductive heatsink core and an electrically insulating layer covering at least the first surface of the electrically conductive heatsink core. The electrically conductive heatsink core has a first pin that is integral with the electrically conductive heatsink core and protrudes from a first surface of the heatsink core. At least the first surface of the heatsink core is covered by an electrically insulating layer, which leaves at least portions of a lateral surface of the first pin exposed from the electrically insulating layer.

A heatsink, a light-emitting diode (LED) module and a corresponding method of manufacture are described. A heatsink includes an electrically conductive heatsink core and an electrically insulating layer covering at least the first surface of the electrically conductive heatsink core. The electrically conductive heatsink core has a first pin that is integral with the electrically conductive heatsink core and protrudes from a first surface of the heatsink core. At least the first surface of the heatsink core is covered by an electrically insulating layer, which leaves at least portions of a lateral surface of the first pin exposed from the electrically insulating layer.

A light-emitting device includes a carrier with a first surface and a second surface opposite to the first surface; and a light-emitting unit disposed on the first surface and configured to emit a light toward but not passing through the first surface. When emitting the light, the light-emitting device has a first light intensity above the first surface, and a second light intensity under the second surface, a ratio of the first light intensity to the second light intensity is in a range of 2˜9.