Provided is a light emitting diode (LED) substrate. The LED substrate includes a substrate of a rectangular shape having sides in a first direction and a second direction, a plurality of LED devices placed on a surface of the substrate, and a plurality of conducting member which electrically connects the plurality of LED devices on the surface of the substrate and forms 2n circuits independent from each other in the first direction. Each circuit has a first electrode part and a second electrode part. The first electrode part receives input of an electric current from the outside, the second electrode part outputs an electric current to the outside, and the first electrode part and the second electrode part face each other in the second direction, and are alternately placed in the first direction to be point-symmetrical with respect to a center of the substrate as a symmetry point.

Provided is a light emitting diode (LED) substrate. The LED substrate includes a substrate of a rectangular shape having sides in a first direction and a second direction, a plurality of LED devices placed on a surface of the substrate, and a plurality of conducting member which electrically connects the plurality of LED devices on the surface of the substrate and forms 2n circuits independent from each other in the first direction. Each circuit has a first electrode part and a second electrode part. The first electrode part receives input of an electric current from the outside, the second electrode part outputs an electric current to the outside, and the first electrode part and the second electrode part face each other in the second direction, and are alternately placed in the first direction to be point-symmetrical with respect to a center of the substrate as a symmetry point.

Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose directly embedded a smart module with a lighting fixture utilizing metal core PCB (MCPCB).

A light-emitting device including a substrate with a top surface and a bottom surface opposite to the top surface and a plurality of LED chips disposed on the top surface and configured to generate a top light visible above the top surface and a bottom light visible beneath the bottom surface, each LED chip comprising a plurality of light-emitting surfaces. The substrate has a thickness greater than 200 m and comprises aluminum oxide, sapphire, glass, plastic, or rubber. The plurality of LED chips has an incident light with a wavelength of 420-470 nm. The top light and the bottom light have a color temperature difference of not greater than 1500K.

A light-emitting device including a substrate with a top surface and a bottom surface opposite to the top surface and a plurality of LED chips disposed on the top surface and configured to generate a top light visible above the top surface and a bottom light visible beneath the bottom surface, each LED chip comprising a plurality of light-emitting surfaces. The substrate has a thickness greater than 200 m and comprises aluminum oxide, sapphire, glass, plastic, or rubber. The plurality of LED chips has an incident light with a wavelength of 420-470 nm. The top light and the bottom light have a color temperature difference of not greater than 1500K.

A backlight module and an electronic device are provided. When an optical assembly is assembled, a first positioning portion and a second positioning portion are cooperatively positioned to receive the optical assembly within accommodating spaces via the backlight module, such that a distance between a light guide plate and a backlight source is less than or equal to a threshold value, preventing a circumstance from occurring during assembly in which the distance between the light guide plate and the backlight source is excessively large, causing the light guide plate to not be able to completely receive light emitted by the backlight source.

A backlight module and an electronic device are provided. When an optical assembly is assembled, a first positioning portion and a second positioning portion are cooperatively positioned to receive the optical assembly within accommodating spaces via the backlight module, such that a distance between a light guide plate and a backlight source is less than or equal to a threshold value, preventing a circumstance from occurring during assembly in which the distance between the light guide plate and the backlight source is excessively large, causing the light guide plate to not be able to completely receive light emitted by the backlight source.

A threadless magnetic lightbulb and socket system includes a lightbulb base having a neck with a threadless exterior surface and a socket having a receptacle with a threadless interior surface configured to receive the neck. A first magnet is positioned at a tip of the lightbulb base and a second magnet is positioned in the receptacle of the socket such that the first magnet and the second magnet are configured to attract each other to magnetically retain the lightbulb within the socket. A threadless magnetic lightbulb includes a lightbulb base having a neck with a threadless exterior surface and a magnet positioned at a tip of the lightbulb base. A threadless magnetic socket includes a socket having a receptacle with a threadless interior surface configured to receive a lightbulb base and a magnet positioned in the receptacle of the socket.

In an example embodiment of the disclosed technology, a modular pod lighting system for plants may comprise a light containment enclosure, which may further comprise a light panel with one side configured to emit light, wherein the light panel may be configured to hang from an above structural element in a relatively horizontal orientation. The modular pod lighting system for plants may further comprise side reflection curtains attached to opposing edges of the light panel, wherein the reflection curtains may extend downwards away from the light panel. The light containment enclosure may be configured to partially enclose plants therein, and wherein light emitted from the light panel may be partially contained and recycled within the light containment enclosure. The light containment enclosure may further comprise bottom reflectors disposed on top of plant containment devices.

In an example embodiment of the disclosed technology, a modular pod lighting system for plants may comprise a light containment enclosure, which may further comprise a light panel with one side configured to emit light, wherein the light panel may be configured to hang from an above structural element in a relatively horizontal orientation. The modular pod lighting system for plants may further comprise side reflection curtains attached to opposing edges of the light panel, wherein the reflection curtains may extend downwards away from the light panel. The light containment enclosure may be configured to partially enclose plants therein, and wherein light emitted from the light panel may be partially contained and recycled within the light containment enclosure. The light containment enclosure may further comprise bottom reflectors disposed on top of plant containment devices.