A light source that is adapted to replace existing fluorescent tubes in an existing fluorescent light fixture is disclosed. The light source includes a plurality of LEDs mounted on a heat-dissipating structure, first and second plug adapters that mate with the florescent tube connectors of the fluorescent tube the light source is to replace, and a power adapter that converts power from a fluorescent tube ballast presented on the first and second plug adapters to DC power that powers the LEDs. The light source is powered from the output of the existing fluorescent ballast. The light source can utilize the existing metallic enclosure as a heat-radiating surface and/or direct air heat transfer from the surface of the heat-dissipating structure.

A power tool includes: a motor; an output shaft that is rotated by a rotational force of the motor; a chip-on-board light emitting diode disposed around the output shaft; and a suppression device configured to suppress a temperature of the chip-on-board light emitting diode to a predetermined allowable value or less.

A power tool includes: a motor; an output shaft that is rotated by a rotational force of the motor; a chip-on-board light emitting diode disposed around the output shaft; and a suppression device configured to suppress a temperature of the chip-on-board light emitting diode to a predetermined allowable value or less.

Apparatus and associated methods relate to an LED device having thermally compartmentalized enclosures. In an illustrative example, a lighting device may include an LED module and a power circuit. The power circuit, for example, may include a heat generating component (HGC) (e.g., a power transistor) and a thermally sensitive component (TSC) (e.g., a capacitor). For example, the lighting device may include a first enclosure including the HGC, and a second enclosure including the TSC. In operation, the first enclosure may be higher than the second enclosure. In some implementations, the second enclosure may be thermally isolated from the first enclosure, and physically external to the first enclosure and the LED module. For example, the second enclosure may be exposed to an ambient environment. Various embodiments may advantageously maintain the temperature of the second enclosure isolated from, and lower than, the temperature of the first enclosure.

Apparatus and associated methods relate to an LED device having thermally compartmentalized enclosures. In an illustrative example, a lighting device may include an LED module and a power circuit. The power circuit, for example, may include a heat generating component (HGC) (e.g., a power transistor) and a thermally sensitive component (TSC) (e.g., a capacitor). For example, the lighting device may include a first enclosure including the HGC, and a second enclosure including the TSC. In operation, the first enclosure may be higher than the second enclosure. In some implementations, the second enclosure may be thermally isolated from the first enclosure, and physically external to the first enclosure and the LED module. For example, the second enclosure may be exposed to an ambient environment. Various embodiments may advantageously maintain the temperature of the second enclosure isolated from, and lower than, the temperature of the first enclosure.

An illuminator includes a substrate, an interlayer, a plurality of connecting pads, a plurality of LEDs, and a plurality of adhesive blocks. The interlayer is on the substrate. The connecting pads are on a side of the interlayer away from the substrate. Each LEDs is on a corresponding connecting pad. Each adhesive blocks bonds one LED to one connecting pad. The interlayer defines a plurality of grooves, each of the grooves corresponds to a connecting pad, each grooves includes an opening through a surface of the interlayer facing the top side of the illuminator. The opening is configured and arranged so that the corresponding adhesive block, in a molten form, flows through the opening into the corresponding groove of the plurality of grooves. A method of fabricating the illuminator and a method of repairing the illuminator are further disclosed.

An illuminator includes a substrate, an interlayer, a plurality of connecting pads, a plurality of LEDs, and a plurality of adhesive blocks. The interlayer is on the substrate. The connecting pads are on a side of the interlayer away from the substrate. Each LEDs is on a corresponding connecting pad. Each adhesive blocks bonds one LED to one connecting pad. The interlayer defines a plurality of grooves, each of the grooves corresponds to a connecting pad, each grooves includes an opening through a surface of the interlayer facing the top side of the illuminator. The opening is configured and arranged so that the corresponding adhesive block, in a molten form, flows through the opening into the corresponding groove of the plurality of grooves. A method of fabricating the illuminator and a method of repairing the illuminator are further disclosed.

An LED light fixture for a hazardous location includes an axially elongated enclosure fabricated from a polymer material, at least one axially elongated linear light emitting diode (LED) module mounted in the enclosure, and an LED driver module mounted in the housing that operates the at least one linear light emitting diode. A combination of a cover lens material of the cover lens and the polymer material of the axially elongated enclosure assists with heat dissipation from the light fixture, thereby allowing the LED driver module and the at least one axially elongated linear printed circuit board with LED components to operate within a target peak temperature limit for the hazardous location.

An LED light fixture for a hazardous location includes an axially elongated enclosure fabricated from a polymer material, at least one axially elongated linear light emitting diode (LED) module mounted in the enclosure, and an LED driver module mounted in the housing that operates the at least one linear light emitting diode. A combination of a cover lens material of the cover lens and the polymer material of the axially elongated enclosure assists with heat dissipation from the light fixture, thereby allowing the LED driver module and the at least one axially elongated linear printed circuit board with LED components to operate within a target peak temperature limit for the hazardous location.

A solid state lamp includes a connector and a bulb portion with multiple strips.