The present disclosure relates generally to a “clocking” mechanism that give customers the flexibility to adjust light output distribution of luminaires to a desired level. The “clocking” mechanism gives the flexibility to adjust a position of a retainer ring of a LED system with respect to a mounting module that includes a heat sink adapter housing.

The present disclosure relates to various embodiments to enable the assembly, construction, and operation of a miniature integrated LED lamp comprising an envelope positioned at a distal end of a solid body portion and a base positioned at a proximal end of the solid body. The envelope further comprises a transparent light diffuser enclosing a semi-cylindrical light pipe containing one or more LEDs populated on its external surface and a LED driver positioned internally within a formed lumen of the light pipe. The light pipe and LED driver are physically and or electrically connected to a cylindrical heatsink encapsulated within the envelope and body portion of the bulb, facilitating thermal management. The envelope and base are assembled together with one or more specific lamp bases to form an LED lamp satisfying performance standards suitable for retrofit or replacement of a standard INC or halogen lamp.

The present disclosure proposes an LED lamp with omnidirectional heat dissipation, which includes an LED lamp housing including a power supply component inside, and a heat sink supporting an LED chip. The LED lamp housing and the heat sink are separated by a heat insulation member to block thermal influence between each other. The LED lamp of the present disclosure adds a heat insulation plate between the LED lamp housing for placing the power supply component and the heat sink, to block and weaken the mutual influence between the heat generated by the LED chip and the heat generated by the power supply component. The design improves the problem of excessively high ambient temperature inside the power supply cavity of the traditional LED lamps, effectively avoids damage to the power supply device due to long-term working in a high-temperature environment, and improves the service life of the LED lamp.

A heat sink assembly has a base of non-conductive heat sink material which provides good heat transfer (e.g., aluminum nitride) and two electrical pathways are integrally formed with, and separated by, the base. An LED assembly is thermally and electrically bonded to the top surface of the heat sink assembly.

A heat sink assembly has a base of non-conductive heat sink material which provides good heat transfer (e.g., aluminum nitride) and two electrical pathways are integrally formed with, and separated by, the base. An LED assembly is thermally and electrically bonded to the top surface of the heat sink assembly.

The present disclosure relates to a backlight module and a display device. The backlight module includes: a heat sinking plate; a mold frame fixed to the heat sinking plate and surrounding a region on the heat sinking plate; and a reflection plate disposed in the region surrounded by the mold frame such that the reflection plate can be moved relative to the heat sinking plate.

The present disclosure relates to a backlight module and a display device. The backlight module includes: a heat sinking plate; a mold frame fixed to the heat sinking plate and surrounding a region on the heat sinking plate; and a reflection plate disposed in the region surrounded by the mold frame such that the reflection plate can be moved relative to the heat sinking plate.

The present disclosure relates to various embodiments to enable the assembly, construction, and operation of a miniature integrated LED lamp comprising an envelope positioned at a distal end of a solid body portion and a base positioned at a proximal end of the solid body. The envelope further comprises a transparent light diffuser enclosing a semi-cylindrical light pipe containing one or more LEDs populated on its external surface and a LED driver positioned internally within a formed lumen of the light pipe. The light pipe and LED driver are physically and or electrically connected to a cylindrical heatsink encapsulated within the envelope and body portion of the bulb, facilitating thermal management. The envelope and base are assembled together with one or more specific lamp bases to form an LED lamp satisfying performance standards suitable for retrofit or replacement of a standard INC or halogen lamp.

An electromagnetic illuminator heater is provided having a heat generating wire and an elongate encasement of thermally transmissive, temperature mitigating, and electrically insulative material. The material encompasses the elongate heating wire. A heater for devices is also provided.

The present disclosure provides a multifunctional LED lamp, which includes: a main lamp body; one or more LED light-emitting modules connected with the main lamp body; a face recognition module disposed on the main lamp body; an infrared sensing module disposed on the main lamp body; a photosensitive module disposed on the main lamp body; and a control module in communication connection with the face recognition module, the infrared sensing module, and the photosensitive module. The multifunctional LED lamp includes multiple working modes, and the control module controls working states of the face recognition module, the infrared sensing module, and the photosensitive module to switch the working modes. By installing different sensors, the LED lamp of the present disclosure integrates various functions such as lighting, security warning, entertainment, lighting, health, etc., and can realize different working modes by combining different sensors.