The present disclosure proposes an LED lamp with omnidirectional heat dissipation, which includes an LED lamp housing including a power supply component inside, and a heat sink supporting an LED chip. The LED lamp housing and the heat sink are separated by a heat insulation member to block thermal influence between each other. The LED lamp of the present disclosure adds a heat insulation plate between the LED lamp housing for placing the power supply component and the heat sink, to block and weaken the mutual influence between the heat generated by the LED chip and the heat generated by the power supply component. The design improves the problem of excessively high ambient temperature inside the power supply cavity of the traditional LED lamps, effectively avoids damage to the power supply device due to long-term working in a high-temperature environment, and improves the service life of the LED lamp.

Provided is a lighting apparatus that is suitable as a substitute for a conventional halogen lamp when positively utilizing leaked light. The lighting apparatus comprises: a heat dissipator 12 that is in one of a bottomed cylindrical shape and a bowl shape, and that has a bottom portion, a circumferential wall portion, and an opening; and a light-emitting device 18b that is provided inside the heat dissipator 12 at the bottom portion and is operable to emit light, wherein the heat dissipator 12 has one or more windows 19 for leaking the emitted light outside the heat dissipater 12.

A light source includes a socket connection, a base connected to the socket connection, an LED unit, a mount and a heat conductive material. The socket connection is capable of connecting to a source of electricity. The mount is disposed into the base, and has a top surface on which the LED unit are disposed and a side surface devoid of the LED unit. The heat conductive material directly contacts the LED unit and the side surface of the mount. The heat conductive material enters into a space flanked by the mount and the base and is substantially translucent or transparent such that light emitted from the LED unit is able to pass through the heat conductive material.

A light source includes a socket connection, a base connected to the socket connection, an LED unit, a mount and a heat conductive material. The socket connection is capable of connecting to a source of electricity. The mount is disposed into the base, and has a top surface on which the LED unit are disposed and a side surface devoid of the LED unit. The heat conductive material directly contacts the LED unit and the side surface of the mount. The heat conductive material enters into a space flanked by the mount and the base and is substantially translucent or transparent such that light emitted from the LED unit is able to pass through the heat conductive material.

A heat dissipation system for a heat source, wherein the heat dissipation system comprises a heat pipe, a heat coupling-in element, and a heat coupling-out element, wherein the heat coupling-out element comprises at least 50% by weight of a thermally conductive thermoplastic composition having an in-plane thermal conductivity of 1 to 50 W/(m*K). Also provided is a luminaire.

An LED lamp, comprising a base; a lamp envelope coupled to the base; a support module accommodated in the lamp envelope, a first inner cavity being formed between the support module and the lamp envelope, the first inner cavity containing therein a first gas medium; a driver module accommodated in the first inner cavity and coupled to the support module; and an LED inner vessel accommodated in the first inner cavity and coupled to at least one of the support module and the driver module, a sealed second inner cavity being formed within the LED inner vessel, and the second inner cavity containing therein a second gas medium and an LED light source module.

An LED lamp, comprising a base; a lamp envelope coupled to the base; a support module accommodated in the lamp envelope, a first inner cavity being formed between the support module and the lamp envelope, the first inner cavity containing therein a first gas medium; a driver module accommodated in the first inner cavity and coupled to the support module; and an LED inner vessel accommodated in the first inner cavity and coupled to at least one of the support module and the driver module, a sealed second inner cavity being formed within the LED inner vessel, and the second inner cavity containing therein a second gas medium and an LED light source module.

The present disclosure includes an LED lamp assembly comprising a glass envelope, an LED platform supported by a stem arrangement disposed within the envelope, a base hermetically sealed to the envelope, a gas disposed within the envelope providing thermal conductivity between the LED platform and the envelope, and a getter disposed within the envelope for absorbing volatile organic compounds. The lamp may maintain a ratio of helium to oxygen that achieves both an acceptable thermal conductivity and an acceptable lumen output over the life of the LED lamp.

A light source cooling body (100), a light source assembly, a luminaire and a method to manufacture a light source cooling body or a light source assembly are provided. The light source cooling body comprises a homogeneous body (104) made of a thermally conductive material. The homogenous body comprises an open space that comprises a wick structure, a condenser (112) and an evaporator (116). Near the evaporator the light source cooling body has an interface area (102) to thermally couple with a light source and to receive heat from the light source. The condenser is arranged away from the interface area. A portion 114 of the open space is tubular shaped. The open space may hold a cooling liquid partially in the gaseous phase and partially in the liquid phase and the wick structure is configured to transport the cooling material in the liquid phase towards the evaporator.

A heat dissipation system for a heat source, wherein the heat dissipation system comprises a heat pipe, a heat coupling-in element, and a heat coupling-out element, wherein the heat coupling-out element comprises at least 50% by weight of a thermally conductive thermoplastic composition having an in-plane thermal conductivity of 1 to 50 W/(m*K). Also provided is a luminaire.