A light fixture includes a housing, and a lighting module. The housing defines first and second portions. The second portion defines a window. The lighting module is at least partially disposed in the second portion. The lighting module includes a submount, a plurality of light emitting diodes, a lens cover, and an encapsulating material. The plurality of light emitting diodes is coupled with the submount and is configured to project light through the window. The lens cover includes an exterior surface and overlies the plurality of light emitting diodes and the submount such that the lens cover and the submount define an interior therebetween. The encapsulating material substantially fills the interior.

A light fixture includes a housing, and a lighting module. The housing defines first and second portions. The second portion defines a window. The lighting module is at least partially disposed in the second portion. The lighting module includes a submount, a plurality of light emitting diodes, a lens cover, and an encapsulating material. The plurality of light emitting diodes is coupled with the submount and is configured to project light through the window. The lens cover includes an exterior surface and overlies the plurality of light emitting diodes and the submount such that the lens cover and the submount define an interior therebetween. The encapsulating material substantially fills the interior.

An LED luminaire and potting method having the following steps: introducing a configured luminaire into an at least partly optically transparent potting mold (16), such that the luminaire does not come into contact with the walls of the potting mold; introducing an optically transparent potting compound (18) into the potting mold (16) until at least the luminaire is surrounded; and detecting a quantity of bubbles by an optical sensor or image detector (14), wherein the pressure in the vacuum chamber (11) is controlled in order to influence the bubbles and/or a pivot/inclination device (12) is controlled in order to move the vacuum chamber (11) and/or the potting mold (16) in order to expel detected gas/air bubbles (19) out of the optically transparent potting compound (18).

An LED luminaire and potting method having the following steps: introducing a configured luminaire into an at least partly optically transparent potting mold (16), such that the luminaire does not come into contact with the walls of the potting mold; introducing an optically transparent potting compound (18) into the potting mold (16) until at least the luminaire is surrounded; and detecting a quantity of bubbles by an optical sensor or image detector (14), wherein the pressure in the vacuum chamber (11) is controlled in order to influence the bubbles and/or a pivot/inclination device (12) is controlled in order to move the vacuum chamber (11) and/or the potting mold (16) in order to expel detected gas/air bubbles (19) out of the optically transparent potting compound (18).

A lighting apparatus for hazardous environments, comprising at least one substantially point-like source of light, and a housing structure for said at least one substantially point-like source of light, defining at least a triple barrier protective encapsulation to seal and insulate said at least one source of light from the environment, wherein said triple barrier protective encapsulation is at least partially optically transmissive to enable light propagation from said at least one source of light to the environment at predefined wavelengths.

A lighting device contains light-emitting elements and has an elongated shape. The lighting device has a housing that has reflective side walls extending in a longitudinal direction of the housing; a cavity formed between the reflective side walls; and light-emitting elements arranged at least partially along the longitudinal direction relative to each other in the cavity. An opening of the cavity forms a light-emitting area, A width of the cavity expands from the light-emitting elements towards the opening at least in sections. A reflective element covers at least a section of the opening and reflects a part of light emitted from the light-emitting elements towards the cavity and reduces a width of the light-emitting area compared to a width of the opening.

A lighting device contains light-emitting elements and has an elongated shape. The lighting device has a housing that has reflective side walls extending in a longitudinal direction of the housing; a cavity formed between the reflective side walls; and light-emitting elements arranged at least partially along the longitudinal direction relative to each other in the cavity. An opening of the cavity forms a light-emitting area, A width of the cavity expands from the light-emitting elements towards the opening at least in sections. A reflective element covers at least a section of the opening and reflects a part of light emitted from the light-emitting elements towards the cavity and reduces a width of the light-emitting area compared to a width of the opening.

A sealing process of LED modules includes a waterproof wire put through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, which are subjected to glue sealing treatment. A waterproof sealing process is operated between the waterproof wire and wire-through hole. The PCB board is fixed on the heat sink. One sealing ring is placed into a groove. A ring of liquid silica gel is evenly applied along the other groove. The heat sink installed with the PCB board and the waterproof wire are inversely buckled on the lens set which is fixed with the solid silica gel ring and liquid silica gel. At least two waterproof sealing rings are used to isolate an LED chip from the outside so as to prevent all water vapor or other harmful gases from corroding the chip and the PCB.

A sealing process of LED modules includes a waterproof wire put through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, which are subjected to glue sealing treatment. A waterproof sealing process is operated between the waterproof wire and wire-through hole. The PCB board is fixed on the heat sink. One sealing ring is placed into a groove. A ring of liquid silica gel is evenly applied along the other groove. The heat sink installed with the PCB board and the waterproof wire are inversely buckled on the lens set which is fixed with the solid silica gel ring and liquid silica gel. At least two waterproof sealing rings are used to isolate an LED chip from the outside so as to prevent all water vapor or other harmful gases from corroding the chip and the PCB.

A mat including at least one lighting element, for use in a range of applications including during vehicle maintenance or when camping. The mat typically providing comfort and lighting to a user. The mat also optionally including a range of surface structures to assist with, for example, liquid capture or drainage, and/or dropped item collection.