A light bulb comprising has a substrate having a light emitting member provided thereon and a main body in which the substrate is positioned. The main body comprises a heat sink, a power supply, electrical contact members electrically connecting the substrate to the power supply and electrical leads extending from the power supply to the electrical contact members. The electrical leads extend through the heat sink.

An optoelectronic semiconductor device includes a substrate with a first main side and a second main side. A plurality of light-emitting semiconductor chips is distributed over the first main side and over the second main side. A molding compound encloses the light-emitting semiconductor chips in a lateral direction. The molding compound levels with the light-emitting semiconductor chips in a direction away from the substrate. The molding compound has a top side facing away from the substrate. A plurality of planar electrical interconnects run on the top side and electrically connects the light-emitting semiconductor chips on their radiation exit sides facing away from the substrate.

A light bulb including a substrate having a light emitting member provided thereon; and a main body in which the substrate is removably received, the main body having a heat sink and electrical contact members. The electrical contact members include an electrically conductive body portion that is mounted to the main body and the electrically conductive body portion mechanically secures the substrate in position in the main body.

A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.

A lens component radiates light from a light source. The lens component includes a light guiding radiation portion. The light guiding radiation portion includes a light incidence portion having an incidence surface on which the light from the light source is made incident, and a plurality of radiation mechanisms that respectively radiate to a plurality of radiation angle ranges. The incidence surface includes a close side incidence region and a distant side incidence region. The radiation angle ranges include a close side radiation angle range and a distant side radiation angle range. The light incident on the close side incidence region is radiated to the distant side radiation angle range via a corresponding distant side radiation mechanism. The light incident on the distant side incidence region is radiated to the close side radiation angle range via a corresponding close side radiation mechanism.

An LED retrofit lamp for a projection headlight system comprises a heat dissipating body portion and a substantially rectangular substrate. A first LED group is mounted on a first surface of the substrate and a second LED group is mounted on a second surface. A support bracket is configured to engage longitudinal sides of the substrate to mechanically support the substrate in alignment with a central optical axis of the headlight system so that light emitted by the first and second LED groups parallel to the first and second surfaces illuminates corresponding top and bottom segments of a cooperating reflector with sufficient intensity for projection headlight system to form a beam having substantially homogenous light intensity.

A solid state lamp includes a connector and a bulb portion with multiple strips.

A light emitting device configured to tunably emit light with a total color temperature (CT.sub.tot), comprising: a carrier comprising a first major surface and an opposite second major surface, a first light source, arranged on said first major surface, and arranged to emit light with a first color temperature (CT.sub.1) tunably adjustable within a first range from a first low to a first high color temperature, a second light source, arranged on said second major surface, and arranged to emit light with a second color temperature (CT.sub.2) tunably adjustable within a second range from a second high to second low temperature, a controller configured to individually control the first and second light sources so to tunably adjust CT.sub.1 and CT.sub.2 from a first state to a second state according to a preselected scheme, by increasing CT.sub.1 and decreasing CT.sub.2 between said first and second states, such that CT.sub.tot remains unvaried.

A solid state lamp includes a connector and a bulb portion with multiple strips.

A light emitting device filament includes a substrate, a plurality of light emitting diodes, two electrode pads, and a plurality of connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extending in a first direction and having a width in a second direction. The plurality of light emitting diodes is disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The plurality of connection lines electrically connects the plurality of light emitting diodes and the two electrode pads. The plurality of connection lines includes a first connection line and a second connection line. The first connection line, the second connection line, or both are formed in a direction inclined or curved with respect to the first direction or the second direction.