A cooling system for a photovoltaic panel including micro flat heat pipes (HP) integrated with thermoelectric generators (TEG) and a cooled water reservoir for cooling the working fluid in heat pipes. The cooled water in the reservoir is pumped from the condensate pan of an air conditioner. Experimental results show that cooling system reduced the average temperature of the panel by as much as 19° C. or 25%. Further, the output power of the photovoltaic panel increased by 44% when the photovoltaic panel was used in a very hot climate (30-40° C.). An additional two watts of power was generated by the TEGs.

A humidor heat exchanger system and method for using thereof to control temperature and relative humidity are disclosed. The humidor heat exchanger system comprises two or more processors coupled to one or more memories, one or more communication interfaces, one or more thermoelectric modules, one or more compressors, one or more heaters, two or more LEDs, one or more fans, one or more sensors, one or more displays, one or more water collectors, one or more doors, one or more water reservoirs, and one or more evaporators. The two or more processors are communicatively connected to the one or more thermoelectric modules, one or more compressors, one or more heaters, two or more LEDs, one or more fans, one or more sensors, one or more displays, one or more water collectors, one or more doors, and one or more water reservoirs, and one or more evaporators. The two or more processors of the humidor heat exchanger system are configured to control temperature and relative humidity of a humidor by: detecting temperature in the one or more thermoelectric modules; detecting temperature in the one or more evaporators; checking temperature difference between the one or more thermoelectric modules and the one or more evaporators; calculating average temperature value in the one or more thermoelectric modules as to not force the one or more compressors to operate outside a safety region and not be powered on before the necessary period of time to balance cooling circuit pressure; activating the one or more compressors depending on the temperature difference between the one or more thermoelectric modules and the one or more evaporators; dynamically adjusting temperature control parameters as a function of adjusted temperature variation conditions; initiating relative humidity control; checking output of the one or more thermoelectric modules; adjusting power output of the one or more thermoelectric modules to attain desired relative humidity value; and stabilizing relative humidity exactly to the value adjustment made without oscillating about 1%.

The present invention relates to a radiation-emitting device (100), comprising at least one radiation source (110) configured to emit radiation of at least one wavelength towards a target (190) or towards a subject (192); at least one space or surface (140) configured to place the target (190) or the subject (192) therein or thereon; at least one means (185) configured to control the at last one radiation source's radiation emission towards the target (190) or towards the subject (192); wherein the radiation-emitting device (100) further comprises: at least one dual heating or cooling system (170) configured to heat or to cool the at least one space or surface (140) and comprising a Peltier device (171), said Peltier device (171) comprising at least two cuboids (172, 172′) made of two semiconductor materials having different electron densities, said at least two cuboids (172, 172′) being placed thermally in parallel to each other and electrically in series, interconnected with thermally conducting metal bridging plates (173, 173′) and sandwiched between a non-conducting material reduced temperature cover plate (174) and a non-conducting material elevated temperature cover plate (174′) and configured to be supplied with DC electric current via electrical connections (179); at least one first heat exchanger (175) thermally connected as a heat source to the Peltier device's (171) reduced temperature cover plate (174); at least one second heat exchanger (176) thermally connected as a heat sink to the Peltier device's (171) elevated temperature cover plate (174′); at least one fan or fan assembly (177, 178) configured to cause environmental air to flow along the at least one heat exchanger (175, 176); at least one nozzle (180) configured to pass and direct the environmental air flow having passed the at least one first and/or second heat exchanger (175, 176) and heated or cooled towards the at least one space or surface (140) configured to place the target (190) or the subject (192) therein or thereon; and at least one means (181) configured to control the DC electric current supply to the Peltier device (171). The invention also relates to a dual heating or cooling system, to the use of the dual heating or cooling system in a radiation-emitting device and a method of alternatingly heating or cooling areas or parts of a radiation-emitting device (100) before, during or after a radiation-emitting o

An air conditioning system for conditioning room air comprising an air supply device (1) having an extraction air chamber (2), into which room extraction air from the room is introduced, and a power source (3) for powering the air supply device. The air supply device comprises at least one pettier-element (4) having a first side (20) arranged to condition at least part of the room extraction air before it being diffused into the room.

A thermoelectric cooling device includes a tank including an inlet hole and an outlet hole, a thermoelectric pad that faces an outer surface of the tank to cool liquid received in the tank, a heat dissipation unit including a heat transfer block coming into contact with the thermoelectric pad, a heat pipe that passes through the heat transfer block, a heat sink connected to the heat pipe, and a fan that blows air to the heat sink, and a controller that controls an output of the thermoelectric pad.

A temperature control layer, for example for an interior trim of a vehicle or a vehicle part is disclosed. The temperature control layer includes an areal thermoelectrical temperature control arrangement with at least one thermoelectrical element and an air extraction arrangement with at least one air extraction duct. The at least one air extraction duct leads from an outside of the temperature control layer through the temperature control arrangement to an inside of the temperature control layer.

An improved locker seat includes a pair of spaced-apart upstanding sidewalls having a pair of lateral edges. A generally horizontal seat is disposed between the lateral edges of the sidewalls. In a first mode, an air source is connected to an airway formed within the seat to create an airflow. The airflow from the air source creates a first temperature differential to cool the seat. In a second mode, an external or internal heat source provides heat to a top surface of the seat, creating a second temperature differential to heat the seat. The first and second temperature differential are distributed across the top surface of the seat. The seat is hinged to be movable about the hinge between an open and a closed position.

Systems and methods are disclosed herein for fluid-dynamic isolation of actively conditioned and return air flow in unconstrained environments. In some embodiments, a system for fluid-dynamic isolation of actively conditioned and return air flow in an unconstrained environment includes: a heat pump subsystem configured to create a conditioned air circuit; and an air curtain subsystem configured to create an air curtain air circuit that isolates the conditioned air circuit from an environment that is external to the system. In this way, conditioned air can be provided in spaces that were impractical before. In addition, this might be done in an efficient way.

The present invention relates to a semiconductor refrigeration and heating air conditioner which includes a body with an air outlet and air inlets, and also includes a semiconductor refrigeration assembly mounted in the body and located at the air outlet, metallic conductive sheets connected with the semiconductor refrigeration assembly, a water tank mounted at the lower end inside the body, a cooling water receptacle mounted at the lower end inside the body, a heat dissipation assembly mounted in the cooling water receptacle, and fan blades mounted in the body and close to the air inlets, wherein the semiconductor refrigeration assembly is connected with the heat dissipation assembly through a connection wire, the metallic conductive sheets face the air outlet, and the water tank is connected with the cooling water receptacle through a water pump assembly.

A foothold including a thermoelectric module includes a body having an air channel in which a suction fan is provided and a dissipation channel in which a dissipation fan is provided, and a cover including an air discharge portion disposed on the body. Further, the thermoelectric element is disposed between the dissipation heat sink and the cover.