A refrigeration cycle apparatus includes a first refrigerant circuit including a first compressor, a first heat exchanger, a first refrigerant flow path of a second heat exchanger, a first expansion device, a third heat exchanger, and a second refrigerant flow path of a fourth heat exchanger, and a second refrigerant circuit including a second compressor, a fifth heat exchanger, a second expansion device, a third refrigerant flow path of the second heat exchanger, and a fourth refrigerant flow path of the fourth heat exchanger, a first refrigerant flows through, in order, the first compressor, the first heat exchanger, the first refrigerant flow path, the first expansion device, the third heat exchanger, and the second refrigerant flow path, the second refrigerant flows through, in order, the second compressor, the fifth heat exchanger, the second expansion device, the third refrigerant flow path, and the fourth refrigerant flow path.

A heating, ventilation, and air conditioning (“HVAC”) system includes an evaporator coil and a compressor fluidly coupled to the evaporator coil via a suction line. A condenser coil is fluidly coupled to the compressor via a discharge line and fluidly coupled to a metering device via a liquid line. A charge compensator is fluidly coupled to the liquid line via a connection line. A charge compensator re-heat valve is disposed in the connection line.

A sub-fab area installation apparatus includes: a vacuum pump configured to evacuate a processing gas from a processing chamber of the semiconductor manufacturing equipment; a cooling unit configured to cool a first circulation liquid used in the processing chamber; a heating unit configured to heat a second circulation liquid used in the processing chamber; and a cooling-liquid line configured to pass a cooling liquid therethrough. The cooling liquid is supplied from a cooling source. The cooling-liquid line includes: a distribution line configured to supply the cooling liquid to the vacuum pump and the cooling unit; and a merging return line configured to merge the cooling liquid that has passed through the vacuum pump and the cooling unit and return the cooling liquid to the cooling source.

A multiple-circuit heating and cooling system includes a first refrigeration circuit having a first condenser and a first evaporator and a second refrigeration circuit having a second condenser and a second evaporator. The first condenser and the second condenser are arranged in a first row split configuration, and the second condenser is downstream of the first condenser relative to a first air flow directed across the second condenser and the first condenser. Additionally, the first evaporator and the second evaporator are arranged in a second row split configuration, and the first evaporator is downstream of the second evaporator relative to a second air flow directed across the first evaporator and the second evaporator.

A refrigeration system includes at least one refrigeration circuit 2. The refrigeration circuit 2 includes a compressor 10, a first heat rejecting heat exchanger 6, a second heat rejecting heat exchanger 8, an expansion valve 12 and a heat absorbing heat exchanger 4. The refrigeration circuit 2 further includes a heat recovery control valve 14 for controlling flow of the compressed refrigerant fluid between the first heat rejecting heat exchanger and the second heat rejecting heat exchanger. The first heat rejecting heat exchanger 6 is for receiving compressed refrigerant fluid from the compressor 10 and exchanging heat between the compressed refrigerant fluid and a second fluid to increase the temperature of the second fluid. The second heat rejecting heat exchanger 8 is for receiving the compressed refrigerant fluid and exchanging heat with ambient air to cool the compressed refrigerant fluid.

A refrigeration system includes at least one refrigeration circuit 2. The refrigeration circuit 2 includes a compressor 10, a first heat rejecting heat exchanger 6, a second heat rejecting heat exchanger 8, an expansion valve 12 and a heat absorbing heat exchanger 4. The refrigeration circuit 2 further includes a heat recovery control valve 14 for controlling flow of the compressed refrigerant fluid between the first heat rejecting heat exchanger and the second heat rejecting heat exchanger. The first heat rejecting heat exchanger 6 is for receiving compressed refrigerant fluid from the compressor 10 and exchanging heat between the compressed refrigerant fluid and a second fluid to increase the temperature of the second fluid. The second heat rejecting heat exchanger 8 is for receiving the compressed refrigerant fluid and exchanging heat with ambient air to cool the compressed refrigerant fluid.

The invention relates to a refrigerant circuit (1), in particular for use in a vehicle, preferably a motor vehicle, comprising: an air conditioning compressor (2), a main condenser (4), at least one connectable condenser (5), and a switching means (3) which is designed to connect one or more of the switchable condensers (5) to the refrigerant circuit (1), wherein a pressure equalising means (6) is configured to equalise an internal pressure of the at least one connectable condenser (5) with an internal pressure of the main condenser (4).

A trans-critical thermodynamic system includes an expansion device and a separator. The expansion device receives a supercritical fluid containing solutes. The expansion device is operable to expand the supercritical fluid to produce a sub-critical gas by reducing a temperature and/or a pressure of the supercritical fluid. The separator removes the solutes from the sub-critical gas.

A refrigeration appliance, in particular a household refrigeration appliance, includes at least first, second and third storage chambers, and a refrigerant circuit on which the following are connected in series between a pressure connection and a suction connection of a compressor: a condenser, a first expansion valve, a first heat exchanger of the first storage chamber, a second expansion valve, a second heat exchanger of the second storage chamber, a third heat exchanger assigned to the third storage chamber, and a control circuit for controlling operation of the compressor and the expansion valves. The third heat exchanger is connected in series downstream of the second heat exchanger. The control circuit is configured to maintain a higher storage temperature in the third storage chamber than in the second storage chamber. A method for operating the refrigeration appliance and a computer program product are also provided.

A multi-refrigeration-cycle apparatus capable of reducing an installation area for equipment installed in a sub-fab and capable of shortening a pipe for delivering a cooling medium to a semiconductor-device manufacturing equipment is disclosed. The multi-refrigeration-cycle apparatus includes: a first refrigeration cycle having a first refrigerant for performing heat exchange with a cooling medium for cooling the semiconductor-device manufacturing equipment, the first refrigerant circulating in the first refrigeration cycle; and a second refrigeration cycle having a second refrigerant for performing heat exchange with the first refrigerant, the second refrigerant circulating in the second refrigeration cycle. At least a part of the first refrigeration cycle is arranged in a clean room where the semiconductor-device manufacturing equipment is installed, and the second refrigeration cycle is arranged in a sub-fab.