A Stirling cooler structure having multiple cooling modules includes at least one power unit, a pipeline, a plurality of Stirling cooling modules, and at least one piezoresistive unit. The power unit includes a cylinder and a piston. The pipeline is connected to the cylinder. The Stirling cooling modules each include a pipe and a passive displacer. The passive displacer is reciprocally, movably disposed in the pipe to partition the pipe into a cold end and a hot end. The hot end is connected to the pipeline. The piston is driven by an electric motor for a compressed air to flow through the pipeline to the hot end and then flow to the cold end through the passive displacer, such that the cold end absorbs ambient heat. The piezoresistive unit is selectively disposed between the Stirling cooling modules and the cylinder.

A Stirling cooler structure having multiple cooling modules includes at least one power unit, a pipeline, a plurality of Stirling cooling modules, and at least one piezoresistive unit. The power unit includes a cylinder and a piston. The pipeline is connected to the cylinder. The Stirling cooling modules each include a pipe and a passive displacer. The passive displacer is reciprocally, movably disposed in the pipe to partition the pipe into a cold end and a hot end. The hot end is connected to the pipeline. The piston is driven by an electric motor for a compressed air to flow through the pipeline to the hot end and then flow to the cold end through the passive displacer, such that the cold end absorbs ambient heat. The piezoresistive unit is selectively disposed between the Stirling cooling modules and the cylinder.

The disclosure relates to a cryogen-free cooling apparatus for cooling a sample, comprising a vacuum chamber, a first cooling device which is configured to generate a first temperature in the vacuum chamber to provide a main thermal bath, a second cooling device, which is in connection with a sample stage on which a sample is to be arranged, wherein the second cooling device is a solid state cooler which is configured to provide a second temperature to the sample stage, and wherein the second temperature is different from the first temperature, and a sample loading device which is configured to change the sample while operating the first cooling device and the second cooling device, wherein the sample stage is held in the vacuum chamber by a plurality of first fibers of low thermal conductivity such that the sample stage is thermally decoupled from the main thermal bath.

The disclosure relates to a cryogen-free cooling apparatus for cooling a sample, comprising a vacuum chamber, a first cooling device which is configured to generate a first temperature in the vacuum chamber to provide a main thermal bath, a second cooling device, which is in connection with a sample stage on which a sample is to be arranged, wherein the second cooling device is a solid state cooler which is configured to provide a second temperature to the sample stage, and wherein the second temperature is different from the first temperature, and a sample loading device which is configured to change the sample while operating the first cooling device and the second cooling device, wherein the sample stage is held in the vacuum chamber by a plurality of first fibers of low thermal conductivity such that the sample stage is thermally decoupled from the main thermal bath.

Systems and methods of continuous cooling at cryogenic temperatures. One exemplary aspect involves a refrigeration system that includes: a chamber adapted to hold liquid and gaseous coolant received from a cooling pot; a first adsorption pump having an inlet end in fluid communication with the chamber, the first adsorption pump configured to capture gas from the liquid and gaseous coolant when the first adsorption pump is enabled; a second adsorption pump having an inlet end in fluid communication with the chamber, the second adsorption pump configured to capture gas from the liquid and gaseous coolant when the second adsorption pump is enabled; a means for desorbing the gas captured by the first adsorption pump; and a means for desorbing the gas captured by the second adsorption pump.

A cryogenic cooling system is provided comprising: a cooled plate (2) thermally coupled to a cryogenic refrigerator (9), a heat switch assembly and a target assembly (5). The target assembly (5) comprises a target refrigerator (12) configured to obtain a lower base temperature than the cryogenic refrigerator (9). The heat switch assembly (18) comprises one or more gas gap heat switches, the heat switch assembly (18) having a first end thermally coupled to the cooled plate (2) and a second end thermally coupled to the target assembly (5). A sorption pump (22) is provided for controlling the thermal conductivity across the heat switch assembly (18) in accordance with the temperature of the sorption pump (22) The sorption pump (22) is thermally coupled to the cryogenic refrigerator (9), by a thermal link (46) extending from the cooled plate (2) to the heat switch assembly (18). The sorption pump (22) is arranged at a position along the thermal link (46) between the heat switch assembly 18 and the cooled plate (2).

A cryogenic cooling system is provided comprising: a cooled plate (2) thermally coupled to a cryogenic refrigerator (9), a heat switch assembly and a target assembly (5). The target assembly (5) comprises a target refrigerator (12) configured to obtain a lower base temperature than the cryogenic refrigerator (9). The heat switch assembly (18) comprises one or more gas gap heat switches, the heat switch assembly (18) having a first end thermally coupled to the cooled plate (2) and a second end thermally coupled to the target assembly (5). A sorption pump (22) is provided for controlling the thermal conductivity across the heat switch assembly (18) in accordance with the temperature of the sorption pump (22) The sorption pump (22) is thermally coupled to the cryogenic refrigerator (9), by a thermal link (46) extending from the cooled plate (2) to the heat switch assembly (18). The sorption pump (22) is arranged at a position along the thermal link (46) between the heat switch assembly 18 and the cooled plate (2).

A cryogenic cooling system is provided comprising a primary insert (118) and a demountable secondary insert (128). The primary insert (118) comprises a plurality of primary plates (111, 112), each primary plate having a primary contact surface, and one or more primary connecting members (117) arranged so as to connect the plurality of primary plates (111, 112). The demountable secondary insert (128) comprises a plurality of secondary plates (121, 122), each secondary plate having a secondary contact surface, and one or more secondary connecting members (127) arranged so as to connect the plurality of secondary plates (121, 122) such that the secondary insert (128) is self-supporting. One or more adjustment members are configured such that, when the secondary insert (128) is mounted to the primary insert (118), the adjustment members cause the primary and secondary contact surfaces of the respective primary (111, 112) and secondary plates (121, 122) to be brought into conductive thermal contact.

A cryogenic cooling system is provided comprising a primary insert (118) and a demountable secondary insert (128). The primary insert (118) comprises a plurality of primary plates (111, 112), each primary plate having a primary contact surface, and one or more primary connecting members (117) arranged so as to connect the plurality of primary plates (111, 112). The demountable secondary insert (128) comprises a plurality of secondary plates (121, 122), each secondary plate having a secondary contact surface, and one or more secondary connecting members (127) arranged so as to connect the plurality of secondary plates (121, 122) such that the secondary insert (128) is self-supporting. One or more adjustment members are configured such that, when the secondary insert (128) is mounted to the primary insert (118), the adjustment members cause the primary and secondary contact surfaces of the respective primary (111, 112) and secondary plates (121, 122) to be brought into conductive thermal contact.

A pneumatically driven cryogenic refrigerator operating primarily on the Gifford-McMahon (GM) cycle is switched from cooling to heating by a switch valve between a rotary valve and a drive piston that causes the displacer to reciprocate. The rotary valve has ports at two radii, one that cycles flow to the displacer and a second that cycles flow to the drive piston. Two ports cycle flow to the top of the drive piston, the “cooling” port optimizes the cooling cycle and the “heating” port provides a good heating cycle. A switch valve that changes the flow from one port to the other can be linearly or rotary actuated. The rotary valve does not reverse direction.