Systems and methods for improving the performance of dilution refrigeration systems are described. Filters and traps employed in the helium circuit of a dilution refrigerator may be modified to improve performance. Some traps may be designed to harness cryocondensation as opposed to cryoadsorption. A cryocondensation trap employs a cryocondensation surface having a high thermal conductivity and a high specific heat with a binding energy that preferably matches at least one contaminant but does not match helium. Multiple traps may be coupled in series in the helium circuit, with each trap designed to trap a specific contaminant or set of contaminants. Both cryocondensation and cryoadsorption may be exploited among multiple traps.

Systems and methods for improving the performance of dilution refrigeration systems are described. Filters and traps employed in the helium circuit of a dilution refrigerator may be modified to improve performance. Some traps may be designed to harness cryocondensation as opposed to cryoadsorption. A cryocondensation trap employs a cryocondensation surface having a high thermal conductivity and a high specific heat with a binding energy that preferably matches at least one contaminant but does not match helium. Multiple traps may be coupled in series in the helium circuit, with each trap designed to trap a specific contaminant or set of contaminants. Both cryocondensation and cryoadsorption may be exploited among multiple traps.

Techniques facilitating efficient thermal profile management within cryogenic environments are provided. In one example, a cryostat can comprise a plurality of thermal stages intervening between a 4-Kelvin (K) stage and a Cold Plate stage. The plurality of thermal stages can include a Still stage and an intermediate thermal stage that provides additional cooling capacity for the cryostat. The intermediate thermal stage can be directly coupled mechanically to the Still stage via a support rod.

Techniques facilitating efficient thermal profile management within cryogenic environments are provided. In one example, a cryostat can comprise a plurality of thermal stages intervening between a 4-Kelvin (K) stage and a Cold Plate stage. The plurality of thermal stages can include a Still stage and an intermediate thermal stage that provides additional cooling capacity for the cryostat. The intermediate thermal stage can be directly coupled mechanically to the Still stage via a support rod.

A dilution refrigerator, such as for a quantum computing system, includes a cryostat having a plurality of temperature-controlled flanges inside a vacuum chamber. A dilution unit is disposed inside the cryostat and operable to cool a first group of the flanges. A continuous flow helium refrigerator is in heat transfer communication with a lowest temperature flange of a second group of flanges, disposed at progressively lower temperatures that are greater than those of the first group of flanges, to provide primary cooling thereto to a first temperature. The continuous flow helium refrigerator resides at least partially in the cryostat and includes a helium liquefier and a first closed-loop circuit thermally coupling the helium liquefier to the lowest temperature flange of the second group of flanges. The helium liquefier provides liquid helium to the lowest temperature flange of the second group of flanges via the first closed-loop circuit.

A heat exchanger includes: a low temperature side channel through which low temperature liquid helium flows; a high temperature side channel through which high temperature liquid helium flows; and a thermal conduction unit that conducts heat from the high temperature side channel to the low temperature side channel. The thermal conduction unit has a partition member that separates the high temperature side channel and the low temperature side channel from each other and a thermal resistance reduction unit that reduces the thermal resistance between the partition member and the liquid helium. The thermal resistance reduction unit has a porous body having nano-size pores and fine metal particles having higher thermal conductivity than that of the porous body.

A heat exchanger includes: a low temperature side channel through which low temperature liquid helium flows; a high temperature side channel through which high temperature liquid helium flows; and a thermal conduction unit that conducts heat from the high temperature side channel to the low temperature side channel. The thermal conduction unit has a partition member that separates the high temperature side channel and the low temperature side channel from each other and a thermal resistance reduction unit that reduces the thermal resistance between the partition member and the liquid helium. The thermal resistance reduction unit has a porous body having nano-size pores and fine metal particles having higher thermal conductivity than that of the porous body.

Techniques facilitating multiple cryogenic systems sectioned within a common vacuum space are provided. In one example, a cryostat can comprise a plurality of thermal stages and a thermal switch. The plurality of thermal stages can intervene between a 4-Kelvin (K) stage and a Cold Plate stage. The plurality of thermal stages can include a Still stage and an intermediate thermal stage that can be directly coupled mechanically to the Still stage via a support rod. The thermal switch can be coupled to the intermediate thermal stage and an adjacent thermal stage. The thermal switch can facilitate modifying a thermal profile of the cryostat by providing a switchable thermal path between the intermediate thermal stage and the adjacent thermal stage.

A dilution refrigerator is provided. The dilution refrigerator includes an outer vacuum chamber comprising at least one substantially planar surface and an opening in the at least one substantially planar surface configured to provide access to an interior of the outer vacuum chamber.

A dilution refrigerator is provided. The dilution refrigerator includes an outer vacuum chamber comprising at least one substantially planar surface and an opening in the at least one substantially planar surface configured to provide access to an interior of the outer vacuum chamber.