Patent classifications
F25B9/12
LOW THERMAL CONDUCTIVITY SUPPORT SYSTEM FOR CRYOGENIC ENVIRONMENTS
Techniques facilitating low thermal conductivity support systems within cryogenic environments are provided. In one example, a cryostat can comprise a support rod and a washer. The support rod can couple first and second thermal stages of the cryostat. The washer can intervene between the support rod and the first thermal stage. The washer can thermally isolate the support rod and the first thermal stage.
1 KELVIN AND 300 MILLIKELVIN THERMAL STAGES FOR CRYOGENIC ENVIRONMENTS
Techniques facilitating efficient thermal profile management within cryogenic environments are provided. In one example, a cryostat can comprise a plurality of thermal stages intervening between a 4-Kelvin (K) stage and a Cold Plate stage. The plurality of thermal stages can include a Still stage and an intermediate thermal stage that provides additional cooling capacity for the cryostat. The intermediate thermal stage can be directly coupled mechanically to the Still stage via a support rod.
1 KELVIN AND 300 MILLIKELVIN THERMAL STAGES FOR CRYOGENIC ENVIRONMENTS
Techniques facilitating efficient thermal profile management within cryogenic environments are provided. In one example, a cryostat can comprise a plurality of thermal stages intervening between a 4-Kelvin (K) stage and a Cold Plate stage. The plurality of thermal stages can include a Still stage and an intermediate thermal stage that provides additional cooling capacity for the cryostat. The intermediate thermal stage can be directly coupled mechanically to the Still stage via a support rod.
MULTIPLE CRYOGENIC SYSTEMS SECTIONED WITHIN A COMMON VACUUM SPACE
Techniques facilitating multiple cryogenic systems sectioned within a common vacuum space are provided. In one example, a cryostat can comprise a plurality of thermal stages and a thermal switch. The plurality of thermal stages can intervene between a 4-Kelvin (K) stage and a Cold Plate stage. The plurality of thermal stages can include a Still stage and an intermediate thermal stage that can be directly coupled mechanically to the Still stage via a support rod. The thermal switch can be coupled to the intermediate thermal stage and an adjacent thermal stage. The thermal switch can facilitate modifying a thermal profile of the cryostat by providing a switchable thermal path between the intermediate thermal stage and the adjacent thermal stage.
TRAPPED ION ARCHITECTURE IN A DILUTION REFRIGERATOR FOR USE WITH SUPERCONDUCTING QUBIT SYSTEMS
A quantum computing system includes a dilution refrigerator having a plurality of chambers. A trapped ion computing device includes a first set of qubits in a given chamber of the plurality of chambers of the dilution refrigerator. A superconducting computing device having a second set of superconducting qubits is inside the given chamber of the plurality of chambers of the dilution refrigerator.
TRAPPED ION ARCHITECTURE IN A DILUTION REFRIGERATOR FOR USE WITH SUPERCONDUCTING QUBIT SYSTEMS
A quantum computing system includes a dilution refrigerator having a plurality of chambers. A trapped ion computing device includes a first set of qubits in a given chamber of the plurality of chambers of the dilution refrigerator. A superconducting computing device having a second set of superconducting qubits is inside the given chamber of the plurality of chambers of the dilution refrigerator.
Interleaved Cryogenic Cooling System for Quantum Computing Applications
A cryogenic cooling system for use in quantum computing applications can include a plurality of cryogenic cooling stages. Each of the plurality of cryogenic cooling stages can include a plurality of interleaved cooling units. The plurality of interleaved cooling units can include a first cooling unit and a second cooling unit. Each of the plurality of interleaved cooling units can have an associated operating temperature range. One or more signal lines that couple one or more classical processors to one or more quantum systems can pass through each of the plurality of interleaved cooling units for each of the plurality of cryogenic cooling stages.
Cryocooler and cryocooler operation method
In a cryocooler for developing coldness of 4 K or lower by expanding helium, an expander expands high-pressure helium. A compressor compresses low-pressure helium returned from the expander, to generate high-pressure helium, and supplies the high-pressure helium to the expander. When helium temperature in the expander is 2.17 K or lower, the pressure of the low-pressure helium is equal to or higher than pressure given by a curve, in a helium state diagram in which the horizontal axis is temperature and the vertical axis is pressure, along which helium's volumetric thermal expansion coefficient is 0.
Cryocooler and cryocooler operation method
In a cryocooler for developing coldness of 4 K or lower by expanding helium, an expander expands high-pressure helium. A compressor compresses low-pressure helium returned from the expander, to generate high-pressure helium, and supplies the high-pressure helium to the expander. When helium temperature in the expander is 2.17 K or lower, the pressure of the low-pressure helium is equal to or higher than pressure given by a curve, in a helium state diagram in which the horizontal axis is temperature and the vertical axis is pressure, along which helium's volumetric thermal expansion coefficient is 0.
Cryogenic apparatus
A cryogenic apparatus (10) comprises: an enclosure (12); a thermo-mechanical cooler (22) and a sample tube (20) that both project into the enclosure (12), where the sample tube (20) has a closed end; a pump (92) with a pump inlet and a pump outlet, and a duct to supply helium gas from the pump outlet to the thermo-mechanical cooler (22) to produce cold helium. The sample tube (20) has a first inlet (74) to allow a fluid into the sample tube (20), and a second inlet (83) to supply fluid to a thermal element (42) in thermal contact with the sample tube (20), and also has a first outlet (26) to withdraw fluid from within the sample tube (20), and a second outlet (28) to withdraw fluid from the thermal element (42). The apparatus also comprises a first duct including a first valve (80) to supply the cold helium to the first inlet (74) and a second duct including a second valve (82) to supply the cold helium to the second inlet (83); and either or both of the first outlet (26) and the second outlet (28) may be connected to the inlet of the pump (92). This enables a specimen to be cooled either in a static mode, relying on natural convection, or in a dynamic mode, with a forced gas flow, or using both modes at once. These different options enable an operator to achieve different cooling rates.