A fluid phase change thermal management cooling method and apparatus for removing heat from a source of heat, the method comprising the steps of: filling a cooling chamber with volume V1 of a fluid phase change thermal management cooling apparatus with a fluid in its liquid phase; increasing the volume of the cooling chamber to volume V2 to va-pourise a portion of the fluid from its liquid phase to its vapour phase such that there is substantially only the fluid in its liquid phase and fluid in its vapour phase within the volume V2; allowing a dwell time that provides for at least some of the fluid in its liquid phase that has contact with a heated surface of the cooling chamber to be vaporised; and repeating the steps where timing of the steps and dwell time between steps is selected to control heat build-up within selected limits.

A method of generating electrical energy using an electrochemical direct heat to electricity converter operating on the Rankine cycle is provided. The converter includes a working fluid, a high temperature electrochemical cell including a first membrane electrode assembly, a low temperature electrochemical cell including a second membrane electrode assembly, an evaporator coupled to the first electrochemical cell, a condenser coupled to the second electrochemical cell, and an external load. The method involves introducing the working fluid at the first membrane electrode assembly as a liquid, expanding the working fluid through the first membrane electrode assembly and evaporating it into a vapor, and cooling and condensing the vapor back into a liquid at the second membrane electrode assembly.

A flexible two-phase cooling apparatus for cooling microprocessors in servers can include a primary cooling loop, a first bypass, and a second bypass. The primary cooling loop can include a reservoir, a pump, an inlet manifold, an outlet manifold, and flexible cooling lines extending from the inlet manifold to the outlet manifold. The flexible cooling lines can be routable within server housings and can be fluidly connected to two or more series-connected heat sink modules that are mountable on microprocessors of the servers. The flexible cooling lines can be configured to transport low-pressure, two-phase dielectric coolant. The first bypass can include a first pressure regulator configured to regulate a first bypass flow of coolant through the first bypass. The second bypass can include a second pressure regulator configured to regulate a second bypass flow of coolant through the second bypass.

A method of absorbing heat from two or more devices can employ a two-phase cooling apparatus that pumps low-pressure coolant through two or more fluidly-connected and series-connected heat sink modules. A flow of subcooled single-phase liquid coolant can be provided to an inlet of a first heat sink module in thermal communication with a first device. Within the first heat sink module, the flow of subcooled single-phase liquid coolant can absorb a first amount of heat from the first device as sensible heat. The flow of subcooled single-phase liquid coolant can be transported from an outlet of the first heat sink module to an inlet of a second heat sink module. Within the second heat sink module, the flow of subcooled single-phase liquid coolant can absorb a second amount of heat from the second device partially as sensible heat and partially as latent heat and thereby transform to two-phase bubbly flow.

A microprocessor assembly adapted for fluid cooling can include a semiconductor die mounted on a substrate. The semiconductor die can include an integrated circuit with a two-dimensional and/or three-dimensional circuit architecture. The assembly can include a heat sink module in thermal communication with the semiconductor die. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. When pressurized coolant is delivered to the inlet chamber, the plurality of orifices can provide jet streams of coolant into the outlet chamber and against a surface to be cooled to provide fluid cooling suitable to control a semiconductor die temperature during operation.

A cooling device of an embodiment includes an evaporator, a condenser, a first connection pipe, a second connection pipe, and a third connection pipe. A refrigerant is vaporized in the evaporator by heat generated by a heating element. The condenser is located above the evaporator, and configured to condense the vaporized refrigerant by exchanging heat with an external fluid. The first connection pipe guides the refrigerant vaporized by the evaporator to the condenser. The second connection pipe guides the refrigerant condensed by the condenser to the evaporator. The third connection pipe connects a portion of the first connection pipe and a portion of the second connection pipe. A connection position between the third connection pipe and the first connection pipe is higher than a maximum liquid level height of the refrigerant in the second connection pipe during an operation.

The invention is for an apparatus and method for a refrigerator and a heat pump based on the magnetocaloric effect (MCE) offering a simpler, lighter, robust, more compact, environmentally compatible, and energy efficient alternative to traditional vapor-compression devices. The subject magnetocaloric apparatus alternately exposes a suitable magnetocaloric material to strong and weak magnetic field while switching heat to and from the material by a mechanical commutator comprising heat pipe elements. The invention may be practiced with multiple magnetocaloric stages to attain large differences in temperature. Key applications include thermal management of electronics, as well as industrial and home refrigeration, heating, and air conditioning. The invention offers a simpler, lighter, compact, and robust apparatus compared to magnetocaloric devices of prior art. Furthermore, the invention may be run in reverse as a thermodynamic engine, receiving low-level heat and producing mechanical energy.

A heat sink module for cooling a heat providing surface can include an inlet chamber and an outlet chamber formed within the heat sink module. The outlet chamber can have an open portion that can be enclosed by the heat providing surface when the heat sink module is installed on the heat providing surface. The heat sink module can include a dividing member disposed between the inlet chamber and the outlet chamber. The dividing member can include a first plurality of orifices extending from a top surface of the dividing member to a bottom surface of the dividing member. The first plurality of orifices can be configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the heat providing surface when the heat sink module is installed on the heat providing surface and when pressurized coolant is provided to the inlet chamber.

The present invention relates to a passive type organic working fluid ejector refrigeration method. The liquid organic working fluid of the reservoir is added to evaporator using gravity. Then the refrigerant absorbs heat during evaporation in the evaporator. When the refrigerant temperature and pressure increases to a certain value, the self-operated pressure regulator valve automatically opens and the ejector begins to work. After condensing in the condenser, the working fluid divided into two streams. One stream returns to the reservoir and the other one flows into the cooling evaporator of refrigeration cycle to produce chilled water about 12° C. When the liquid refrigerant is completely evaporated in the evaporator, the self-operated pressure regulator valve opens and the working fluid flows into the evaporator from the reservoir. A certain quality of the working fluid is closed in the evaporator, preparing for a new work cycle as above-mentioned. The system of the present invention can use organic fluid as the working fluid to utilize the low-temperature heat sources range from 60 to 200° C., using groundwater, river (sea) water or air as cold source and using gravity to transport liquid working fluid.

A refrigeration appliance includes a refrigerant circuit having a heat exchanger. The refrigeration appliance also includes a heat circuit. The heat exchanger is thermally coupled to the heat circuit by a coupling element. The coupling element is mechanically connected to the heat circuit by a detachable connection. The detachable connection may be a force-locking connection, in particular a screw connection, a plug-in connection or a form-locking connection, in particular a snap-on connection.