An immersion cooling system includes a housing having an interior space; a heat-generating component disposed within the interior space; and a working fluid liquid disposed within the interior space such that the heat-generating component is in contact with a liquid phase of the working fluid. The immersion system further includes a device configured to selectively remove a fluid from within the housing. The working fluid includes a halogenated material.

A cooling system includes a first cooling loop, a second cooling loop and a heat exchanger configured to transfer heat from the first cooling loop to the second cooling loop. The first cooling loop includes a vapor/liquid separation feature configured to separate vapor present in the first cooling loop due to a leak between the first cooling loop and the second cooling loop. The first cooling loop also includes a pressure sensor configured to detect an increase in pressure in the first cooling loop that may result from a leak of second coolant into the first cooling loop.

A cooling system is provided including a two-phase pump loop and a vapor compression system. The two-phase pump loop cools a thermal load with a first coolant. The vapor compression system is configured to circulate a second coolant. The vapor compression system includes a liquid vapor separator which separates the second coolant into a liquid portion and a gaseous portion. The liquid vapor separator is a thermal energy storage for the two-phase pump loop. A condenser of the two-phase pump loop transfers heat from the first coolant to the liquid portion of the second coolant in the liquid-vapor separator.

The present disclosure provides methods and systems for heat exchange, such as cooling a heat source. A cooling system of the present disclosure may comprise a first channel that is configured to direct a liquid coolant, a second channel that is configured to direct a vapor coolant generated from the liquid coolant, and a condenser that is configured to permit the vapor coolant to undergo phase transition to the liquid coolant. The cooling system may further comprise at least one cooling interface in fluid communication with the first channel and the second channel. The cooling interface may be configured to facilitate heat exchange between the liquid coolant and a heat source.

A cooling system includes a first cooling loop, a second cooling loop and a heat exchanger configured to transfer heat from the first cooling loop to the second cooling loop. The first cooling loop includes a vapor/liquid separation feature configured to separate vapor present in the first cooling loop due to a leak between the first cooling loop and the second cooling loop. The first cooling loop also includes a pressure sensor configured to detect an increase in pressure in the first cooling loop that may result from a leak of second coolant into the first cooling loop.

A refrigeration system includes a heat exchanger configured to place a cooling fluid in a heat exchange relationship with a working fluid, a free-cooling circuit having a pump configured to circulate the working fluid through the heat exchanger and a condenser, a flow control valve configured to control a flow rate of the working fluid to the condenser, a condenser bypass valve configured to control a flow rate of the working fluid that bypasses the condenser, and a controller configured to adjust a position of the flow control valve, a position of the condenser bypass valve, a speed of a fan of the condenser, a speed of the pump, and a temperature of a heater based on an ambient temperature, a temperature of the working fluid leaving the condenser, the position of the flow control valve, the position of the condenser bypass valve, or a combination thereof.

A heat exchanger module includes a condenser unit and an evaporator unit. The evaporator unit includes N pieces of parallel-flow heat exchangers arranged adjacently, and the coolant temperatures reduce gradually from the first to Nth parallel-flow heat exchangers along an air flow direction in the evaporator unit. A counter-current mounting method is adopted in the parallel-flow heat exchangers of the evaporator unit in the heat exchanger module provided by the present invention. The coolant temperature of each parallel-flow heat exchanger is lower than that of the previous one, the temperature difference between air and coolant is relatively uniform by using the counter-current method so as to reach a better heat exchange effect.

The present disclosure provides materials and methods related to passive cooling systems. In particular, the present disclosure provides a condensorator heat exchanger with a single microchannel coil that integrates the evaporator and condenser into one assembly. The passive heat exchanger systems of the present disclosure provide enhanced cooling capacity and airflow in environments ranging from outdoor electronic enclosures to commercial and residential buildings.

A system and method of controlling temperature of a medium by refrigerant vaporization, or working gas condensation, or a combination of both, the system including a container, at least one a working gas reservoir having at least one reservoir section that includes a wall with an exterior surface structured to be thermally coupled with a volume of the medium in the container and to provide a volume of medium thermal coverage in the container, a condensation apparatus to provide regulation of working gas condensation in the reservoir, whereby the working gas reservoir forms a vapor space in each of the at least one reservoir section in response to receiving the working gas and to the condensation apparatus regulation of condensation to enable working gas condensation at or near a selected temperature of the volume of medium in the container that is thermally coupled to the respective reservoir section.

A method for cooling an information technology system, comprising: receiving a flow of at least a subcooled liquid phase change refrigerant; cooling the information technology system by sensible heat transfer in an evaporator, to produce at least gaseous refrigerant; and exchanging heat from the at least gaseous refrigerant from the evaporator to the subcooled liquid phase change refrigerant. The phase change refrigerant may be a hydrofluorocarbon ether having a boiling point of 30-65° C. at 1-12 bar.