Patent classifications
F25B23/006
Method for manufacturing device temperature control device and method for filling working fluid
A method for manufacturing a device temperature controller includes filling an inside of a circuit with working fluid by connecting a filling port of the circuit to a container that stores gas phase working fluid. The circuit constitutes a thermosiphon heat pipe and allows the working fluid to circulate in the circuit. In the filling, the working fluid inside the circuit is cooled by a cooling source. An inside temperature of the circuit is decreased to be lower than an inside temperature of the container, and thereby an inside pressure of the circuit is decreased to be lower than an inside pressure of the container.
Cooler
A cooler includes a plurality of loop heat pipes. Each of the plurality of loop heat pipes includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid, a liquid pipe that connects the evaporator and the condenser, and a vapor pipe that connects the evaporator and the condenser, and forms a loop-shaped passage together with the liquid pipe. Evaporators of the plurality of loop heat pipes overlap each other, and a pressure inside the loop-shaped passage is different among the plurality of loop heat pipes.
HELICAL PILE WITH HEAT EXCHANGER
A helical pile including a heat exchanger is described. The pile is formed from a lead section and one or more extension sections. The interior of the lead and extension sections are hollow and form a heat exchanger cavity. At the lower end of the lead section is a helical blade. Rotation of the lead section causes the helical blade to screw into the ground, thus pulling the lead section downward. Extension sections are added to the lead section and the pile is rotated until it is installed to a desired depth. The pile includes an inflow tube extending a predetermined distance into the heat exchanger cavity and an outflow port connected with the heat exchanger cavity. In operation, a heat carrying fluid is pumped into the inflow tube from a heat source or sink, for example, a heat pump for a building heating and cooling system. The fluid exits the tube at a point near the bottom of the heat exchanger cavity. The fluid flows upward through the heat exchange cavity and exchanges heat with the surrounding soil. The fluid flows out through the outflow port and back to the heat source or sink.
Data center refrigeration system
An apparatus includes a pump and a driver mechanically coupled to the pump. The driver is configured to receive gaseous refrigerant at a first pressure, discharge gaseous refrigerant at a second pressure, and produce a mechanical force from a pressure differential between the first pressure and the second pressure. The pump is configured to receive liquid refrigerant at a third pressure, discharge liquid refrigerant at a fourth pressure, and pump liquid refrigerant from the third pressure to the fourth pressure in response to the mechanical force from the driver.
Air-vapor separation method for immersed liquid cooling system and device thereof
The present invention relates to an air-vapor separation method for separating air from refrigerant vapor in an immersed liquid-cooling system. The immersed liquid-cooling system comprises an immersed server blade cabinet, a condensing device, an air-vapor separator and a refrigerant storage tank, wherein the refrigerant storage tank supplies a liquid refrigerant to the immersed server blade cabinet, and the liquid refrigerant undergoes a phase change to be vaporized into a refrigerant vapor for cooling of the heating element in the immersed server blade cabinet; the condensing device condenses the refrigerant vapor; the air-vapor separator separates a mixed gas in the immersed liquid-cooling system into the air and the refrigerant vapor. The cooling efficiency of the liquid-cooling system is improved by effectively separating the air from the refrigerant vapor in the liquid-cooling system.
PASSIVE REFRIGERATION SYSTEM FOR THE COLD CHAIN INDUSTRY
A passive refrigeration box for controlled refrigeration of a product comprising: an outer box including an outer insulation layer; an inner box including an inner insulation layer, and a thermal shield on an outside of the inner insulation layer, the inner box and the outer box defining a vapour channel therebetween; and a thermal link including a thermal layer and a plurality of heat pipes or thermosyphons, the thermal layer and a top section of the inner box defining a coolant chamber, the coolant chamber including a coolant chamber access, and in communication with the vapour channel, and the thermal layer and a bottom section of the inner box defining a load chamber, the load chamber including a load chamber access, each heat pipe or thermosyphon having a condenser section disposed in the coolant chamber and an evaporator section disposed in the load chamber and extending through the thermal layer.
Cooling device
A cooling device of an embodiment includes an evaporator, a condenser, a first connection pipe, a second connection pipe, and a third connection pipe. A refrigerant is vaporized in the evaporator by heat generated by a heating element. The condenser is located above the evaporator, and configured to condense the vaporized refrigerant by exchanging heat with an external fluid. The first connection pipe guides the refrigerant vaporized by the evaporator to the condenser. The second connection pipe guides the refrigerant condensed by the condenser to the evaporator. The third connection pipe connects a portion of the first connection pipe and a portion of the second connection pipe. A connection position between the third connection pipe and the first connection pipe is higher than a maximum liquid level height of the refrigerant in the second connection pipe during an operation.
Impacting T-junction component regulator for regulating components of non-azeotropic working medium
The present disclosure discloses an impacting T-junction component regulator for regulating components of a non-azeotropic working medium, which is formed by connecting a single T-junction or a plurality of T-junctions. Each of the T-junction comprises an inlet pipe and an outlet pipe. When the impacting T-junction component regulator is formed by a plurality of connected T-junctions, the impacting T-junction component regulator further comprises an upper manifold trunk communicated with an outlet pipe of each T-junction and throttle valves located between two adjacent T-junctions. By using the characteristics of unequal vapor and liquid components of the non-azeotropic working medium and mal-distribution of two phase flows by vertical impacting T-junctions, the regulator achieves the fluid flowing through a plurality of T-junctions and throttle valves once so as to achieve the purpose of separating components.
System and methods utilizing fluid coolers and chillers to perform in-series heat rejection and trim cooling
The cooling systems and methods of the present disclosure involve modular fluid coolers and chillers configured for optimal power and water use based on environmental conditions and client requirements. The fluid coolers include wet media, a first fluid circuit for distributing fluid across wet media, an air to fluid heat exchanger, and an air to refrigerant heat exchanger. The chillers, which are fluidly coupled to the fluid coolers via pipe cages, include a second fluid circuit in fluid communication with the air to fluid heat exchanger and a refrigerant circuit in thermal communication with the second fluid circuit and in fluid communication with the air to refrigerant heat exchanger. Pipe cages are coupled together to allow for expansion of the cooling system when additional cooling capacity is needed. The fluid coolers and chillers are configured to selectively operate in wet or dry free cooling mode, partial free cooling mode, or mechanical cooling mode.
Boiling cooling device and boiling cooling system
A boiling cooling device and a boiling cooling system which can promote boiling and restrain the cooling capacity of the device from deteriorating. A boiling cooling device includes: a pump to circulate refrigerant; a microbubble generator to produce microbubbles and incorporate the microbubbles into the refrigerant discharged from the pump; a boiling cooler to which the refrigerant containing the microbubbles is supplied and which boils the refrigerant; a radiator to cool the refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump 11; and a gas-liquid separator 15 to separate gas from the circulating refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump.