Integrated adsorption and heat exchanger devices are provided for solid sorption refrigeration systems (1), together with methods for making such devices. An integrated adsorption and heat exchanger device (20, 30, 45, 52) comprises a solid material having formed therein both a porous adsorption structure (21, 31, 44, 53), which is pervious to an adsorbate of said system (1), and a heat exchanger structure (22, 32), which is impervious to said adsorbate, for heat exchange with the porous adsorption structure in operation of the system (1).

Integrated adsorption and heat exchanger devices are provided for solid sorption refrigeration systems (1), together with methods for making such devices. An integrated adsorption and heat exchanger device (20, 30, 45, 52) comprises a solid material having formed therein both a porous adsorption structure (21, 31, 44, 53), which is pervious to an adsorbate of said system (1), and a heat exchanger structure (22, 32), which is impervious to said adsorbate, for heat exchange with the porous adsorption structure in operation of the system (1).

Adsorption heat exchanger devices (11, 25) are provided for use in solid sorption refrigeration systems (1) together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dilute that, during evaporation of the solvent, the binder becomes concentrated around contact points between granules (18) of the adsorbent material whereby localized bonds (19) are formed around the contact points on curing of the binder.

Adsorption heat exchanger devices (11, 25) are provided for use in solid sorption refrigeration systems (1) together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dilute that, during evaporation of the solvent, the binder becomes concentrated around contact points between granules (18) of the adsorbent material whereby localized bonds (19) are formed around the contact points on curing of the binder.

An adsorption heat pump includes: an evaporator configured to evaporate a refrigerant; and an adsorbent heat exchanger provided with an adsorption member configured to adsorb vapor evaporated by the evaporator, and a heat transfer tube in which a heating medium flows. Here, the adsorbent heat exchanger includes a pressing mechanism configured to press and compress the adsorption member depending on a temperature of the heating medium flowing inside the heat transfer tube.

An adsorption heat pump includes: an evaporator configured to evaporate a refrigerant; and an adsorbent heat exchanger provided with an adsorption member configured to adsorb vapor evaporated by the evaporator, and a heat transfer tube in which a heating medium flows. Here, the adsorbent heat exchanger includes a pressing mechanism configured to press and compress the adsorption member depending on a temperature of the heating medium flowing inside the heat transfer tube.

An electrochemical heat transfer device utilizes an electrochemical hydrogen compressor to pump hydrogen into and out of a reservoir having a metal hydride forming alloy therein. The absorption of hydrogen by the metal hydride forming alloy is exothermic, produces heat, and the desorption of the hydrogen from the metal hydride forming alloy is endothermic and draws heat in. An electrochemical hydrogen compressor may be configured between to reservoirs and pump hydrogen back and forth to form a heat transfer device. A heat exchange device may be coupled with the reservoir or may comprise the outer surface of the reservoir to transfer heat to an object or to the surroundings. A closed loop may be configured having two reservoirs and one or two electrochemical hydrogen compressors to pump the hydrogen in a loop around the system.

An electrochemical heat transfer device utilizes an electrochemical hydrogen compressor to pump hydrogen into and out of a reservoir having a metal hydride forming alloy therein. The absorption of hydrogen by the metal hydride forming alloy is exothermic, produces heat, and the desorption of the hydrogen from the metal hydride forming alloy is endothermic and draws heat in. An electrochemical hydrogen compressor may be configured between to reservoirs and pump hydrogen back and forth to form a heat transfer device. A heat exchange device may be coupled with the reservoir or may comprise the outer surface of the reservoir to transfer heat to an object or to the surroundings. A closed loop may be configured having two reservoirs and one or two electrochemical hydrogen compressors to pump the hydrogen in a loop around the system.

A refrigerator appliance including a multi-capacity compressor and a refrigerant circuit with two conduits and pressure reducing devices arranged in parallel between an evaporator and a condenser. Refrigerant can flow through one, both or none of the conduits and pressure reducing devices. The appliance also has a heat exchanger in contact with either one pressure reducing device, or one conduit between the pressure reducing device and the valve system. The appliance also includes a controller for priming the compressor above a nominal capacity for a predetermined or calculated duration at the beginning of an ON-cycle.

Adsorption heat exchanger devices (11, 25) are provided for use in solid sorption refrigeration systems (1) together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dilute that, during evaporation of the solvent, the binder becomes concentrated around contact points between granules (18) of the adsorbent material whereby localized bonds (19) are formed around the contact points on curing of the binder.