The present disclosure relates to a method of controlling an adiabatic demagnetization apparatus. The method includes varying at least operation parameter of the adiabatic demagnetization apparatus.

A microstrip that is usable in a quantum application (q-microstrip) includes a ground plane, a polyimide film disposed over the ground plane at a first surface of the polyimide film, and a conductor formed on a second side of the polyimide film such that the first surface is substantially opposite to the second surface. A material of the conductor provides greater than a threshold thermal conductivity (T.sub.H) with a structure of a dilution fridge stage (stage).

A cryopump includes a cryocooler which includes a high-temperature cooling stage and a low-temperature cooling stage, a radiation shield which is thermally coupled to the high-temperature cooling stage and axially extends in a tubular shape from a cryopump intake port, and a low-temperature cryopanel section which is thermally coupled to the low-temperature cooling stage, is surrounded by the radiation shield, and includes a plurality of cryopanels and a plurality of heat transfer bodies axially arranged in columnar shape, and in which the plurality of cryopanels and the plurality of heat transfer bodies are axially stacked.

A vacuum adiabatic body includes a first plate; a second plate; a seal; a support; and an exhaust port, wherein an extension tab extending toward the third space to be coupled to the support is provided to at least one of the first and second plates, and the extension tab extends downward from an edge portion of the at least one of the first and second plates.

A vacuum insulator including a heat diffusion block placed in a vacuum space; a thermoelectric module, in the vacuum space, coming into contact with the heat diffusion block so as to exchange heat therewith: and a heat sink exchanging heat with the thermoelectric module and placed in a first space or a second place. High heat-insulation performance and heat-transfer performance can be obtained.

An assembly for thermal insulation of an MR magnet system during such a transport has a container for accommodating an MR magnet, the container being equipped with thermal insulation, and the container has an opening for accommodating a cooling unit. The assembly further has a protective cap, such that the opening is sealed in a reversible manner by the protective cap, and the protective cap is likewise equipped with thermal insulation.

The present invention provides a semiconductor refrigerator, which comprises: a liner; at least one semiconductor cooler; and a plurality of cold end heat exchanging devices, each of which is configured to allow the refrigerant to flow therein and undergo phase-change heat exchange to transfer cold from the cold end of the semiconductor cooler to the storage compartment of the liner. Each of the cold end heat exchanging devices has three refrigerant pipelines, each refrigerant pipeline having an evaporation section which is downwardly bent and extends in a vertical plane and has a closed tail end, the evaporation sections of the three refrigerant pipelines of each of the cold end heat exchanging devices being thermally connected to the rear wall and two side walls of the liner respectively. Energy efficiency of the semiconductor refrigerator is improved significantly.

There is provided refrigeration system (1) and method for remote cooling of a thermal load having a first portion (27) and a second portion (25). The system comprises a cold source (4) having a first cooling stage (5) and a second cooling stage (6), the temperature of the first cooling stage being higher than the temperature of the second cooling stage. The system also comprises a cryogen circuit for circulation of a cryogen flow in a closed cycle, the closed cycle being thermally coupled to the cold source. The system further comprises a compressor (7) for compressing and circulating the cryogen flow in the cryogen circuit. The cryogen circuit comprises a first conduit for thermally connecting the first cooling stage of the cold source to the first portion of the thermal load so as to cool said first portion towards the temperature of the first cooling stage, and a second conduit for thermally connecting the second cooling stage of the cold source to the second portion of the thermal load so as to cool said second portion to wards the temperature of the second cooling stage. The cryogen flow in the system is a sub-cooled or saturated liquid, two phase, saturated or overheated, supercritical gas helium flow.

A refrigeration appliance includes a refrigerant circuit having a heat exchanger. The refrigeration appliance also includes a heat circuit. The heat exchanger is thermally coupled to the heat circuit by a coupling element. The coupling element is mechanically connected to the heat circuit by a detachable connection. The detachable connection may be a force-locking connection, in particular a screw connection, a plug-in connection or a form-locking connection, in particular a snap-on connection.

An experimental payload and cryogenic system are provided. An experimental payload including a cryogenic chamber is provided. The cryogenic chamber includes an action chamber configured to be cryogenically cooled to an action temperature. The cryogenic chamber also includes an inner cooling ring cooled via an internal braiding system. The inner cooling ring is configured to operate at a first temperature. The cryogenic chamber further includes an outer ring in communication with the inner cooling ring. The outer ring is configured to absorb heat from the experimental payload. The outer ring defines a second temperature that is greater than the first temperature. The cryogenic chamber also includes a plurality of legs operably coupled to the cryogenic chamber at a top end of each leg. The legs are characterized by a low thermal conductivity and the experimental payload is configured to be attached to a base of a cryocooler.