A method for treating a substrate is provided. The method includes the following steps: performing a process of treating the substrate by dispensing a supercritical fluid onto the substrate. A treating fluid flows through a treating fluid supplying regulator regulating an amount of the treating fluid before dispensed onto the substrate. The treating fluid is heated to a set temperature or more by a first heater before passing through the treating fluid supplying regulator, and the treating fluid is heated by a second heater when the treating fluid is passed through the treating fluid supplying regulator. The temperature of the treating fluid is lowered in rear region of the treating fluid supplying regulator. The set temperature is a temperature that allows the lowered temperature to be maintained at a critical temperature or more.

A method for treating a substrate is provided. The method includes the following steps: performing a process of treating the substrate by dispensing a supercritical fluid onto the substrate. A treating fluid flows through a treating fluid supplying regulator regulating an amount of the treating fluid before dispensed onto the substrate. The treating fluid is heated to a set temperature or more by a first heater before passing through the treating fluid supplying regulator, and the treating fluid is heated by a second heater when the treating fluid is passed through the treating fluid supplying regulator. The temperature of the treating fluid is lowered in rear region of the treating fluid supplying regulator. The set temperature is a temperature that allows the lowered temperature to be maintained at a critical temperature or more.

Disclosed are methods for critical point drying a composite material. After exposing the composite material to a supercritical fluid, the composite material dries as the supercritical fluid evaporates with reduced pressure. The composite materials are useful as chromatographic separation media.

Disclosed are methods for critical point drying a composite material. After exposing the composite material to a supercritical fluid, the composite material dries as the supercritical fluid evaporates with reduced pressure. The composite materials are useful as chromatographic separation media.

A continuous dryer heat exchanger device has a plurality of heat exchanger units. Waste air of an associated dryer section of the associated continuous dryer is guided through an individual heat exchanger unit and contaminants from the waste air are deposited in the heat exchanger unit. A cleaning device for cleaning the continuous flow heat exchanger device of the contaminants is thereby provided, which cleaning device has a plurality of cleaning units. An associated heat exchanger unit is to be cleaned by means of the individual cleaning unit. A switching device is provided, by means of which the cleaning units are to be switched in series one after the other.

A continuous dryer heat exchanger device has a plurality of heat exchanger units. Waste air of an associated dryer section of the associated continuous dryer is guided through an individual heat exchanger unit and contaminants from the waste air are deposited in the heat exchanger unit. A cleaning device for cleaning the continuous flow heat exchanger device of the contaminants is thereby provided, which cleaning device has a plurality of cleaning units. An associated heat exchanger unit is to be cleaned by means of the individual cleaning unit. A switching device is provided, by means of which the cleaning units are to be switched in series one after the other.

A hydrocarbon recovery system is integrated with a fluff transfer system. The hydrocarbon recovery system is configured for contacting a wet polymer fluff with a purge gas to provide a purged polymer fluff and an overhead stream, and separating a solids stream, a recovered hydrocarbon stream, and a recovered purge gas from the overhead stream. The polymer fluff transfer system is configured to receive the purged polymer fluff from the hydrocarbon recovery system and transport the purged polymer fluff in the fluff transfer system via circulation of a fluff transfer gas. The hydrocarbon recovery system and the fluff transfer system are integrated by utilizing fluff transfer gas from the fluff transfer system as the purge gas in the hydrocarbon recovery system and/or by utilizing at least a portion of the recovered purge gas from the hydrocarbon recovery system in the fluff transfer system as the fluff transfer gas.

A hydrocarbon recovery system is integrated with a fluff transfer system. The hydrocarbon recovery system is configured for contacting a wet polymer fluff with a purge gas to provide a purged polymer fluff and an overhead stream, and separating a solids stream, a recovered hydrocarbon stream, and a recovered purge gas from the overhead stream. The polymer fluff transfer system is configured to receive the purged polymer fluff from the hydrocarbon recovery system and transport the purged polymer fluff in the fluff transfer system via circulation of a fluff transfer gas. The hydrocarbon recovery system and the fluff transfer system are integrated by utilizing fluff transfer gas from the fluff transfer system as the purge gas in the hydrocarbon recovery system and/or by utilizing at least a portion of the recovered purge gas from the hydrocarbon recovery system in the fluff transfer system as the fluff transfer gas.

A fluid supply device configured to supply a processing fluid to a wafer processing device that includes a chamber is provided. The fluid supply device includes a reservoir configured to change the processing fluid into a supercritical fluid state; a wafer protecting device comprising a body configured to prevent a wafer in the chamber of the wafer processing device from being damaged by the processing fluid in the supercritical fluid state by receiving the processing fluid in the supercritical fluid state and limiting a speed of the processing fluid; and a fluid supply line configured to provide a path for the processing fluid between the reservoir and the wafer protecting device and a path for the processing fluid between the wafer protecting device and the wafer processing device.

A fluid supply device configured to supply a processing fluid to a wafer processing device that includes a chamber is provided. The fluid supply device includes a reservoir configured to change the processing fluid into a supercritical fluid state; a wafer protecting device comprising a body configured to prevent a wafer in the chamber of the wafer processing device from being damaged by the processing fluid in the supercritical fluid state by receiving the processing fluid in the supercritical fluid state and limiting a speed of the processing fluid; and a fluid supply line configured to provide a path for the processing fluid between the reservoir and the wafer protecting device and a path for the processing fluid between the wafer protecting device and the wafer processing device.