A substrate treating apparatus is disclosed. The apparatus may include a housing including an upper body and a lower body coupled to each other to define a treatment space, the lower body being provided below the upper body, a supporting unit coupled to the upper body, the supporting unit supporting an edge of a substrate disposed in the treatment space, a fluid supplying unit configured to supply fluid into the treatment space, a sealing member provided between and in contact with the upper and lower bodies, the sealing member hermetically isolating the treatment space from an outer space, and an isolation plate installed between the sealing member and the supporting unit. The isolation plate may be provided to face the sealing member.

The present disclosure is directed to a wafer drying method that detects airborne molecular contaminants in a drying gas as a feedback parameter for a single wafer or multi-wafer drying process. For example, the method includes dispensing in a wafer drying station a drying gas over one or more wafers; collecting the drying gas from an exhaust of the wafer drying station; determining the concentration of contaminants in the drying gas; re-dispensing the drying gas over the one or more wafers if the concentration of contaminants is higher than a baseline value; and transferring the one or more wafers out of the wafer drying station if the concentration is equal to or less than the baseline value.

A drying apparatus includes a drying chamber configured to be connected to a decompression section, and a moving section configured to move a target object in the interior of the drying chamber. With this structure, the pressure in the interior of the drying chamber can be reduced and the target object can be dried in the interior of the drying chamber, and thereby the drying efficiency of the target object can be increased.

The present disclosure is directed to a wafer drying system and method that detects airborne molecular contaminants in a drying gas as a feedback parameter for a single wafer or multi-wafer drying process. For example, the system comprises a wafer drying station configured to dispense a drying gas over one or more wafers to dry the one or more wafers, a valve configured to divert the drying gas to a first portion and a second portion, and an exhaust line configured to exhaust the first portion of the drying gas. The system further comprises a detector configured to receive the second portion of the drying gas and to determine a real time property of the second portion of the drying gas, and a control unit configured to control a feedback operation of the wafer drying station based on the real time property of the second portion of the drying gas.

A substrate cleaning and drying system includes a cleaning station, a drying station positioned adjacent the cleaning station, a cleaner robot to transfer a substrate from the cleaning station to the drying station, an aligner stage adjacent to the drying station, a robot arm rotatable between a substantially vertical first position for receiving the substrate from the drying station and a substantially horizontal second position for releasing the substrate onto the aligner stage, and a factory interface robot to transfer a substrate from the aligner stage into a factory interface module while in a horizontal orientation. The aligner stage includes a rotatable support to hold the substrate in a substantially horizontal orientation and to rotate the substrate to a desired orientation.

A substrate cleaning and drying system includes a cleaning station, a drying station positioned adjacent the cleaning station, a cleaner robot to transfer a substrate from the cleaning station to the drying station, an aligner stage adjacent to the drying station, a robot arm rotatable between a substantially vertical first position for receiving the substrate from the drying station and a substantially horizontal second position for releasing the substrate onto the aligner stage, and a factory interface robot to transfer a substrate from the aligner stage into a factory interface module while in a horizontal orientation. The aligner stage includes a rotatable support to hold the substrate in a substantially horizontal orientation and to rotate the substrate to a desired orientation.

A hybrid drying apparatus including: a bed portion having a horizontally disposed top surface; an object-to-be-dried supplying portion configured to spread an object to be dried on the top surface of the bed portion; and a driving unit configured to rotate and drive the bed portion or the object-to-be-dried supplying portion, wherein the object to be dried supplied from the object-to-be-dried supplying portion is spread on the top surface of the bed portion while the bed portion or the object-to-be-dried supplying portion is rotated, and the top surface of the bed portion is heated in such a manner that a lower portion of the bed portion is primarily heated so that the bed portion is used to dry the object to be dried coated on the top surface of the bed portion by the object-to-be-dried supplying portion.

The present example embodiments relate to food preparation devices using natural flowing and/or fan driven circulating air, and details for the construction thereof. Example embodiments are shown, which may be reduced in size and volume by the user. Example embodiments are shown which utilize natural convection airflow. Example embodiments are also shown which utilize fan driven air which flows in alternating directions.

A machine for the heating of granular material at high temperature, wherein a vessel is divided into compartments by vessel dams and vibrated in a direction perpendicular or Cross Axis to the vessel longitudinal axis. The vessel is vibrated by counter rotating rotary vibrators to create a Cross Axis vibration causing a circular cascading movement of the granular material within the vessel. The vessel is surrounded by a furnace heated by electric power or a combustible gas.

According to one embodiment, a substrate processing apparatus (1) includes a table (4) configured to support a substrate W, a solvent supply unit (8) configured to supply a volatile solvent to a surface of the substrate W on the table (4), and an irradiator (10) configured to emit light to the substrate W, which has been supplied with the volatile solvent, and function as a heater that heats the substrate W such that a gas layer is formed on the surface of the substrate W to make the volatile solvent into a liquid ball. Thus, it is possible to dry the substrate successfully as well as to suppress pattern collapse.