F27D11/12

Furnace system for controlling of individual temperature through selectively radiating of electromagnetic waves
20230123684 · 2023-04-20 ·

The furnace system for controlling of individual temperature through selectively radiating of electromagnetic waves according to the present invention comprises: a heating body unit for heating a melt to a predetermined temperature; a heating sensing unit for selectively measuring the internal temperature of the heating body unit to calculate predetermined temperature information; a heating cover unit that selectively covers the heating body unit to prevent a predetermined heat from being diffused to the outside so that the melt maintains a predetermined temperature; and a radiating unit receiving the predetermined temperature information from the heating sensing unit and selectively irradiating a predetermined electromagnetic wave so that the melt becomes the predetermined temperature.

Furnace system for controlling of individual temperature through selectively radiating of electromagnetic waves
20230123684 · 2023-04-20 ·

The furnace system for controlling of individual temperature through selectively radiating of electromagnetic waves according to the present invention comprises: a heating body unit for heating a melt to a predetermined temperature; a heating sensing unit for selectively measuring the internal temperature of the heating body unit to calculate predetermined temperature information; a heating cover unit that selectively covers the heating body unit to prevent a predetermined heat from being diffused to the outside so that the melt maintains a predetermined temperature; and a radiating unit receiving the predetermined temperature information from the heating sensing unit and selectively irradiating a predetermined electromagnetic wave so that the melt becomes the predetermined temperature.

Far-infrared radiation heating furnace for steel sheet for hot stamping

The present invention provides a far-infrared radiation heating furnace for steel sheets for hot stamping configured to inhibit thermal deformation of the furnace body and furnace body parts. A far-infrared radiation heating furnace (10) includes heating units (13-1) to (13-6), a ceiling unit (19), and a furnace body frame (12) made of steel, the heating units including: blocks made of a thermal insulation material, the blocks being disposed around horizontal planes of spaces for accommodating the steel sheets for hot stamping; and far-infrared radiation heaters positioned above and below the steel sheets for hot stamping to heat the steel sheets for hot stamping, the furnace body frame being disposed around the heating units and the ceiling unit. The furnace body frame includes spacers (17-1) to (17-7) that space the heating units and the ceiling unit apart from the furnace body frame and support them.

Far-infrared radiation heating furnace for steel sheet for hot stamping

The present invention provides a far-infrared radiation heating furnace for steel sheets for hot stamping configured to inhibit thermal deformation of the furnace body and furnace body parts. A far-infrared radiation heating furnace (10) includes heating units (13-1) to (13-6), a ceiling unit (19), and a furnace body frame (12) made of steel, the heating units including: blocks made of a thermal insulation material, the blocks being disposed around horizontal planes of spaces for accommodating the steel sheets for hot stamping; and far-infrared radiation heaters positioned above and below the steel sheets for hot stamping to heat the steel sheets for hot stamping, the furnace body frame being disposed around the heating units and the ceiling unit. The furnace body frame includes spacers (17-1) to (17-7) that space the heating units and the ceiling unit apart from the furnace body frame and support them.

Systems and methods for altering microstructures of materials
11466935 · 2022-10-11 · ·

Systems and methods for altering microstructures of materials are disclosed. The system may include at least one computing device in communication with a heating device and an electromagnetic device. The computing device(s) may be configured to alter a microstructure of a material forming a component by performing processes including heating the component using the heating device to a predetermined temperature. The predetermined temperature may be below a first phase-transformation temperature based on the material forming the component, and a second phase-transformation temperature based on the material forming the component, where the second phase-transformation temperature greater than the first phase-transformation temperature. The computing device(s) may also perform processes including intermittently magnetizing the heated component using the electromagnetic device for a predetermined number of cycles, and cooling the component after intermittently magnetizing the heated component.

Systems and methods for altering microstructures of materials
11466935 · 2022-10-11 · ·

Systems and methods for altering microstructures of materials are disclosed. The system may include at least one computing device in communication with a heating device and an electromagnetic device. The computing device(s) may be configured to alter a microstructure of a material forming a component by performing processes including heating the component using the heating device to a predetermined temperature. The predetermined temperature may be below a first phase-transformation temperature based on the material forming the component, and a second phase-transformation temperature based on the material forming the component, where the second phase-transformation temperature greater than the first phase-transformation temperature. The computing device(s) may also perform processes including intermittently magnetizing the heated component using the electromagnetic device for a predetermined number of cycles, and cooling the component after intermittently magnetizing the heated component.

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
20230106341 · 2023-04-06 ·

There is provided a technique capable of stably form the film on a substrate regardless of machine difference or processing conditions. According to an aspect of the present disclosure, there is provided a technique that includes: (a) setting correction coefficients for correcting an output level of microwave; (b) storing correction tables containing the correction coefficients set in (a); (c) acquiring one or more correction coefficients from at least one correction table periodically from a start of outputting of the microwave; (d) calculating a correction value for an output preset level of the microwave from the one or more correction coefficients acquired in (c); (e) correcting the output preset level of the microwave by using the correction value calculated in (d); and (f) processing a substrate by supplying the microwave into a process chamber with the output preset level of the microwave corrected in (e).

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
20230106341 · 2023-04-06 ·

There is provided a technique capable of stably form the film on a substrate regardless of machine difference or processing conditions. According to an aspect of the present disclosure, there is provided a technique that includes: (a) setting correction coefficients for correcting an output level of microwave; (b) storing correction tables containing the correction coefficients set in (a); (c) acquiring one or more correction coefficients from at least one correction table periodically from a start of outputting of the microwave; (d) calculating a correction value for an output preset level of the microwave from the one or more correction coefficients acquired in (c); (e) correcting the output preset level of the microwave by using the correction value calculated in (d); and (f) processing a substrate by supplying the microwave into a process chamber with the output preset level of the microwave corrected in (e).

Magnetic annealing apparatus and magnetic annealing method

Disclosed is a magnetic annealing apparatus including a processing container that performs a magnetic annealing processing on a plurality of substrates accommodated therein in a magnetic field; a substrate holder that holds the plurality of substrates substantially horizontally in the processing container; a division heater including a plurality of sub-division heaters and covering a substantially entire circumferential surface of an outer periphery of a predetermined region of the processing container along a longitudinal direction; a magnet installed to cover an outside of the division heater; and a controller configured to feedback-control a temperature of a predetermined control target heater among the plurality of sub-division heaters, and to control temperatures of the plurality of sub-division heaters other than the predetermined control target heater based on a control output obtained by multiplying a control output of the predetermined control target heater and a predetermined ratio.

Magnetic annealing apparatus and magnetic annealing method

Disclosed is a magnetic annealing apparatus including a processing container that performs a magnetic annealing processing on a plurality of substrates accommodated therein in a magnetic field; a substrate holder that holds the plurality of substrates substantially horizontally in the processing container; a division heater including a plurality of sub-division heaters and covering a substantially entire circumferential surface of an outer periphery of a predetermined region of the processing container along a longitudinal direction; a magnet installed to cover an outside of the division heater; and a controller configured to feedback-control a temperature of a predetermined control target heater among the plurality of sub-division heaters, and to control temperatures of the plurality of sub-division heaters other than the predetermined control target heater based on a control output obtained by multiplying a control output of the predetermined control target heater and a predetermined ratio.