A steel strip annealing furnace with a dew point control system. The furnace/control system can be more readily controlled to the desired dew point than the prior art control system and can handle the set point changes required as different types of steel coils are continuously run therethrough.

A steel strip annealing furnace with a dew point control system. The furnace/control system can be more readily controlled to the desired dew point than the prior art control system and can handle the set point changes required as different types of steel coils are continuously run therethrough.

A device for detecting transport boats includes a contact element for contacting a transport boat, and a connecting element spring mounted in a housing of the device, biased into an initial position and linearly displaceably guided via a guide of the housing. The contact element is connected to the spring mounted connecting element and is displaceable together therewith in such a way that contact of the transport boat with the contact element causes deflection of the connecting element against the bias from the initial position into a detection position. The device further includes a detection device adapted to detect reaching of the detection position by the connecting element.

A device for detecting transport boats includes a contact element for contacting a transport boat, and a connecting element spring mounted in a housing of the device, biased into an initial position and linearly displaceably guided via a guide of the housing. The contact element is connected to the spring mounted connecting element and is displaceable together therewith in such a way that contact of the transport boat with the contact element causes deflection of the connecting element against the bias from the initial position into a detection position. The device further includes a detection device adapted to detect reaching of the detection position by the connecting element.

With a method for detecting variables in an outlet of a metallurgical vessel, different variables in the outlet are detected or measured by at least one coil surrounding the outlet channel and/or an induction coil of an induction heater as a monitoring system, wherein the variables relate to the slag portion when pouring out the metal melt, wear condition of refractory parts in the outlet channel, the solidified metal melt, flow rate and/or plugging mass in the outlet channel. After evaluation, a closure element for the outlet is actuated, heating of the metal in the outlet channel is activated and/or renewal of the outlet channel is triggered. In this way, optimum operation in the pouring of metal melt out of a vessel is simply achieved, wherein occurrence of irregularities are detected during the entire pouring, and pouring out of slag can be successfully prevented at the end of the pouring.

The semiconductor wafer is preheated by halogen lamps and then heated by a flash of light irradiation from flash lamps. A length of a light emission waveform of a flash of light applied from the flash lamps can be adjusted as appropriate. A data collection cycle (sampling interval) of a radiation thermometer that measures a surface temperature of the semiconductor wafer is made variable, and the longer the light emission waveform of the flash of light, the longer the data collection cycle. Even when a rising and falling time of the surface temperature of the semiconductor wafer changes due to the length of the light emission waveform of a flash of light, a temperature change can be included in a temperature profile with a constant number of data points until the surface temperature rises, goes through a maximum reaching temperature, and falls.

The semiconductor wafer is preheated by halogen lamps and then heated by a flash of light irradiation from flash lamps. A length of a light emission waveform of a flash of light applied from the flash lamps can be adjusted as appropriate. A data collection cycle (sampling interval) of a radiation thermometer that measures a surface temperature of the semiconductor wafer is made variable, and the longer the light emission waveform of the flash of light, the longer the data collection cycle. Even when a rising and falling time of the surface temperature of the semiconductor wafer changes due to the length of the light emission waveform of a flash of light, a temperature change can be included in a temperature profile with a constant number of data points until the surface temperature rises, goes through a maximum reaching temperature, and falls.

In the specification and drawings, an apparatus for conducting hot work is described and shown with an enclosure; a hot work apparatus operable within the enclosure; and a detector located exterior of the enclosure, the detector being in detecting communication with the interior of the enclosure, such that the detector detects the presence of a condition within the enclosure. A method of conducting hot work is also described and shown.

In the specification and drawings, an apparatus for conducting hot work is described and shown with an enclosure; a hot work apparatus operable within the enclosure; and a detector located exterior of the enclosure, the detector being in detecting communication with the interior of the enclosure, such that the detector detects the presence of a condition within the enclosure. A method of conducting hot work is also described and shown.

Several embodiments include a cooking instrument. The cooking instrument can include a heating system. The heating system can include one or more heating elements capable of emitting wireless energy into the cooking chamber. The cooking instrument can also include a sensor and a control system. The control system can be configured to execute a heating process and determine a stage of the heating process based on sensor data from the sensor.