Embodiments described herein relate to a bi-functional thermal cooling system. The bi-functional thermal cooling system includes a first body, a second body, and a third body. The second body has a first plurality of Weyl semimetal nanostructures. The second body is spaced apart from the first body. The third body has a second plurality of Weyl semimetal nanostructures. The third body is spaced apart from the second body. The second body and the third body are each configured to independently rotate with respect to the first body to change an optical property of the first plurality of Weyl semimetal nanostructures of the second body and an optical property of the second plurality of Weyl semimetal nanostructures of the third body.

A power overlay (POL) module includes a semiconductor device having a first side and an opposing second side, a dielectric sheet having a first side coupled to the semiconductor device second side, and an opposing second side, the dielectric sheet defining an aperture therethrough. The POL module also includes a first conductive layer disposed on the second side of the dielectric sheet and electrically coupled through the aperture to the semiconductor device second surface, a first conductive plate having a first side, and an opposing second side coupled to the first surface of the semiconductor device. The POL module further includes a first heat sink coupled the first side of the conductive plate and a first thermal interface layer disposed between the first conductive plate and the first heat sink.

This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

A flexible temperature control system absorbs and dissipates heat includes a flexible member having a thermal conductor wound with a substantially constant spacing separation and a uniform pitch that encloses a cooling passage that extends therethrough. The thermal conductor has a plurality of side openings. An upper case and a lower case connect the flexible member and include a heat dissipating layer formed of aromatic crystal of carbon atoms linked together in a hexagonal lattice. The cooling passage encloses a foam layer that includes void mediums that increase the thermal conductivity between an upper interfacing element distant from a lower interfacing element.

A thermal connection structure includes a foam layer having a light porous, semi-grid flexible material. A thermal conducting medium is injected within closed cells and foam voids of the foam layer. A heat dissipating layer couples the thermal conducting medium comprising a planar unsaturated ring that has thermal conductivity that couples a heat sink.

A thermal management system for transferring heat from a heat load includes a composite structural member that supports a heat load source and a heat transfer member in thermal contact with the composite structural member, and in thermal contact with a heat sink. The system further includes at least one thermally-conductive first fastener that is in thermal contact with the heat transfer member, couples the heat load source to the composite structural member, and conducts heat from the heat load source into the heat transfer member. The heat transfer member conducts heat from the thermally-conductive first fastener to the heat sink.

Provided is a heater for a ciga-like electronic cigarette with a heat transfer efficiency improved by strengthening a bonding force between a cigarette support portion and a heater portion by thermally pressing and bonding the cigarette support portion and the heater portion together using a heat-dissipating adhesive layer with a heat-dissipating filler added to a high-heat-resistant thermoplastic polyimide resin, and a method of manufacturing the same.

A power overlay (POL) module includes a semiconductor device having a first side and an opposing second side, a dielectric sheet having a first side coupled to the semiconductor device second side, and an opposing second side, the dielectric sheet defining an aperture therethrough. The POL module also includes a first conductive layer disposed on the second side of the dielectric sheet and electrically coupled through the aperture to the semiconductor device second surface, a first conductive plate having a first side, and an opposing second side coupled to the first surface of the semiconductor device. The POL module further includes a first heat sink coupled the first side of the conductive plate and a first thermal interface layer disposed between the first conductive plate and the first heat sink.

A heat exchanger is disclosed. The heat exchanger of the present disclosure includes a first heat exchanger into or from which a first fluid flows or is discharged, and a second heat exchanger into or from which a second fluid flows or is discharged, the second heat exchanger being adjacent to the first heat exchanger, and the first heat exchanger and the second heat exchanger are rolled together in a roll shape, are alternately disposed in a radial direction, and are in contact with each other.