Devices and methods disclosed herein can include a conductive foam having pores disposed within the conductive foam. The conductive foam can be compressible between an uncompressed thickness and a compressed thickness. The compressed thickness can be ninety-five percent or less of the uncompressed thickness. In one example, a filler can be disposed in the pores of the conductive foam. The filler can include a first thermal conductivity. The first thermal conductivity can be greater than a thermal conductivity of air.

A resin sheet has a single composition, and changes in thermal conductivity according to an area. The resin sheet includes a region having a thermal conductivity that is greater than an average value of a thermal conductivity of an entirety of the resin sheet by 1 W/mK or more. A method for manufacturing a resin sheet includes: forming a resin composition into a molded body having a sheet shape, the resin composition containing a filler having magnetic anisotropy; performing magnetic field orientation on the filler by using a bulk superconductor magnet in one or a plurality of predetermined portions of the molded body; and forming a region having a thermal conductivity that is greater than an average value of a thermal conductivity of an entirety of the resin sheet by 1 W/mK or more, in the one or the plurality of predetermined portions.

A heat sink includes a carbon nanotube structure and multiple calcium chloride particles. The carbon nanotube structure includes multiple carbon nanotubes, and the carbon nanotube structure is a free-standing structure. The multiple calcium chloride particles are located on the multiple carbon nanotubes. The present application is also related to an electronic device including the heat sink.

Tubing structures are connected to each other to form a tubing assembly having one or more fluid pathways from a fluid entrance to a fluid exit. A heating device is bonded to the tubing structures along a length of the tubing assembly. The heating device has a flexibility to follow along one or more bends present along the length of the tubing assembly. The heating device includes one or more heater traces embedded within an encasing material. The encasing material is thermally conductive and electrically insulative. The one or more heater traces are formed of a material that generates heat in the presence of an electrical current. The heating device has a continuous and unbroken structure along the length of the tubing assembly. An encapsulation layer of thermal insulating material is disposed over the tubing assembly and covers the heating device.

Techniques of controlling heat from a heat source in an electronic device using a heat pipe, improved techniques include placing a thermal conductor such as graphite sheet in thermal contact with a heat pipe and an external surface such as a surface of a battery in an electronic device. In some implementations, the graphite sheet covers an area encompassing an end of the heat pipe. In some implementations, the graphite sheet is attached to the heat pipe using an adhesive.

A tubular sapphire member of the present disclosure is a tubular body made of sapphire, including: an outer wall extending in an axial direction; a plurality of through holes extending in the axial direction; and one or more partition walls extending in the axial direction and dividing the plurality of through holes, wherein the axial direction is parallel to a c-axis of sapphire, at least one of the partition walls extends from a central axis toward the outer wall and is connected with the outer wall in a front view seen in the axial direction, and an extending direction of the partition wall is parallel to either an a-axis or an m-axis of sapphire.

An infrared radiation device includes a radiation portion including a heating portion and a metamaterial structure capable of emitting infrared radiation having a peak wavelength of a non-Planck distribution from a radiation surface when thermal energy is supplied from the heating portion; a reflecting portion that surrounds the radiation portion and reflects the infrared radiation emitted from the metamaterial structure; and an emitting portion having an incident surface on which the infrared radiation reflected by the reflecting portion is incident and an emission surface through which infrared radiation incident on the incident surface is emitted to outside, the emission surface having an area less than an area of the radiation surface.

A refractory panel for a heat exchanger is provided having a body including a first planar surface having a plurality of refractory openings formed therein. A sidewall is arranged about a periphery of at least one of the plurality of refractory openings. The sidewall extends outwardly from the first planar surface and is configured to extend through an adjacent component into an inlet of a heat exchanger coil.

A superconductive nano heat transfer plate type heat exchanger consisting of a plurality of superconductive nano plate bundles by welding, the plate bundles being formed by welding a plurality of heat transfer plates together and sealed in vacuum, each of the plate bundles comprising an evaporation zone and a condensation zone, inside the plate bundle is padded a superconductive nano medium. The heat exchanger enhances heat transfer efficiency and may perform highly efficient heat transfer at different pressures, different temperatures, within different application scopes.

Method and apparatus for thermally protecting a product, when storing and/or shipping a product, to control temperatures products are exposed to. Embodiments increase the amount of time portions of the product experience a desired temperature range and/or reduce the amount of time portions of the product experience temperatures outside a desired temperature range and/or experience an undesirable temperature range. Embodiments incorporate thermally conductive materials, referred to as conductive equalizers, positioned around and/or near the product positioned inside a packaging container, where the conductive materials conduct heat from locations in the package interior to other locations in the package interior. The conductive equalizers conductively transfer heat from hotter portions of the interior of the container to cooler portions of the interior of the container and/or from portions of the interior desired to be cooled to the cold bank, resulting in a more uniform temperature distribution around the product.