Patent classifications
F28F13/003
Devices and methods for radiative cooling
Devices for radiative cooling and optical waveguiding are provided, wherein the devices comprise a fabric including one or more fibers extending for a length in a longitudinal direction and a plurality of void structures positioned within each of the one or more fibers and extended over the length of each of the one or more fibers. Each of the plurality of void structures is configured to scatter at least a portion of an electromagnetic radiation received thereon to thereby radiatively cool the object.
Cold plate with porous thermal conductive structure
A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.
MODULAR HEAT-STORAGE ASSEMBLY WITH PHASE-CHANGE MATERIAL, THE MANUFACTURE OF WHICH IS SIMPLIFIED
The invention relates to a modular assembly (E) for storing heat by phase-change material including a plurality of heat-storage modules (M1) attached to one another, the heat-storage assembly comprising a vessel (2). At least two adjacent modules are disposed so that a porous external wall (6b) of one of the modules (M1) is arranged facing a porous external wall (6b) of the other of the modules (M1), and so that a solid external wall (6a) of one of the modules (M1), forming one of the parts of the vessel, is attached to a solid external wall (6a) of the other of the modules (M1), forming another part of the vessel.
Air-cooled heat transfer device with integrated and mechanized air pre-cool system
A once-through dry adiabatic cooler having an integrated factory installed air pre-cooler system that is mechanized to move from a shipping position to an operational position.
Heat Exchanger Device for a Motor Vehicle, Method for Operating a Heat Exchanger Device and Method for Producing a Heat Exchanger Device
A heat exchanger device for a motor vehicle includes a main body, through which a temperature-control medium can flow, and a media-conveying device which passes through the main body and by which a medium to be temperature-controlled can be conveyed through the main body. As a result, the temperature of the medium to be temperature-controlled can be controlled by heat exchange with the temperature-control medium. The main body is produced in an integral injection molding process, as a result of which the main body is closed on the periphery and open-pored in the interior.
Hypersonic leading-edge heat pipe with porous wick, and methods of making and using the same
Some variations provide a leading-edge heat pipe comprising: (a) an envelope fabricated from a shell material, wherein the envelope includes at least one edge with a radius of curvature of less than 3 mm, and wherein the envelope includes, or is in thermal communication with, at least one heat-rejection surface; (b) a porous wick fabricated from a ceramic or metallic wick material, wherein the porous wick is configured within a first portion of the interior cavity, wherein at least a portion of the porous wick is adjacent to the inner surface, and wherein the porous wick has a bimodal pore distribution comprising an average capillary-pore size from 0.2 microns to 200 microns and an average high-flow pore size from 100 microns to 2 millimeters (the average high-flow pore size is greater than the average capillary-pore size); and (c) a phase-change heat-transfer material contained within the porous wick.
HEAT EXCHANGER AND ADSORPTION MACHINE
The invention relates to a heat exchanger (10) of an adsorption machine, comprising—at least two heat transport pipes (15) and/or heat transport pipe sections, which are arranged at a distance (A) with respect to one another in such a way as to form at least one interspace, which is designed as a steam flow duct (18), —and pipe attachments (20) connected to the heat transport pipes (15) and/or heat transport pipe sections. According to the invention, the pipe attachments (20) are arranged in the interspace and designed as a substrate for a directly applied, binder-free active material coating (25), wherein the heat transfer grid (50) consisting of the coated pipe attachments (20) together with the heat transport pipes (15) and/or heat transport pipe sections has a steam-side outer surface of 500-3600 m.sup.2/m.sup.3.
Heat exchange using phase change material
A heat exchange device comprising phase change material-impregnated heat conductive foam disposed between fluid stream channels in a heat exchanger element.
Power electronics assemblies with CIO bonding layers and double sided cooling, and vehicles incorporating the same
A 2-in-1 power electronics assembly includes a frame with a lower dielectric layer, an upper dielectric layer spaced apart from the lower dielectric layer, and a sidewall disposed between and coupled to the lower dielectric layer and the upper dielectric layer. The lower dielectric layer includes a lower cooling fluid inlet and the upper dielectric layer includes an upper cooling fluid outlet. A first semiconductor device assembly and a second semiconductor device assembly are included and disposed within the frame. The first semiconductor device is disposed between a first lower metal inverse opal (MIO) layer and a first upper MIO layer, and the second semiconductor device is disposed between a second lower MIO layer and a second upper MIO layer. An internal cooling structure that includes the MIO layers provides double sided cooling for the first semiconductor device and the second semiconductor device.
Monocoque shell and tube heat exchanger
A heat exchanger with a monocoque structure transfers heat between a first fluid and a second fluid. The heat exchanger in has a plurality of tubes through which the first fluid may flow in a direction, each of the plurality of tubes has a first mouth end, an N opposing second mouth end and a waist region between the first mouth end and the second mouth end. The heat exchanger also has one or more interconnected fluid channels through which the second fluid may flow, the one or more fluid channels lay generally in a plane, the plurality of tubes and the one or more fluid channels interleave such that heat may be transferred between the plurality of tubes and the one or more fluid channels, and the direction of flow of the first fluid is generally perpendicular to the plane of the one or more fluid channels.