Patent classifications
F28F13/003
Reaction device with heat exchanger and use thereof
A reaction device is provided with a first wall that defines an interior in which a stirring mechanism is located. A heat exchanger is at least partly provided on the first outer wall surface facing away from the interior and/or on the stirring mechanism, wherein the heat exchanger has a grate structure, and at least two layers are provided which have a grate structure. Thus, it is possible to transfer heat in a precise and efficient manner primarily by means of thermal radiation in endothermic processes at different temperature levels, in particular pyrolysis, gassing, and reforming processes, and thereby use the exhaust heat for other processes.
Liquid Cooling Apparatus
A liquid cooling apparatus has a chassis, a cover mounted on the chassis, and a dividing structure disposed in an inner chamber defined between the chassis and the cover. The dividing structure divides the inner chamber into a liquid inlet compartment and a liquid outlet compartment. The liquid inlet compartment communicates with the liquid outlet compartment via the recess. The liquid cooling apparatus can be installed on a first panel with the boss of the chassis mounted through a through hole of the first panel and thermally attached to a heat source on a second panel. A working fluid that flows into the liquid inlet compartment is forced to flow into the recess before flowing to the liquid outlet compartment by the dividing structure. Accordingly, heat generated by the heat source can be effectively dissipated.
HEAT DISSIPATION DEVICE HAVING ANISOTROPIC THERMALLY CONDUCTIVE SECTIONS AND ISOTROPIC THERMALLY CONDUCTIVE SECTIONS
A heat dissipation device may be formed having at least one isotropic thermally conductive section (uniformly high thermal conductivity in all directions) and at least one anisotropic thermally conductive section (high thermal conductivity in at least one direction and low thermal conductivity in at least one other direction). The heat dissipation device may be thermally coupled to a plurality of integrated circuit devices such that at least a portion of the isotropic thermally conductive section(s) and/or the anisotropic thermally conductive section(s) is positioned over at least one integrated circuit device. The isotropic thermally conductive section(s) allows heat spreading/removal from hotspots or areas with high-power density and the anisotropic thermally conductive section(s) transfers heat away from the at least one integrated circuit device predominately in a single direction with minimum conduction resistance in areas with uniform power density distribution, while reducing heat transfer in the other directions, thereby reducing thermal cross-talk.
ACTIVE THERMAL DISSIPATING SYSTEM
An active temperature control system includes a thermal connection structure made of a foam layer having a light porous and semi-grid flexible material. The thermal medium is injected within closed cells and foam voids of the foam layer that couples heat dissipating layers. A cooling fan positioned adjacent to the heat dissipating layers draws heat from them.
MODULE FOR THERMAL STORAGE BY A PHASE-CHANGE MATERIAL WHOSE MANUFACTURE IS SIMPLIFIED
A module for thermal storage by a phase-change material includes a vat, at least one heat-exchanger having first and second connecting ends configured to be connected to a heat-transfer fluid network, the first and second connecting ends penetrating and opening into the vat, and a structure received in the vat and configured to contain a phase-change material. The structure includes a porous matrix made of a metallic material with communicating cells crossed by the heat-exchanger and in contact with the external surface of the heat-exchanger. The matrix is obtained by moulding around the heat-exchanger. The vat includes at least one wall made of a metallic material formed directly during moulding and integral with the matrix.
LIQUID COOLING STRUCTURE AND LIQUID COOLING SYSTEM INCLUDING THE LIQUID COOLING STRUCTURE
A liquid cooling structure may include a lower structure and an upper structure. The lower structure may be configured to cover one surface of an object. The upper structure may be combined with the lower structure to provide a channel through which a cooling fluid may flow. The channel may include a plurality of passages connected between a channel inlet through which the cooling fluid may enter and a channel outlet through which the cooling fluid may exits.
Circumferential flow foam heat exchanger
A heat exchanger is disclosed that includes a cold heat exchange zone including a foam material having an annular geometry and having fluid distribution and collection slots configured to distribute a cooling fluid circumferentially through the foam material.
HEAT EXCHANGE APPARATUS AND METHOD
A heat exchanger apparatus includes a tube having a wall with an inner surface and an outer surface. The tube is configured to receive heat exchange fluid at one end, and output, when heated through the wall, vapor of the heat exchange fluid at the opposing end. A first layer of thermally conductive porous material is disposed on the inner surface of the tube. Heating equipment, a heat exchanger, and a method of heating are also disclosed.
COLD PLATE AND A METHOD OF MANUFACTURE THEREOF
A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.
CONSTANT DENSITY HEAT EXCHANGER AND SYSTEM FOR ENERGY CONVERSION
A constant density heat exchanger and system for energy conversion is provided. The constant density heat exchanger includes a housing extending between a first end and a second end and defining a chamber having an inlet and an outlet. A first flow control device is positioned at the inlet of the chamber and movable between an open position in which a working fluid is permitted into the chamber and a closed position in which the working fluid is prevented from entering the chamber. A second flow control device is positioned at the outlet of the chamber and movable between an open position in which the working fluid is permitted to exit the chamber and a closed position in which the working fluid is prevented from exiting the chamber. A heat exchange fluid imparts thermal energy to the volume of working fluid as the first flow control device and the second flow control device hold the volume of working fluid at constant density within the chamber.