Embodiments herein relate to systems, apparatuses, processing, and techniques related to patterning one or more sides of a thin film capacitor (TFC) sheet, where the TFC sheet has a first side and a second side opposite the first side. The first side and the second side of the TFC sheet are metal and are separated by a dielectric layer, and the patterned TFC sheet is to provide at least one of a capacitor or a routing feature on a first side of a substrate that has the first side and a second side opposite the first side.

A heat sink assembly includes a thermally conductive support member configured to be attached to a heat source and a heat sink. An adjustable mechanism is configured to moveably connect the thermally conductive support member to the heat sink. The adjustable mechanism permits the heat source to be moved relative to the heat sink without requiring access to the adjustable mechanism. The heat sink assembly provides a mechanically adjustable and supportive system having a thermally conductive path for heat removal from the object. The integral movable adjustment mechanism permits the thermally conductive member to translate without loss of the thermal path between the two ends. The heat source can move and become rigidly fixed in location without direct access. A compression mechanism may provide a continuous force between the support member and the heat sink as the support member is translated to permit movement of the heat generating source.

The disclosed apparatus may include (1) a shoulder bolt that includes (A) a head and (B) a shank, (2) a retention barrel that envelops at least a portion of the shank of the shoulder bolt, (3) a coil spring that envelops at least a portion of the shank of the shoulder bolt and resides between the head of the shoulder bolt and a heatsink, and (4) a travel-limiting component (such as a set screw or a sleeve) that (A) is coupled to the retention barrel and (B) limits the heatsink from travelling linearly beyond a travel threshold via the coil spring. Various other apparatuses, systems, and methods are also disclosed.

A memory auxiliary heat transfer structure is correspondingly assembled with at least one memory unit and a water-cooling assembly. The memory auxiliary heat transfer structure includes a main body. The main body has a first end, a second end and a middle section. The middle section has a heated side and a contact side. The heated side is disposed corresponding to at least one chip disposed on the memory unit. The contact side is attached to and assembled with the water-cooling assembly. The memory auxiliary heat transfer structure serves to reduce the friction between the memory unit and the water-cooling assembly and fill the gap so as to reduce the heat resistance.

A vessel includes an exterior container, an interior container, and a support structure. The exterior container is formed by an exterior wall that prevents transmission of a fluid. The interior container is by an interior layer disposed within the exterior container such that the exterior container encapsulates the interior container. The interior layer and the exterior wall are separated by a gap defining a barrier void. The interior layer prevents transmission of a fluid across the interior layer. The support structure is disposed within the barrier void between the exterior wall and the interior layer. The support structure comprises a lattice and is integrally formed with the exterior wall and the interior layer. The support structure is connected to and extends between the exterior wall and the interior layer.

A thermal switch having an on-state and an off-state is provided. First and second plates are composed from a thermally conductive material. The first and second plates are connected to form an internal cavity having a channel defining a gap between the first and second plate. The first reservoir is coupled to the channel and contains a thermally conductive liquid. The actuator is coupled to the first reservoir and the channel and is moveable between a first state and a second state corresponding to the on-state and the off-state of the thermal switch, respectively. Thermally conductive liquid is allowed to flow from the first reservoir to the channel when the actuator is in the first state and allowed to flow from the channel to the first reservoir when the actuator is in the second state.

A heating system for an EWOD device using a single, spatially-structured temperature control element, used to create a zone with a specific temperature profile. The heating system uses multiple contact regions between the temperature control element and the device. One or more contact regions are separated from the temperature control element by one or more thermally resistive layers that restrict heat flow from the temperature control element to the device, and further restrict lateral flow of heat between adjacent contact regions. The heating system can use materials with different thermal resistance to alter the heat flow to different regions. The spatial location of the contact regions is also used to determine the temperature profile within the device. The device has an optional temperature control element which offsets the low temperature point from the inlet temperature. This invention includes methods to process multiple droplets within the multiple temperature zones.

The disclosed apparatus may include (1) a shoulder bolt that includes (A) a head and (B) a shank, (2) a retention barrel that envelops at least a portion of the shank of the shoulder bolt, (3) a coil spring that envelops at least a portion of the shank of the shoulder bolt and resides between the head of the shoulder bolt and a heatsink, and (4) a travel-limiting component (such as a set screw or a sleeve) that (A) is coupled to the retention barrel and (B) limits the heatsink from travelling linearly beyond a travel threshold via the coil spring. Various other apparatuses, systems, and methods are also disclosed.

Disclosed herein are thermal interface materials (TIMs) including memory foam cores. In an exemplary embodiment, a thermal interface material generally includes a memory foam core including a plurality of sides defining a perimeter. A heat spreader is disposed at least partially around the perimeter defined the plurality of sides of the memory foam core.

A thermal interface material system includes a thermally conductive porous matrix, the thermally conductive porous matrix having a plurality of interstitial voids, and a thermally conductive colloidal suspension disposed on each side of the thermally conductive porous matrix to inhibit thermal pump-out of the thermally conductive colloidal suspension so that the thermally conductive porous matrix and thermally conductive colloidal suspension collectively form a thermally conductive porous pad.