Described herein is an apparatus and method for generating a pain score for a patient. The method includes the steps of generating a PLR response signature for each drug of a plurality of drugs and further initiating a light stimulus to the patient, and measuring a corresponding PLR response. The method includes initiating a neuro-stimulus to the patient, the neuro-stimulus being initiated over a set of frequencies, each frequency being associated with a unique intensity, and stimulating a unique nerve fiber type of the patient, and measuring a PRD response of the patient for the initiated neuro-stimulus. Further, the method includes determining, for each nerve fiber type, a threshold response based on the measured PRD, determining a weight for each threshold response based on the PLR response, and combining the determined weight for each threshold response to obtain a pain score for the patient.

In one embodiment of the present disclosure, a device is disclosed comprising a macroscopic thermal body and an extraction structure that is electromagnetically-coupled to the thermal emitting area of the thermal body. The macroscopic thermal body having a thermal emitting area, and the extraction structure configured and arranged to facilitate emission from, or receipt to the thermal emitting area that exceeds a theoretical, Stefan-Boltzmann, emission limit for a blackbody having the same thermal emitting area as the thermal body.

A heat control method and device are provided. In the method, a distance or distances between one or more regions of a terminal and a predetermined detection object may be detected (S102); heat insulation processing may be performed in a first region of the terminal, where the first region may be a region of which the distance to the predetermined detection object is smaller than a first predetermined threshold; and/or, heat dissipation processing may be performed in a second region of the terminal, where the second region may be a region of which the distance to the predetermined detection object is larger than a second predetermined threshold (S104).

A heat dissipation device for an electronic device is provided. The heat dissipation device comprises a heat conducting cover configured to be disposed on an electronic device, the heat conducting cover forming a closed cavity; and a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover. With a temperature increase of the electronic device, the heat absorbing material filler is configured to deform structurally, to absorb heat generated by the electronic device.

Heat transfer between a fluid-bearing flexible tube and a heat-conducting surface is improved by fixing a flexible heat-conducting sheath to the flexible tube and by compressive fixing that distorts the tube and deforms the sheath and/or the surface. The tube can be made of cross-linked polythene (PEX). The sheath can be spirally wound high-purity aluminum wire. The sheath enables efficient heat transfer between the outer surface of the tube and the heat-conducting surface. Applications include radiant heating and cooling. Tube layout can be customized and variable tube spacing is possible, for example by using a castellated layer to support the tube.

An apparatus for thermal interface material detection includes a heat dissipating device stack up that includes a heat dissipating device, a thermal interface material, a heat generating component, and a printed circuit board. The heat dissipating device is disposed on the thermal interface material, the thermal interface material is disposed on the heat generating component, and the heat generating component is disposed on the printed circuit board. A channel in a body of the heat dissipating device includes an embedded conductive probe, where a first end of the embedded conductive probe leads to a lower surface of the body of the heat dissipating device and a second end of the embedded conductive probe leads to an upper surface of the body of the heat dissipating device.

A device for coupling to a heat source, the device includes thermoelectric elements and a coupling magnet. The thermoelectric elements harvest heat to generate electric current. The coupling magnet provides a coupling force between the thermoelectric elements and the heat source. The coupling magnet regulates thermal flow between the thermoelectric elements and the heat source as a function of temperature of the coupling magnet. The device acts to protect the thermoelectric elements and other associated components from heat damage that might otherwise occur if the heat source generates too much heat.

A method for controlling thermal conductivity between two thermal masses includes thermally contacting a first conduction body with a heat source, thermally contacting a second conduction body with a heat sink, and thermally contacting the second conduction body with the first conduction body by moving the first conduction body between a first position and a second position with a thermal expansion component. The thermal expansion component moves the first conduction body between the first position and the second position at a predetermined temperature and heat is conducted from the heat source to the heat sink through the first and second conduction bodies.

Method and apparatus for controlling heat transfer between two objects. In one embodiment, an apparatus for controlled heat transfer is disclosed herein. The apparatus includes a first and second conductive elements, a container of magnetorheological fluid disposed between the first and second conductive elements, an electromagnet disposed about the container, wherein the electromagnet is configured to produce a magnetic field within the container of magnetorheological fluid and conductively couple the first and second conductive elements, and at least one biasing element wherein the biasing element is coupled to the first conductive element and is configured to move the first conductive element relative to the container to conductively couple and uncouple the first conductive element and the second conductive element.

A thermal conductive stress relaxation structure is interposed between a high-temperature substance and a low-temperature substance to conduct heat in a heat-transfer direction from the high-temperature substance to the low-temperature substance. The structure includes an assembly configured such that a thermal conductive material gathers in a non-bonded state having stress relaxation effect. Such an assembly is a rolled-up body configured such that a carbon-based sheet material and a metal-based sheet material are alternately rolled up, for example. This structure has one or more interfaces at which adjacent parts can slide, thereby dividing a deformable region to relax the thermal stress. It has a low rigidity and can thus deform to release the thermal stress. The structure can suppress the thermal stresses and the shape changes that would be generated in the high-temperature substance and the low-temperature substance, and each physical body located there between.