A heat sink module for cooling a heat providing surface can include an inlet chamber and an outlet chamber formed within the heat sink module. The outlet chamber can have an open portion that can be enclosed by the heat providing surface when the heat sink module is installed on the heat providing surface. The heat sink module can include a dividing member disposed between the inlet chamber and the outlet chamber. The dividing member can include a first plurality of orifices extending from a top surface of the dividing member to a bottom surface of the dividing member. The first plurality of orifices can be configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the heat providing surface when the heat sink module is installed on the heat providing surface and when pressurized coolant is provided to the inlet chamber.

A heat sink module for cooling a heat providing surface can include an inlet chamber and an outlet chamber formed within the heat sink module. The outlet chamber can have an open portion that can be enclosed by the heat providing surface when the heat sink module is installed on the heat providing surface. The heat sink module can include a dividing member disposed between the inlet chamber and the outlet chamber. The dividing member can include a first plurality of orifices extending from a top surface of the dividing member to a bottom surface of the dividing member. The first plurality of orifices can be configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the heat providing surface when the heat sink module is installed on the heat providing surface and when pressurized coolant is provided to the inlet chamber.

A device is provided that includes a heat conductive structure; a heat transfer structure for extracting heat from the heat conductive structure by means of a boundary layer; a motor for rotating the heat transfer structure relative to the heat conductive structure; and a vertical fixing mechanism for allowing the heat transfer structure to rotate above the heat transfer structure without making contact with the heat transfer structure so as to define a boundary layer between the heat conductive structure and heat transfer structure, wherein the heat transfer structure extracts heat from the heat conductive structure by means of the boundary layer, and wherein the heat conductive structure includes small geometric turbulators.

A device is provided that includes a heat conductive structure; a heat transfer structure for extracting heat from the heat conductive structure by means of a boundary layer; a motor for rotating the heat transfer structure relative to the heat conductive structure; and a vertical fixing mechanism for allowing the heat transfer structure to rotate above the heat transfer structure without making contact with the heat transfer structure so as to define a boundary layer between the heat conductive structure and heat transfer structure, wherein the heat transfer structure extracts heat from the heat conductive structure by means of the boundary layer, and wherein the heat conductive structure includes small geometric turbulators.

Flow paths and boundary layer restart features are provided. For example, a flow path comprises a flow path wall defining an inner flow path surface and an asymmetric notch defined in the flow path wall. The asymmetric notch comprises a first surface and a second surface and is asymmetric about a first line extending through an intersection of the first and second surfaces. Further, a flow boundary layer restart feature comprises a first surface extending inward with respect to a flow path surface of a flow path and a second surface extending inward with respect to the flow path surface. The second surface is asymmetric with respect to the first surface such that the first and second surfaces define an asymmetric notch. Additionally, a flow path wall may comprise an asymmetric notch that includes a flow expansion angle and a flow contraction angle that are unequal.

A passive vortex formed or induced from a temperature difference across a cavity or void aggregates and supports a horizontal flow over the top of the cavity. A cavity of a suitable depth and width exhibits a small difference in temperature, or heat source, along the sides or bottom of cavity. A resulting convective flow tends to form a rising current along a warmer side, and a complementary downward current on an opposed side of the cavity. The formed vortex tends to draw the cooler downward flow across the warmer, heated surface, enhancing the vortex flow. The vortex aligns with a horizontal flow across the top of the cavity as the upward current complements the downward current on an opposed side of the cavity. A plurality of adjacent cavities tend to align with an aggregate horizontal flow contributed from each cavity.

A passive vortex formed or induced from a temperature difference across a cavity or void aggregates and supports a horizontal flow over the top of the cavity. A cavity of a suitable depth and width exhibits a small difference in temperature, or heat source, along the sides or bottom of cavity. A resulting convective flow tends to form a rising current along a warmer side, and a complementary downward current on an opposed side of the cavity. The formed vortex tends to draw the cooler downward flow across the warmer, heated surface, enhancing the vortex flow. The vortex aligns with a horizontal flow across the top of the cavity as the upward current complements the downward current on an opposed side of the cavity. A plurality of adjacent cavities tend to align with an aggregate horizontal flow contributed from each cavity.

A evaporative cooling device is described having a pair of heat conducting plates arranged in spaced, generally parallel relationship with spacing elements separating the plates from one another and defining primary and secondary flow channels between the plates. Inlet ducts are connected to the primary channels and outlet ducts connect from the primary and secondary channels. A water distribution system is also provided to supply water to the secondary channels such that a primary air flow through the primary channels may be cooled by heat conduction along the plates to cause evaporation of the water into a secondary air flow through the secondary channels.

A evaporative cooling device is described having a pair of heat conducting plates arranged in spaced, generally parallel relationship with spacing elements separating the plates from one another and defining primary and secondary flow channels between the plates. Inlet ducts are connected to the primary channels and outlet ducts connect from the primary and secondary channels. A water distribution system is also provided to supply water to the secondary channels such that a primary air flow through the primary channels may be cooled by heat conduction along the plates to cause evaporation of the water into a secondary air flow through the secondary channels.

Apparatuses, systems and methods are directed to heat exchangers that are made of microchannel tubes and that have offset fins of various geometries and density. The heat exchanger coils can be implemented in various refrigeration and/or heating, ventilation, and air conditioning (HVAC) units or systems thereof.