An electronic device having a heat dissipation function is proposed. The electronic device includes: a heating element (20); a shield can (30) covering the heating element (20) to block electromagnetic waves; and a heat dissipation means (50) provided to be adjacent to the heating element (20) and causing an ionic wind to flow into a shielded space (32) of an inner part of the shield can (30). Here, the heat dissipation means (50) includes: a wire electrode (70) provided to be adjacent to an entrance of the shielded space (32) of the shield can (30) and becoming an emitter electrode; and a power module (80) connected to the wire electrode (70) and applying voltage to the wire electrode (70), wherein the shield can (30) is grounded at the same time of being connected to the power module (80) and becomes a collector electrode.

A heat exchanger including more than one fluid conductor, each of the fluid conductors is configured to receive a distinct flow of fluid and heat from only one heat source, wherein the coils are configured to be interleaved to form a structure of a single-sized lumen in which the heat source is disposed.

A heat exchanger including more than one fluid conductor, each of the fluid conductors is configured to receive a distinct flow of fluid and heat from only one heat source, wherein the coils are configured to be interleaved to form a structure of a single-sized lumen in which the heat source is disposed.

An electrocaloric module includes an electrocaloric element that includes an electrocaloric film, a first electrode on a first surface of the electrocaloric film, and a second electrode on a second surface of the electrocaloric film. A support is attached along an edge portion of the electrocaloric film, leaving a central portion of the electrocaloric film unsupported film. At least one of the first and second electrodes includes a patterned disposition of conductive material on the film surface. The electrocaloric module also includes a first thermal connection configured to connect to a first thermal flow path between the electrocaloric element and a heat sink, a second thermal connection configured to connect to a second thermal flow path between the electrocaloric element and a heat source, and a power connection connected to the first and second electrodes and configured to connect to a power source.

An electrocaloric module includes an electrocaloric element that includes an electrocaloric film, a first electrode on a first surface of the electrocaloric film, and a second electrode on a second surface of the electrocaloric film. A support is attached along an edge portion of the electrocaloric film, leaving a central portion of the electrocaloric film unsupported film. At least one of the first and second electrodes includes a patterned disposition of conductive material on the film surface. The electrocaloric module also includes a first thermal connection configured to connect to a first thermal flow path between the electrocaloric element and a heat sink, a second thermal connection configured to connect to a second thermal flow path between the electrocaloric element and a heat source, and a power connection connected to the first and second electrodes and configured to connect to a power source.

An arrangement for thermal management is disclosed, wherein a heat generating component is arranged within an enclosure, defined by an enclosure wall and in thermal contact with a thermal management fluid. The arrangement comprises an electrohydrodynamic flow unit, comprising a first and a second electrode, for controlling the flow of fluid within the enclosure.

An arrangement for thermal management is disclosed, wherein a heat generating component is arranged within an enclosure, defined by an enclosure wall and in thermal contact with a thermal management fluid. The arrangement comprises an electrohydrodynamic flow unit, comprising a first and a second electrode, for controlling the flow of fluid within the enclosure.

An example apparatus is disclosed that includes a base and a wickless capillary driven constrained vapor bubble heat pipe carried by the base. The wickless capillary driven constrained vapor bubble heat pipe includes a capillary, and the capillary has a longitudinal axis and a cross-sectional shape orthogonal to the longitudinal axis. The cross-sectional shape includes a first curved wall, a second curved wall, a first corner between a first straight wall and a second straight wall, and a second corner between a third straight wall and a fourth straight wall.

An example apparatus is disclosed that includes a base and a wickless capillary driven constrained vapor bubble heat pipe carried by the base. The wickless capillary driven constrained vapor bubble heat pipe includes a capillary, and the capillary has a longitudinal axis and a cross-sectional shape orthogonal to the longitudinal axis. The cross-sectional shape includes a first curved wall, a second curved wall, a first corner between a first straight wall and a second straight wall, and a second corner between a third straight wall and a fourth straight wall.

To provide a reticular resin molding and an operating method of an air conditioner capable of increasing a heat exchange efficiency in a heat exchanger by controlling a charge of air introduced into the heat exchanger.

The reticular resin molding has a plate form, is composed of a thermoplastic resin, includes a plurality of vent holes penetrating in a thickness direction, and is capable of increasing a heat exchange efficiency in a heat exchanger by introducing air, having passed through the vent holes to control a charge thereof, into the heat exchanger. The reticular resin molding is composed of a thermoplastic resin of polyethylene or polypropylene obtained by dissolving therein a non-fired powder of a montmorillonite-based clay mineral. Further, the operating method of an air conditioner comprises providing, to the heat exchanger, this reticular resin molding so as to cross an airflow path to a heat exchanger, and introducing the air, having passed through the vent holes, into the heat exchanger.