A device includes a connected array of cells formed in a stack of flexible sheets. Each pair of adjacent sheets in the stack includes a first sheet and a second sheet bonded together at multiple bond locations. Each sheet has an electrically conductive layer disposed on an electrically non-conductive layer, the conductive layer comprising an electrically conductive non-metal material. Each pair of adjacent sheets in the stack is arranged so that the non-conductive layer of each first sheet is between the conductive layers of the first and second sheets. The cells of the array reversibly transition between an open state and a closed state in response to an electric potential having a magnitude greater than a threshold value applied between the conductive layers of the first and second sheets.

A device includes a connected array of cells formed in a stack of flexible sheets. Each pair of adjacent sheets in the stack includes a first sheet and a second sheet bonded together at multiple bond locations. Each sheet has an electrically conductive layer disposed on an electrically non-conductive layer, the conductive layer comprising an electrically conductive non-metal material. Each pair of adjacent sheets in the stack is arranged so that the non-conductive layer of each first sheet is between the conductive layers of the first and second sheets. The cells of the array reversibly transition between an open state and a closed state in response to an electric potential having a magnitude greater than a threshold value applied between the conductive layers of the first and second sheets.

A thermal switch includes: a first electrode; a second electrode opposite the first electrode; and a liquid crystal layer between the first electrode and the second electrode, the liquid crystal layer containing liquid crystal molecules that are at least either in the Williams domain mode or in the dynamic scattering mode when a voltage is applied between the first electrode and the second electrode.

To provide a reticular resin molding and an operating method of an air conditioner capable of increasing a heat exchange efficiency in a heat exchanger by controlling a charge of air introduced into the heat exchanger. The reticular resin molding has a plate form, is composed of a thermoplastic resin, includes a plurality of vent holes penetrating in a thickness direction, and is capable of increasing a heat exchange efficiency in a heat exchanger by introducing air, having passed through the vent holes to control a charge thereof, into the heat exchanger. The reticular resin molding is composed of a thermoplastic resin of polyethylene or polypropylene obtained by dissolving therein a non-fired powder of a montmorillonite-based clay mineral. Further, the operating method of an air conditioner comprises providing, to the heat exchanger, this reticular resin molding so as to cross an airflow path to a heat exchanger, and introducing the air, having passed through the vent holes, into the heat exchanger.

To provide a reticular resin molding and an operating method of an air conditioner capable of increasing a heat exchange efficiency in a heat exchanger by controlling a charge of air introduced into the heat exchanger. The reticular resin molding has a plate form, is composed of a thermoplastic resin, includes a plurality of vent holes penetrating in a thickness direction, and is capable of increasing a heat exchange efficiency in a heat exchanger by introducing air, having passed through the vent holes to control a charge thereof, into the heat exchanger. The reticular resin molding is composed of a thermoplastic resin of polyethylene or polypropylene obtained by dissolving therein a non-fired powder of a montmorillonite-based clay mineral. Further, the operating method of an air conditioner comprises providing, to the heat exchanger, this reticular resin molding so as to cross an airflow path to a heat exchanger, and introducing the air, having passed through the vent holes, into the heat exchanger.

A fluidic device is disclosed, comprising an enclosed passage that is adapted to convey a circulating fluid. The enclosed passage comprises a flow unit having a first electrode and a second electrode offset from the first electrode in a downstream direction of a flow of the circulating fluid. The first electrode is formed as a grid structure and arranged to allow the circulating fluid to flow through the first electrode. The fluidic device may be used for controlling or regulating the flow of the fluid circulating in the enclosed passage, and thereby act as a valve opening, reducing or even closing the passage.

A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in rack servers are disclosed. An example embodiment includes: a base structure; and a rack column supported by the base structure, the rack column in thermal coupling with a heat-generating device, the rack column containing a constrained vapor bubble (CVB) cell cluster including a plurality of cells in thermal coupling with the heat-generating device at a first end in an evaporator region and in thermal coupling with the base structure at a second end in a condenser region, each cell of the plurality of cells having a wickless capillary driven CVB heat pipe embedded in the cell, each wickless capillary driven CVB heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between the evaporator region and the condenser region.

A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in rack servers are disclosed. An example embodiment includes: a base structure; and a rack column supported by the base structure, the rack column in thermal coupling with a heat-generating device, the rack column containing a constrained vapor bubble (CVB) cell cluster including a plurality of cells in thermal coupling with the heat-generating device at a first end in an evaporator region and in thermal coupling with the base structure at a second end in a condenser region, each cell of the plurality of cells having a wickless capillary driven CVB heat pipe embedded in the cell, each wickless capillary driven CVB heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between the evaporator region and the condenser region.

An electronic device having heat dissipation function is proposed. The electronic device includes: a heating element (60) installed in a casing (C); a heat dissipation means (70) causing an ionic wind to flow into an inner space (S) of the casing (C); and a heat dissipation bridge (95). The heat dissipation bridge (95) exchanges heat with the ionic wind flowing in the inner space (S) by protruding in a direction of the heating element (60) and at least a portion of the heat dissipation bridge is connected to a heat sink and transfers heat received from the heating element (60) to the heat sink. Accordingly, two means of the heat dissipation means (70) and the heat dissipation bridge (95) simultaneously cool the heating element (60), so cooling efficiency is improved.

An electronic device having heat dissipation function is proposed. The electronic device includes: a heating element (60) installed in a casing (C); a heat dissipation means (70) causing an ionic wind to flow into an inner space (S) of the casing (C); and a heat dissipation bridge (95). The heat dissipation bridge (95) exchanges heat with the ionic wind flowing in the inner space (S) by protruding in a direction of the heating element (60) and at least a portion of the heat dissipation bridge is connected to a heat sink and transfers heat received from the heating element (60) to the heat sink. Accordingly, two means of the heat dissipation means (70) and the heat dissipation bridge (95) simultaneously cool the heating element (60), so cooling efficiency is improved.