A heat-dissipation substrate structure with high adhesive strength is provided. The heat-dissipation substrate structure includes a heat-dissipation base layer, a functional layer, and a matching layer. The functional layer is formed by sputtering, and has a single layer structure or a multi-layer structure. A thickness of each layer of the functional layer is less than 3 μm. The matching layer has a single layer structure or a multi-layer structure, and a thickness of each layer of the multi-layer structure of the matching layer is less than 1 μm. The matching layer is formed by sputtering of one or any two of titanium, titanium alloy, nickel, and nickel alloy. The functional layer and the heat-dissipation base layer are two heterogeneous metal layers, and the matching layer is located between the functional layer and the heat-dissipation base layer.

A heat-dissipation substrate structure with high adhesive strength is provided. The heat-dissipation substrate structure includes a heat-dissipation base layer, a functional layer, and a matching layer. The functional layer is formed by sputtering, and has a single layer structure or a multi-layer structure. A thickness of each layer of the functional layer is less than 3 μm. The matching layer has a single layer structure or a multi-layer structure, and a thickness of each layer of the multi-layer structure of the matching layer is less than 1 μm. The matching layer is formed by sputtering of one or any two of titanium, titanium alloy, nickel, and nickel alloy. The functional layer and the heat-dissipation base layer are two heterogeneous metal layers, and the matching layer is located between the functional layer and the heat-dissipation base layer.

A radiant cooling system comprises an enclosure, a cooling element and a cooling device. The enclosure includes a first wall that is transmissive of infrared radiation. The cooling element is disposed in the enclosure. The cooling device is coupled to the cooling element. The cooling element provides cooling mainly by radiative exchange. The system promotes cooling by radiative exchange and significantly reduces condensation problems and is compatible with open and enclosed spaces. Thermal losses of cooling power to conductive and convective pathways are significantly reduced. The system comes in a variety of forms including flat, cylindrical and dome-like geometries.

A radiant cooling system comprises an enclosure, a cooling element and a cooling device. The enclosure includes a first wall that is transmissive of infrared radiation. The cooling element is disposed in the enclosure. The cooling device is coupled to the cooling element. The cooling element provides cooling mainly by radiative exchange. The system promotes cooling by radiative exchange and significantly reduces condensation problems and is compatible with open and enclosed spaces. Thermal losses of cooling power to conductive and convective pathways are significantly reduced. The system comes in a variety of forms including flat, cylindrical and dome-like geometries.

Cooling assemblies including a porous three dimensional surface such as a heat sink are disclosed. In one embodiment, a cooling assembly includes a heat transfer substrate having a surface, a thermally conductive fin extending from the surface, a metal mesh bonded to a surface of the thermally conductive fin, and sintered metal particles bonded to the metal mesh and the surface of the thermally conductive fin. The metal mesh defines a macro-level porosity, and the sintered metal particles define a micro-level porosity. In another embodiment, a cooling assembly includes a heat transfer substrate having a surface, a thermally conductive fin extending from the surface of the heat transfer substrate, and sintered metal particles bonded to the surface of the thermally conductive fin. An average diameter of the sintered metal particles increases from a base of the thermally conductive fin to a top of the thermally conductive fin.

A method to modify the shape of a channel in a metallic substrate is described. The method includes the step of applying at least one metallic coating on selected portions of an interior surface of the channel, so as to alter the heat transfer characteristics of the channel during passage of a coolant fluid therethrough. Related articles that contain the modified channels are also described, such as gas turbine engine components.

A heat exchanger may include a heat exchange surface partially coated with a heat-conducting layer. The heat exchange surface may include a plurality of contact regions coated with the heat-conducting layer and a plurality of insulating regions that are not coated with the heat-conducting layer. The heat exchange surface may further include a degree of coverage of the heat-conducting layer that varies to compensate at least one of at least one hot spot and at least one cold spot. The at least one hot spot and the at least one cold spot may be included within at least one of the heat exchange surface and a plurality of energy storage elements of an energy store that contacts the heat exchange surface.

A heat exchanger may include a heat exchange surface partially coated with a heat-conducting layer. The heat exchange surface may include a plurality of contact regions coated with the heat-conducting layer and a plurality of insulating regions that are not coated with the heat-conducting layer. The heat exchange surface may further include a degree of coverage of the heat-conducting layer that varies to compensate at least one of at least one hot spot and at least one cold spot. The at least one hot spot and the at least one cold spot may be included within at least one of the heat exchange surface and a plurality of energy storage elements of an energy store that contacts the heat exchange surface.

A method uses a sheet shaped member to separate two spaces from each other. The sheet shaped member includes a base having a first principal surface and a second principal surface, and a moisture permeable membrane provided on or close to the first principal surface of the base. The first principal surface of the base is arranged in one of the two spaces having a lower water vapor pressure when the two spaces separated from each other by the sheet-like member have different water vapor pressures.

Vapor flow-diverting devices that re-direct upwardly flowing vapor, for example, in a downward direction across condenser tubes disposed in the upper or top section of a vapor-liquid contacting apparatus, are described. These devices are particularly beneficial in tubular condensers within distillation columns and may be used in combination with other associated equipment (e.g., a deflector plate and divider plate) as well as in combination with the tube surface enhancements to improve the heat transfer coefficient.