The present invention relates generally to a manifold for a parallel flow heat exchanger and a heat exchanger incorporating that manifold. The manifold comprising a first plurality of channels each having a first opening facing a first direction and a second opening facing a second direction different from the first direction. The manifold further comprises a second plurality of channels interleaved with the first plurality of channels, the second plurality of channels having a third opening facing a third direction and a fourth opening facing the first direction, wherein the third direction is different from the first direction and the second direction.

A heat exchanger for fluids includes an elongated conduit. At least two spaced fluid passageways are defined in the conduit and extend longitudinally through the conduit from a first end thereof to a second end thereof. A heat transfer element thermally contacts a surface of the conduit to transfer heat to or from a fluid flowing through the at least two spaced passageways. The conduit can be unitary and of one piece. In one embodiment, the conduit can be a single crystal.

A heat exchanger for fluids includes an elongated conduit. At least two spaced fluid passageways are defined in the conduit and extend longitudinally through the conduit from a first end thereof to a second end thereof. A heat transfer element thermally contacts a surface of the conduit to transfer heat to or from a fluid flowing through the at least two spaced passageways. The conduit can be unitary and of one piece. In one embodiment, the conduit can be a single crystal.

Embodiments for a heat pipe heat flux rectifier are provided. One embodiment includes a first curved diode heat pipe that includes an adiabatic section that includes a curved portion, an evaporator section that is coupled to the adiabatic section, and a condenser section that is coupled to the adiabatic section. In some embodiments, the first curved diode heat pipe includes a non-condensable gas reservoir that is coupled to the condenser section for storing non-condensable gas, where the first curved diode heat pipe stores a fluid and a wicking material. In some embodiments, the first curved diode heat pipe operates as a thermal conductor when heat is applied to the evaporator section and as a thermal insulator when heat is applied to the condenser section.

Embodiments for a heat pipe heat flux rectifier are provided. One embodiment includes a first curved diode heat pipe that includes an adiabatic section that includes a curved portion, an evaporator section that is coupled to the adiabatic section, and a condenser section that is coupled to the adiabatic section. In some embodiments, the first curved diode heat pipe includes a non-condensable gas reservoir that is coupled to the condenser section for storing non-condensable gas, where the first curved diode heat pipe stores a fluid and a wicking material. In some embodiments, the first curved diode heat pipe operates as a thermal conductor when heat is applied to the evaporator section and as a thermal insulator when heat is applied to the condenser section.

A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.

A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.

The first and second media are coupled via evanescent waves generated by surface phonon polaritons thermally excited on surfaces of the first and second media. First and second media made of the same material are disposed with a gap formed between for cutting off thermal conduction and the heat transfer between them is performed via the thermally excited evanescent waves. A third medium is provided on a surface of the first medium on a side toward the second medium. Heat flux flows from the second medium to the first medium in a first state wherein the second medium has a first temperature T.sub.H and the first medium has a second temperature T.sub.L lower than the T.sub.H differ in intensity from heat flux which flows from the first to the second medium in a second state wherein the first medium has the T.sub.H and the second medium has the T.sub.L.

Provided is a structure including a first member (2); a second member (3) disposed opposite to the first member (2); and a glass layer (4) disposed between the first member (2) and the second member (3) so as to bond the first member (2) and the second member (3). A glass transition point of the glass layer (4) is lower than a temperature of the glass layer (4) under operation. In the glass layer (4), at least either of ceramic and metallic particles 4b, 4c is dispersed. In a temperature region lower than the glass transition point of the glass layer (4), a thermal expansion coefficient thereof falls in between thermal expansion coefficients of the first member (2) and the second member (3). This allows thermal strain caused within the structure (1) to be reduced when the structure (1) is operated at a higher temperature than a room temperature.

Provided is a structure including a first member (2); a second member (3) disposed opposite to the first member (2); and a glass layer (4) disposed between the first member (2) and the second member (3) so as to bond the first member (2) and the second member (3). A glass transition point of the glass layer (4) is lower than a temperature of the glass layer (4) under operation. In the glass layer (4), at least either of ceramic and metallic particles 4b, 4c is dispersed. In a temperature region lower than the glass transition point of the glass layer (4), a thermal expansion coefficient thereof falls in between thermal expansion coefficients of the first member (2) and the second member (3). This allows thermal strain caused within the structure (1) to be reduced when the structure (1) is operated at a higher temperature than a room temperature.