A heat conduction member includes: a cylindrical ceramic body, a metal pipe on the outer periphery side of the cylindrical ceramic body, and an intermediate member held between the cylindrical ceramic body and the metal pipe. The cylindrical ceramic body has passages passing through from one end face to the other end face and allowing the first fluid to flow therethrough. The intermediate member is made of material having at least a part having a Young's modulus of 150 Gpa or less. The first fluid is allowed to flow through the inside of the cylindrical ceramic body while the second fluid having lower temperature than that of the first fluid is allowed to flow on the outer peripheral face side of the metal pipe to perform heat exchange between the first fluid and the second fluid.

A heat transfer device includes a first and second substrate, and a heat transfer layer. The first substrate includes a first plate and a first adhesive layer that is formed on the first plate. The second substrate includes a second plate and a second adhesive layer that is formed on the second plate. The heat transfer layer is sandwiched between the first adhesive and second adhesive layers, and includes a plurality of carbon flakes that is made from one of graphene or graphite. The carbon flakes lies on the first adhesive layer with partial overlap of the carbon flakes.

A heat transfer device includes a first and second substrate, and a heat transfer layer. The first substrate includes a first plate and a first adhesive layer that is formed on the first plate. The second substrate includes a second plate and a second adhesive layer that is formed on the second plate. The heat transfer layer is sandwiched between the first adhesive and second adhesive layers, and includes a plurality of carbon flakes that is made from one of graphene or graphite. The carbon flakes lies on the first adhesive layer with partial overlap of the carbon flakes.

A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.

A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.

Disclosed is a concrete box beam using a refrigeration stirrup, which may include a box beam, an evaporation pipe, a water inlet pipe, and a water removal assembly; the box beam is provided with a plurality of steel bars in a circumferential direction; the n evaporation pipe surrounds and is connected to an outer side of the plurality of steel bars and an input end of the evaporation pipe is higher than an output end of the evaporation pipe; an output end of the water inlet pipe is connected to the input end of the evaporation pipe, and the water inlet pipe is connected to a three-way valve; and the water removal assembly includes a water sealing cavity, the output end of the evaporation pipe is connected to the water sealing cavity by means of a recovery pipe, the water sealing cavity is connected to a first pipeline.

A flat heat pipe with a two-phase liquid-vapor working fluid, includes a first plate receiving thermal energy from a heat source, a second plate transferring thermal energy to a cold source, an edge to form a hermetically sealed enclosed internal space, a capillary structure interposed between the first and second plates, vaporization channels adjacent to the first plate, condensation channels adjacent to the second plate, a transfer passage placing the evaporation channels in communication with the condensation channels for the transport of vapor, and a collection channel forming a reservoir, in fluid communication with each condensation channel. The collection channel is adjacent to the second plate, such that the collection channel can pump and store the excess liquid phase.

A flat heat pipe with a two-phase liquid-vapor working fluid, includes a first plate receiving thermal energy from a heat source, a second plate transferring thermal energy to a cold source, an edge to form a hermetically sealed enclosed internal space, a capillary structure interposed between the first and second plates, vaporization channels adjacent to the first plate, condensation channels adjacent to the second plate, a transfer passage placing the evaporation channels in communication with the condensation channels for the transport of vapor, and a collection channel forming a reservoir, in fluid communication with each condensation channel. The collection channel is adjacent to the second plate, such that the collection channel can pump and store the excess liquid phase.

Devices and methods for fabrication of a multiscale porous high-temperature heat exchanger for high-temperature and high-pressure applications are disclosed. The heat exchanger can include a core with macrochannels formed in a checkerboard pattern to facilitate alternative flow of working fluid having hot and cold temperatures between adjacent macrochannels. Each macrochannel can include a two-dimensional microchannel array that further distributes flow throughout the heat exchanger to enhance heat transfer and mechanical strength without significant pressure drop penalty. The heat exchanger can further include a header integrated therewith to distribute working fluid flowing through the heat exchanger through the outlets such that it flows evenly therethrough. Methods of fabricating heat exchangers of this nature are also disclosed.

Devices and methods for fabrication of a multiscale porous high-temperature heat exchanger for high-temperature and high-pressure applications are disclosed. The heat exchanger can include a core with macrochannels formed in a checkerboard pattern to facilitate alternative flow of working fluid having hot and cold temperatures between adjacent macrochannels. Each macrochannel can include a two-dimensional microchannel array that further distributes flow throughout the heat exchanger to enhance heat transfer and mechanical strength without significant pressure drop penalty. The heat exchanger can further include a header integrated therewith to distribute working fluid flowing through the heat exchanger through the outlets such that it flows evenly therethrough. Methods of fabricating heat exchangers of this nature are also disclosed.