A metal-resin complex, comprising a space surrounded by a metal component and a resin component, the resin component comprising at least one fragile portion.

A metal-resin complex, comprising a space surrounded by a metal component and a resin component, the resin component comprising at least one fragile portion.

Embodiments for a heat pipe heat flux rectifier are provided. One embodiment includes a first curved diode heat pipe that includes an adiabatic section that includes a curved portion, an evaporator section that is coupled to the adiabatic section, and a condenser section that is coupled to the adiabatic section. In some embodiments, the first curved diode heat pipe includes a non-condensable gas reservoir that is coupled to the condenser section for storing non-condensable gas, where the first curved diode heat pipe stores a fluid and a wicking material. In some embodiments, the first curved diode heat pipe operates as a thermal conductor when heat is applied to the evaporator section and as a thermal insulator when heat is applied to the condenser section.

The present invention is a heat management device for a hookah, wherein the device is provided to enclose a heat source such as burning charcoal. The heat source is provided on the top surface of a base which conducts heat to tobacco located at the bottom side of the base. The heat management device is further provided with a hollow riser which defines an air path from the top side of the base to the bottom side of the base while preventing particulate from the heat source from contaminating the tobacco.

A heat-dissipation substrate structure with high adhesive strength is provided. The heat-dissipation substrate structure includes a heat-dissipation base layer, a functional layer, and a matching layer. The functional layer is formed by sputtering, and has a single layer structure or a multi-layer structure. A thickness of each layer of the functional layer is less than 3 μm. The matching layer has a single layer structure or a multi-layer structure, and a thickness of each layer of the multi-layer structure of the matching layer is less than 1 μm. The matching layer is formed by sputtering of one or any two of titanium, titanium alloy, nickel, and nickel alloy. The functional layer and the heat-dissipation base layer are two heterogeneous metal layers, and the matching layer is located between the functional layer and the heat-dissipation base layer.

An electronic module includes a semiconductor package including a semiconductor chip and an electrically insulating encapsulation body encapsulating the semiconductor chip, the encapsulation body completely covering a second main face and four side faces of the semiconductor chip, wherein a first main face of the semiconductor chip that is opposite the first main face is exposed from the encapsulation body, a heat spreader attached to the semiconductor package, the heat spreader completely covering the first main face of the semiconductor chip, and an electrically insulating layer disposed on the heat spreader remote from the semiconductor package. The electrically insulating layer is completely separated from the semiconductor chip.

A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.

Cooling assemblies including a porous three dimensional surface such as a heat sink are disclosed. In one embodiment, a cooling assembly includes a heat transfer substrate having a surface, a thermally conductive fin extending from the surface, a metal mesh bonded to a surface of the thermally conductive fin, and sintered metal particles bonded to the metal mesh and the surface of the thermally conductive fin. The metal mesh defines a macro-level porosity, and the sintered metal particles define a micro-level porosity. In another embodiment, a cooling assembly includes a heat transfer substrate having a surface, a thermally conductive fin extending from the surface of the heat transfer substrate, and sintered metal particles bonded to the surface of the thermally conductive fin. An average diameter of the sintered metal particles increases from a base of the thermally conductive fin to a top of the thermally conductive fin.

An aluminum alloy brazing sheet has high strength, corrosion resistance and elongation, and includes an aluminum alloy clad material. The material includes a core material, one surface of which is clad with a sacrificial material and an other surface of which is clad with an Al—Si-based or Al—Si—Zn-based brazing filler metal. The core material has a composition containing 1.3 to 2.0% Mn, 0.6 to 1.3% Si, 0.1 to 0.5% Fe and 0.7 to 1.3% Cu, by mass, with the balance Al and impurities. The sacrificial material has a composition containing more than 4.0% to 8.0% Zn, 0.7 to 2.0% Mn, 0.3 to 1.0% Si, 0.3 to 1.0% Fe and 0.05 to 0.3% Ti, by mass, with the balance Al and impurities. At least the core material has a lamellar crystal grain structure. Elongation of material is at least 4% and a tensile strength after brazing is at least 170 MPa.

An aluminum alloy brazing sheet has high strength, corrosion resistance and elongation, and includes an aluminum alloy clad material. The material includes a core material, one surface of which is clad with a sacrificial material and an other surface of which is clad with an Al—Si-based or Al—Si—Zn-based brazing filler metal. The core material has a composition containing 1.3 to 2.0% Mn, 0.6 to 1.3% Si, 0.1 to 0.5% Fe and 0.7 to 1.3% Cu, by mass, with the balance Al and impurities. The sacrificial material has a composition containing more than 4.0% to 8.0% Zn, 0.7 to 2.0% Mn, 0.3 to 1.0% Si, 0.3 to 1.0% Fe and 0.05 to 0.3% Ti, by mass, with the balance Al and impurities. At least the core material has a lamellar crystal grain structure. Elongation of material is at least 4% and a tensile strength after brazing is at least 170 MPa.