A heat transfer device includes a first and second substrate, and a heat transfer layer. The first substrate includes a first plate and a first adhesive layer that is formed on the first plate. The second substrate includes a second plate and a second adhesive layer that is formed on the second plate. The heat transfer layer is sandwiched between the first adhesive and second adhesive layers, and includes a plurality of carbon flakes that is made from one of graphene or graphite. The carbon flakes lies on the first adhesive layer with partial overlap of the carbon flakes.

Adhesive tapes including a thin metal foil layer are described. The tapes also include a layer or one or more regions of a pressure sensitive adhesive. The tapes exhibit a high thermal conductivity and find application as heat transfer components. Also described are heat spreader assemblies using the adhesive tapes.

A welded plate type air to liquid heat exchanger has a plurality of plates each with an internal volume inside a peripheral flange having a flange thickness. The plates are in parallel fluid communication with an inlet and outlet, and are mounted in a frame with a mutual predetermined distance, such that air flows therebetween. The plates are mounted between two plate holding frame members on opposite sides of the plates. The frame members have an exterior edge and slits in a comb-like shape extending from the exterior edge. First type and second type slits are provided in an alternating configuration. The first type are formed with a narrow entry passage section having a width corresponding to the flange thickness and a widened opening section therebehind. The first type receive the peripheral flanges of the plates in the narrow passage section. The second type are substantially straight and vacant.

A brazed heat exchanger, for example a heat exchanger to be used in an air-conditioning system, preferably as a condenser, includes flat tubes extending between a pair of header tubes and fins arranged between the flat tubes. The components are produced from aluminum alloys, and are brazed together using an AlSi braze alloy. The aluminum alloys have a zinc content of no greater than 0.5% before brazing, and zinc from the aluminum alloys diffuses into the braze joints to result in braze joints having an average zinc content of no greater than 0.1%.

Disclosed is an aluminum alloy brazing sheet including a core material, a brazing filler material provided on one surface of the core material and formed of an Al—Si based alloy, and a sacrificial anode material provided on the other surface of the core material, the brazing sheet having a thickness of less than 200 μm, wherein the core material includes more than 1.5% by mass and 2.5% or less by mass of Cu, and 0.5 to 2.0% by mass of Mn, with the balance being Al and inevitable impurities, wherein the sacrificial anode material includes 2.0 to 10.0% by mass of Zn, an Mg content in the sacrificial anode material being restricted to 0.10% or less by mass, with the balance being Al and inevitable impurities, and wherein each of the brazing filler material and the sacrificial anode material has a thickness thereof in a range of 15 to 50 μm, and the total of cladding rates of the brazing filler material and sacrificial anode material is 50% or less.

A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.

A Co-based alloy heat exchanger comprises: in mass %, 0.08-0.25% C; 0.1% or less B; 10-30% Cr; 5% or less Fe and 30% or less Ni, the total amount of Fe and Ni being 30% or less; W and/or Mo, the total amount of W and Mo being 5-12%; Ti, Zr, Nb and Ta, the total amount of Ti, Zr, Nb and Ta being 0.5-2%; 0.5% or less Si; 0.5% or less Mn; 0.003-0.04% N; and the balance being Co and impurities. The impurities include 0.5% or less Al, and 0.04% or less O. The heat exchanger is a polycrystalline body of matrix crystal grains with an average size of 5-100 μm. In the matrix crystal grains, segregation cells with an average size of 0.13-2 μm are formed, wherein components constituting an MC type carbide comprising Ti, Zr, Nb and/or Ta are segregated in boundary regions of the segregation cells.

A heat exchanger includes a header and an annular core fluidly connected to the header. The annular core includes an inner diameter, an outer diameter, first flow channels arranged in a first set of layers, and second flow channels arranged in a second set of layers and interleaved with the first flow channels. Each of the first flow channels includes a first inlet, a first outlet, and a first axial region extending between the first inlet and the first outlet. Each of the second flow channels includes a second inlet, a second outlet, and a second axial region extending between the second inlet and the second outlet.

A heat dissipation substrate for increasing solderability is provided. The heat dissipation substrate for increasing solderability includes a heat dissipation layer serving as a base layer, a plating layer formed on the heat dissipation layer, and a protective layer formed on the plating layer. The protective layer is made of one of tin and tin alloy, and the protective layer is capable of being melted in a subsequent process, such that the protective layer is a meltable protective layer.

An onboard electronic device includes: an element that generates heat; a member that is provided between the element and a coolant cooling the element, and differs in thermal expansion coefficient from the element; an element temperature sensor that detects the temperature of the element; a coolant temperature sensor that detects the temperature of the coolant; and a controller that controls operation of the element such that the temperature of the element allowed when the temperature of the coolant is a first temperature is lower than the temperature of the element allowed when the temperature of the coolant is a second temperature that is higher than the first temperature.