Aspects of the disclosure are directed to methods and/or apparatuses involving one or more of a conductive polymer, deposition of a conductive polymer and 3D (three-dimensional) printing of a continuous bead of material. As may be implemented in accordance with one or more embodiments characterized herein, a 3D structure is formed as follows. A stacked layer is formed by depositing a continuous bead of material along an uninterrupted path that defines a first layer of the 3D structure. A sidewall of the 3D structure is formed with opposing surfaces respectively defined by successive stacked layers of the 3D structure by, for each stacked layer (including the first layer), depositing the continuous bead of material along the path and with a surface thereof in contact with a surface of the continuous bead of material of an adjacent one of the stacked layers.

A heat exchanger includes a separator member that divides a first flow passage from a second flow passage. The heat exchanger also includes a plurality of first hollow members that extend across the first flow passage at respective non-orthogonal angles. The plurality of first hollow members are fluidly connected to the second flow passage. Moreover, the heat exchanger includes a plurality of second hollow members that extend across the second flow passage at respective non-orthogonal angles. The plurality of second hollow members are fluidly connected to the first flow passage.

A thermal management assembly is provided for both removing heat and absorbing acoustic energy. The thermal management assembly includes a heat sink base component and a plurality of thermally conductive fins disposed in a sparsely-arranged array in thermal communication with the heat sink base component. Each fin defines a two-sided Helmholtz unit cell disposed in a periodic array extending from the heat sink base component. Each unit cell includes a lossy resonator and a lossless resonator. The lossy resonator includes a first chamber portion bounded by at least one first boundary wall defining a first chamber volume, and a first neck forming an opening in the first chamber portion. The lossless resonator includes a second chamber portion bounded by at least one second boundary wall defining a second chamber volume, and a second neck forming an opening in the second chamber portion.

A heat dissipation unit and a heat dissipation device using same are disclosed. The heat dissipation device includes a base and one or more heat dissipation units. The base has a first side and an opposite second side; and the heat dissipation units respectively include at least one radiation fin correspondingly provided on the first side of the base. The radiation fin is formed by correspondingly closing a first plate member and a second plate member to each other, such that a plurality of independent flow channels is defined between the closed first and second plate member. And, the independent flow channels respectively have an amount of working fluid filled therein.

A radiator is provided having high heat dissipation performance while being compact and lightweight. A radiator 1 is configured from a base portion 4 having a heat receiving surface 2 abutting on a heat generating element, such as a semiconductor device and an electronic component, and a heat transfer surface 3 opposed to the heat receiving surface 2 and a fin 5 extending from the heat transfer surface 3 of the base portion 4. In the radiator 1 thus configured, the fin 5 is configured from a fin base 5a extending from the heat transfer surface 3 and a plurality of heat diffusing projections 8 and 9 formed on a surface of the fin base 5a.

A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base, at least one heat dissipation fin, and at least one fluid replenisher. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet. The at least one fluid replenisher is connected to at least one internal channel.

A heat sink structure includes a plurality of radiation fins and a base. Each of the radiation fins has a connecting end and a free end, and internally defines a chamber extended between the connecting end and the free end for filling a working fluid therein. The base has an upper connecting surface provided with a plurality of connecting sections and a lower heat receiving surface in contact with a heat source. The connecting ends of the radiation fins are integrally connected to the connecting sections of the base in one-to-one correspondence through overmolding, so as to eliminate thermal resistance between the radiation fins and the base.

A method includes providing a first metal sheet and a second metal sheet, printing patterns of a plurality of obstructers, a plurality of channels, an evaporator channel, a condenser channel, and a connecting channel on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other, separating the first metal sheet and the second metal sheet from each other to form the plurality of channels, the evaporator channel, the condenser channel, and the connecting channel by introducing a fluid between the first metal sheet and the second metal sheet, introducing working fluid in the plurality of channels, and sealing the first metal sheet and the second metal sheet.

A heat exchanging system includes a tank including a fluid inlet and a fluid outlet, which encloses (envelopes) a heat exchanger including a manifold tube and one or more one heat exchanging plates, extending from the manifold tube. The manifold tube includes a fluid intake and the fluid outlet, as well as a manifold barrier, which divides the interior of the manifold tube (for example, which is hollow), so as to define within the manifold tube an intake region and an outlet region. The heat exchanging system also has at least one heat exchanging plate extending from the manifold tube, the at least one heat exchanging plate with at least one plate barrier, such that the heat exchanging plate is configured to define a fluid flow path within the heat exchanging plate such that fluid flows from the intake region of the manifold tube.

A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.