A heat exchange apparatus, and method of forming the apparatus, are disclosed. The apparatus includes a thermally conductive substrate with a metal microlattice structure adhered to the thermally conductive substrate and in thermal communication with the thermally conductive substrate, the metal microlattice structure comprising a region containing an electroless metal. A method of making the apparatus includes forming a polymer lattice, applying the polymer lattice to a thermally conductive substrate, forming an electroless plated metal layer on the polymer lattice, forming an electroplated metal layer on the electroless metal layer, and forming a metal microlattice of the electroless metal layer and the electroplated metal layer.

A cooling system for an electronic circuit package is provided. The cooling system includes a heat transfer plate positioned in thermal contact with an electronic circuit package surface and forming the bottom surface of an evaporative region of the cooling system. The cooling system also includes a plurality of condensing tubes in fluid communication with, and extending away from, the evaporative region, such that the evaporative region and the condensing tubes together form a single, uninterrupted, sealed enclosure. The cooling system also includes a fluid within the sealed enclosure. The cooling system also includes a plurality of spacers filling gaps between the heat transfer plate and the condensing tubes, such that each spacer is configured as an independent component to allow the passage of fluid through the interior space of each spacer. The cooling system also includes a plurality of wicks, where each wick is positioned partially within a corresponding spacer to which it is fluidically coupled.

A cooling device having a surface configured to allow the circulation of a heat-transfer fluid along the surface in a first direction D1, an exchange of heat being able to take place by convection between the cooling device and the fluid, the device includes n cooling fins, n being an integer greater than or equal to one, each cooling fin forming a protuberance of the device, extending primarily in a plane (P) containing the first direction (D1), in each fin, at least two inserts having a tube form and a dimension characteristic of a section of the tube and extending primarily in a second direction (D2) of the plane P distinct from the first direction (D1), the inserts having, over their greater length, a thermal resistance lower than the thermal resistance of the cooling fin along the same length, each insert being distant in the first direction (D1) from another insert by a length equal to or greater than the characteristic dimension of the section of the tube of the insert.

A cooling apparatus (1) for cooling a fluid withsurface water, comprising at least one tube (8) for containing and transporting the fluid in its interior, the exterior of the tube (8) being in operation at least partially submerged in the surface water so as to cool the tube (8) to thereby also cool the fluid. The cooling apparatus (1) further comprises at least one light source (9) for producing light that hinders fouling on the submerged exterior, wherein the light source (9) is dimensioned and positioned with respect to the tube (8) so as to cast anti-fouling light over the tube's exterior. By this structure anti-fouling of the cooling apparatus (1) can be assured in an alternative and effective manner.

The present disclosure provides a thermal superconductive finned heat sink and an electrical equipment cabinet. The thermal superconductive finned heat sink includes: a base plate; a plurality of thermal superconductive fins inserted into the surface of the base plate; the thermal superconductive fin has a composite plate structure, a thermal superconductive channel line is formed in the thermal superconductive fin, the thermal superconductive channel line is a closed channel line, and is filled with heat-transfer working medium; the thermal superconductive fin has a U-shaped plate structure, including a flat plate main body and sides which bend relative to the flat plate main body; the projection area of the plurality of thermal superconductive fins, onto the plane where the base plate is located, is greater than the area of the base plate.

A pin fin heat sink includes a plurality of pin fins extending from a base plate, at least one of the plurality of pin fins defining a hollow portion therein. The pin fin heat sink also includes an annular ring of metal foam material disposed within the hollow portion, the annular ring of metal foam material having a radially outer surface in direct contact with an inner diameter of the pin fin, the annular ring of metal foam material defining a central cavity. The pin fin heat sink further includes a phase change material disposed within the central cavity.

Methods and systems are provided for a cooling module assembly for a vehicle. In one example, the cooling module assembly includes a first set of fins arranged in a circle, configured to flow a first fluid through a first sinusoidal, continuous inner passage, and a second set of fins, also arranged in a circle and configured to flow a second fluid through a second sinusoidal, continuous inner passage. The second set of fins shares a common plane with the first set of fins and is arranged concentric about the first set of fins.

A cooling apparatus (1) for cooling a fluid by means of surface water, the cooling apparatus comprising at least one tube (8) for containing and transporting the fluid in its interior, the exterior of the tube (8) being in operation at least partially submerged in the surface water so as to cool the tube (8) to thereby also cool the fluid, characterized in that the cooling apparatus is adapted to receive at least one light source (9) for producing light that hinders fouling, wherein, after the cooling apparatus has received the light source, the at least one light source (9) is dimensioned and positioned with respect to the tube (8) so as to cast anti-fouling light over the tubes' (8) exterior.

A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in rack servers are disclosed. An example embodiment includes: a base structure; and a rack column supported by the base structure, the rack column in thermal coupling with a heat-generating device, the rack column containing a constrained vapor bubble (CVB) cell cluster including a plurality of cells in thermal coupling with the heat-generating device at a first end in an evaporator region and in thermal coupling with the base structure at a second end in a condenser region, each cell of the plurality of cells having a wickless capillary driven CVB heat pipe embedded in the cell, each wickless capillary driven CVB heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between the evaporator region and the condenser region.

Methods and systems are provided for a cooling module assembly for a vehicle. In one example, the cooling module assembly includes a first set of fins configured to flow a first fluid through a first sinusoidal, continuous inner passage, and a second set of fins configured to flow a second fluid through a second sinusoidal, continuous inner passage. The second set of fins shares a common plane with the first set of fins and together forms a semi-circular structure.