A fin of a heat exchanger includes: a substrate including aluminum or an aluminum alloy, the substrate including a plurality of holes or a plurality of cutout portions in which a plurality of heat transfer tubes are to be disposed respectively; and an organic layer disposed on an end face of the substrate.

A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.

A microchannel heat exchanger having: fin segments defined between lower and upper fin tips; at each fin tip, the fin segments have inner and outer facing surfaces; each fin segment having louvers having: an upper transition region at an upper louver end, adjacent an upper fin tip; a lower transition region at a lower louver end, adjacent a lower fin tip; and a straight region extending therebetween, wherein: the transition regions along the inner facing surface at each fin tip have a first transition surface having a first transition length, disposed at a first transition angle; the transition regions along the outer facing surface at each fin tip have a second transition surface having a second transition length, disposed at a second transition angle; wherein: the first transition length is longer than the second transition length; and/or the first transition angle is smaller than the second transition angle.

A diffusion bonding heat exchanger includes a first heat transfer plate and a second heat transfer plate. A high-temperature flow path of the first heat transfer plate includes a connection channel portion configured such that a high-temperature fluid can flow across a plurality of channels within at least a range that overlaps a predetermined range in a stacking direction, the predetermined range being a range from a flow path inlet of the second heat transfer plate to a position downstream of the flow path inlet.

A heat exchanger includes a plurality of plate fins. At least one plate fin has a plurality of holes arranged in one or more rows and a contoured region formed adjacent one of the plurality of holes having a sinusoidal corrugation. The contoured region includes a plurality of elongate adjustable lance elements. The plurality of elongate adjustable lance elements are lowered relative to a central plane arranged at a midpoint of an amplitude of the sinusoidal corrugation.

A fin, comprising: multiple fin subunits arranged in multiple rows, the fin subunits in two adjacent rows being arranged in an offset fashion. Each of the fin subunits comprises: a first direction center line and a second direction center line perpendicular to the first direction center line; a hole located at a central part of the fin subunit; four fenestrated zones, with two adjacent fenestrated zones in the four fenestrated zones being arranged as mirror images of each other, centered at the first or second direction center line therebetween; a flat zone comprising a hole periphery flat zone, the hole periphery flat zone being disposed between the hole and each fenestrated zone; each fenestrated zone comprises first, second, third and fourth boundaries, wherein the first boundary is located at that side of each fenestrated zone which faces the hole, the second boundary is located at that side of each fenestrated zone which faces away from the hole, and the third and fourth boundaries extend in a direction parallel to the first direction center line; the first boundary forms a demarcation line between the hole periphery flat zone and each fenestrated zone, and at least a portion of the first boundary is an elliptical arc or a circular arc that is not concentric with the circle center of the hole.

Proposed is a heatsink module for an inverter. The heatsink module includes a housing a bottom face, both spaced side walls, and both flanges. The heatsink module include a heat-dissipation plate including a base fixed to the both flanges; and a plurality of heat-dissipation fins extending downward from a bottom of the base. The heatsink module includes a supporter interposed between the bottom face of the housing and the heat-dissipation fins. The supporter has slots defined therein for accommodating at least portions of the heat-dissipation fins respectively.

A cooler, having individual cooling elements (1) of stacked construction having ducts (25) extending in parallel to one another, each of which delimits a flow chamber (29) for the throughflow of a liquid medium to be cooled, between which at least two layers (3, 5) of individual rows of meandering fins (34) extend, which for the throughflow of air jointly delimit a further flow chamber (26, 28) each, is characterized in that the respective one flow chamber (29), free of obstacles, permits a laminar flow of the liquid medium through the assignable duct (25) in one throughflow direction, in that the height (H1) of each fin (34), viewed transversely to the direction of throughflow of the liquid medium, has at least the same height as the free throughflow cross section of the flow chamber (29) of the adjacently arranged duct (25), viewed in parallel to the extension of the respective fin (34), and in that in every layer (3, 5), a plurality of rows (36) of several fins (34) are arranged in succession, which each viewed in the direction of throughflow of the duct (25) are offset from each other.