A flow heater is described that has a housing in which a flow channel extends from a liquid inlet to a liquid outlet. The heater has a metal plate along which the flow channel runs, and the metal plate carries a heating resistor. Provision is made for the metal plate to carry a corrugated sheet that protrudes into the flow channel and has openings through which the liquid that is to be heated can pass.

An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.

A heat exchanger can be configured to utilize multiple sections of hardway fins that can be configured so that an upper first section of the fins can build up liquid head and a second lower section of the fins can be configured to distribute liquid in an even, or uniform, manner. The first section of fins can utilize a different type of hole arrangement than the second section of fins. For instance, the diameter or width of the holes in the first section may differ from the diameter or width of the holes of the second section. In addition (or as an alternative), fin frequency and/or spacing between immediately adjacent holes in the first section of fins may be different from the spacing between immediately adjacent holes in the second section of fins.

A heat exchanger, the heat exchanger including flat tubes and fins. The flat tubes are provided at intervals along the thickness direction of the flat tubes. The flat tubes are internally provided with fluid channels extending along the longitudinal direction of the flat tubes. The fins are provided between adjacent flat tubes. A plurality of fins between adjacent flat tubes are provided at intervals along the transverse direction of the flat tubes. Each fin extends along the longitudinal direction of the flat tubes. Ventilation windows are provided on the fins.

A heat exchanger includes a first fluid carrying conduit extending along a first conduit axis and configured to convey a first fluid at a first temperature, and a second fluid carrying conduit extending along a second conduit axis and configured to convey a second fluid at a cooler, second temperature. The heat exchanger also includes at least one fin having a first opening for coupling to the first fluid carrying conduit and a second opening for coupling to the second fluid carrying conduit. The at least one fin extends along a fin axis that subtends an acute angle or obtuse angle with at least one of the first conduit axis or the second conduit axis.

A heat exchanger is provided. The heat exchanger comprises: a first header comprising a first globe and a second globe; a second header disposed in parallel with the first header; a tube assembly comprising multiple first tubes for connecting the first header and the second header and causing a refrigerant introduced from the first globe to flow in a first direction toward the position of the second header, and multiple second tubes disposed continuously with the multiple first tubes so as to cause a refrigerant introduced from the second header to flow in a second direction that is opposite to the first direction; and multiple heat exchange-fins individually having multiple insertion portions, into which the multiple first tubes and the multiple second tubes are inserted, respectively, and heat exchange surfaces disposed between the multiple insertion portions. The first heat-exchange fin, which is adjacent to the first header among the multiple heat exchange fins, has a heat-exchange surface including a first surface having a louver formed thereon, and a second surface formed to be flat and adjacent to insertion portions into which multiple second tubes are inserted. The second heat-exchange fin, which is adjacent to the second header, has a heat-exchange surface including a first surface.

A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe, a working fluid and a solder bonding portion. The vapor chamber includes an inner cavity and a first joint. The first joint is formed with a passage being in communication with the inner cavity. The heat pipe is provided with a pipe space and a second joint. The pipe space is in communication with the inner cavity through the passage. The second joint is sleeved to surround the first joint such that one end surface of the second joint is directly contacted with one surface of the vapor chamber. The working fluid is filled within the pipe space and the inner cavity. The solder bonding portion connected to the second joint and the surface of the vapor chamber for integrating the heat pipe and the vapor chamber together.

A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe and a working fluid. The vapor chamber includes an inner cavity, a first capillary structure disposed within the inner cavity, and a first joint connected with the inner cavity. The heat pipe includes a pipe body, a second capillary structure, and a second joint disposed at the pipe body and connected to the first joint, such that a pipe space of the pipe body is in communication with the inner cavity. The second capillary structure includes a first section and a second section. The first section is fixedly disposed within a pipe space and connected to the second section. The second section is curvedly extended from one end of the first section, and connected to the first capillary structure. The working fluid is filled within the pipe space and the inner cavity.

A heat sink for a heat-generating component of an electronic device has a backbone panel with opposing upper and lower surfaces. Cooling elements extend away from the upper surface of the heat sink and terminate in upper ends that define a topological surface. Thermally conducting structures extend away from the lower surface of the heat sink and terminate in tips that define a surface that is complementary to the surface of the heat-generating component of the electronic device.

The present disclosure relates to a heat exchanger and an air conditioner including the same. The heat exchanger may be provided for heat exchange between refrigerant and air. The heat exchanger may include a plurality of refrigerant tubes that are disposed with a clearance (C) therebetween in a first direction (A), in which the air moves, and are disposed to be spaced apart in a second direction (B) crossing the first direction (A) and a plurality of heat exchange fins that are disposed between the plurality of refrigerant tubes disposed to be spaced apart in the second direction (B).