A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

An exemplary cooling system includes a heat transfer device having a base and a plurality of curved fins defining a curved air flow channel. Air flow is provided through the air flow channel, and a plurality of openings through a fin communicate air flow from a first side to a second side of the curved fin.

A heat dissipation device includes a base, a fin array, and an air flow channel. The fin array includes: a plurality of fins protruding in a first direction from the base and arranged side by side in a second direction that intersects with the first direction; and a reinforcing structure coupling two adjacent fins out of the plurality of fins. The air flow channel is surrounded, in the fin array, with the plurality of fins and the reinforcing structure and opens toward an end in the first direction.

Provided is an outdoor unit of an air conditioner, including: an outdoor heat exchanger that has a height longer than a width; and an outdoor blowing fan that is disposed above the outdoor heat exchanger and blows air upward from below the outdoor heat exchanger, in which the outdoor heat exchanger includes: a plurality of radiating fins that contacts air; a gap that is formed between the radiating fins; a louver fin that is cut in the radiating fin and then bent; and a cut-out area that is formed in the radiating fin and formed at a position where the louver fin is cut, the radiating fin includes: a first zone that is disposed above the outdoor heat exchanger and disposed close to the outdoor blowing fan; and a second zone that is located below the first zone, and an area LA1 of the louver fin in the first zone is formed to be larger than an area LA2 of the louver fin in the second zone.

The present disclosure has the advantage of uniformly forming air volumes in each zone of the heat exchanger in the vertical height direction by making the areas of the louver fins arranged in each zone different, even when the outdoor blowing fan is disposed to be biased upward.

A diffusion bonding heat exchanger includes a first heat transfer plate and a second heat transfer plate. A high-temperature flow path of the first heat transfer plate includes a connection channel portion configured such that a high-temperature fluid can flow across a plurality of channels within at least a range that overlaps a predetermined range in a stacking direction, the predetermined range being a range from a flow path inlet of the second heat transfer plate to a position downstream of the flow path inlet.

A cooling apparatus for an electrical component housing includes a fin configured to attach to the electrical component housing so as to conduct heat and cool the electrical component housing. The fin includes a first longitudinal portion and a second longitudinal portion, a first end, and a second end portion connecting the first and second longitudinal portions at a second end, the first longitudinal portion and the second longitudinal portion being disposed at a predetermined siatnce from each other at the first end, and the second end portion having a width that is greater than the predetermined distance.

A heat exchanger prevents cracking in heat transfer plates while avoiding lowering heat-exchange efficiency. Heat transfer plates are arranged with a space between them, and a hollow pipe extends through the plates. A high-temperature gas flows through the space to exchange heat with a liquid in the hollow pipe. The heat transfer plates are elongated in the direction in which parts of the hollow pipe are aligned and can thus have thermal expansion accumulating in the elongation direction. The heat transfer plates each include a thermal expansion absorber between an edge of the heat transfer plate receiving inflow of the high-temperature gas and an inter-pipe portion between adjacent parts of the hollow pipe to absorb thermal expansion of the heat transfer plate. A selected one or more of the inter-pipe portions, rather than all, include the thermal expansion absorber.

A cooling device for dissipating heat from an object. The cooling device comprises a base part arranged for contact with the object, and fins attached to and protruding from the base part in a direction substantially away from the object when in use. The fins are arranged in a first configuration adapted for heat dissipation by natural convection of air and in a second configuration adapted for heat dissipation by forced convection of ambient air movement such as wind. Thereby, the cooling device can provide ample or at least adequate cooling effect on the object both when there is more or less ambient air movement chiefly using the second configuration, and when the ambient air is not moving chiefly using the first configuration.

An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.

An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.