An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.

The present invention relates to an enhanced heat dissipation module, a cooling fin structure and a stamping method thereof. The enhanced heat dissipation module includes a first cooling fin and a second cooling fin. The first cooling fin includes a first tapered tunnel protruding outwards, and the second cooling fin includes a second tapered tunnel protruding outwards. The first tapered tunnel and the second tapered tunnel jointly encircle and form a flow guide channel. Accordingly, a pressure difference is generated by hot air passing through the tapered tunnels, thereby increasing natural thermal convection and further enhancing heat dissipation efficiency of the cooling fins.

A heat exchanger includes: a heat-exchanger core which includes flat fins each having a plurality of cuts arranged on one side of each flat fin and allowing heat transfer tubes to be inserted into the cuts, and which has a recess on the other side of the flat fins; and a heat-exchanger core having protrusions which fits in the recesses. The heat-exchanger core also includes flat fins each of which has a plurality of cuts allowing heat transfer tubes to be inserted into the cuts, and also each of which has protrusions on a side of the fin; and a heat-exchanger core having recesses which allow the protrusions to fit in the recesses.

A refrigerator comprising a storeroom and a cold air supplier configured to supply cold air into the storeroom. Where the cold air supplier comprises a heat exchanger producing cold air, a duct accommodating the heat exchanger and defining a flow path for air to pass through the heat exchanger, and a fan generating an air flow inside the duct. Where the heat exchanger comprises a tube in which a refrigerant flows and a fin coupled to an outer surface of the tube. Where the tube is eccentrically arranged to a side of the duct.

The invention relates to a method for producing a corrugated fin element for a heating register or for another heating device, through which corrugated fin element a flow can pass, to a corrugated fin element produced according to such a method, and to a heating register designed with such corrugated fin elements, wherein the corrugated fin elements are produced by unfolding.

An electronic device includes a heat-generating electronic component, a heat spreader and a heat sink. The heat spreader has an area at least about 4 times greater than the heat-generating component. A first surface of the heat spreader is in thermal contact with the first surface of the heat-generating component along a first, non-dielectric interface. The heat sink has greater mass than the heat spreader and comprises one or more layers of thermally conductive material. A first surface of the heat sink is in thermal contact with the second surface of the heat spreader along a second interface having greater area than the first interface. Dielectric thermal interface material is provided at the second interface in direct contact with the heat spreader and the heat sink, such that the second interface is dielectric.

This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

A heat dissipation structure includes a heat dissipation portion and a heat storage portion. The heat dissipation portion has the heat receiving surface including the contact surface in contact with the semiconductor generating the heat, and dissipates the heat of the semiconductor in contact with the contact surface. The heat storage portion is arranged to sandwich the semiconductor. The heat storage portion has, for example, the heat storage opening portion in which the semiconductor is positioned, and surrounds the semiconductor. The heat storage portion is provided to he in contact with the heat receiving surface, and stores the heat of the semiconductor conducted through the heat dissipation portion.

A core arrangement for a heat exchanger includes a first core layer. The first core layer includes first upstream and downstream ends, first and second parting sheets parallel to one another, and a plurality of adjacent fins disposed between the first and second parting sheets. Each of the plurality of fins extends from a surface of the first parting sheet to a surface of the second parting sheet, and longitudinally between the first upstream end and the first downstream end. The plurality of fins are further laterally arranged to define a plurality of first fluid passages. Each of a subset of the plurality of fins includes an internal slot positioned away from the first upstream end and the first downstream end.

A heat dissipation device has a frame assembly, a gravity loop thermosyphon, and a dissipating fin assembly. The gravity loop thermosyphon has a heat exchanger, a condenser, two bendable tubes, and working fluid. One end of each bendable tube communicates with the heat exchanger and another end of each bendable tube communicates with the condenser and thus the working fluid may circulate therein. After the bendable tubes are bent, the condenser can be moved to an appropriate location or tilted to an appropriate angle according to the environment, and then the location and the angle are fixed via the frame assembly so the gravity loop thermosyphon can adapt for different dissipation assemblies.