A thermal energy transfer device attached to an object to dissipate thermal energy from the object is described. In one aspect, the device includes a non-metal base plate and first and second non-metal plate structures. The base plate includes at least one groove on one of its primary surfaces. An edge of the first plate structure is received in a first groove of the at least one groove of the base plate. An edge of the second plate structure is received in a second groove of the at least one groove of the base plate. At least the first groove or the second groove is a V-notch groove such that the edge of the first plate structure or the edge of the second plate structure that is received in the first groove or the second groove is interlockingly received in the V-notch groove.

A pin for a heat exchanger. The pin includes: a monolithic top section; a monolithic bottom section; and a middle section comprising a plurality of spaced apart sub-pins extending between the top section and the bottom section, wherein the plurality of sub-pins define one or more windows for allowing fluid flow through the middle section. Also disclosed is a layer of a heat exchanger including the pin, as well as a heat exchanger including the layer, and a method of making a layer for a heat exchanger.

A heat exchanger includes: a partition wall that separates two fluids of different temperature; and multiple plate-shaped fins formed on at least one surface of the partition wall and each having a pair of heat transfer surfaces. The partition wall and the multiple fins are made of a same metal material to constitute an integrally molded product. The multiple fins each have a curved part and are arranged to be spaced from one another in a direction intersecting with the pair of heat transfer surfaces. Each heat transfer surface of the pair of heat transfer surfaces is formed with multiple grooves having a depth of 100 μm to 400 μm in a thickness direction of each fin.

A fin for a finned pack for heat exchangers, includes a plate in which a plurality of through holes is made for the positioning of tubes to convey a first heat exchange fluid, the plate having an edge as well as two main faces each to be contacted by a second heat exchange fluid in a crossing direction from an inlet portion to an outlet portion of the edge of the plate.

The heat sink with slotted pin fins includes a thermally conductive base and a plurality of pin fins, which may be substantially cylindrical. Each pin fin has axially opposed upper and lower ends, the lower ends being attached to the base. Each of the pin fins is formed of a thermally conductive material and extends from the base. Each of the pin fins has a slot formed therein extending both diametrically and axially through the pin fin, such that a surrounding fluid medium can flow through the slot formed through pin fin, thus reducing the drag force on the surrounding fluid medium as it impinges upon and flows through the pin fins, increasing the rate of thermal transfer.

The compact tube and plate condenser with cooling fins is similar to a conventional compact tube and plate condenser, but with the addition of thermally conductive cooling fins for enhancing heat transfer with the external environment. The compact tube and plate condenser with cooling fins includes a serpentine tube mounted on a thermally conductive plate. The serpentine tube has opposed inlet and outlet ports for respectively receiving and outputting a refrigerant fluid. The compact tube and plate condenser is folded in a substantially spiral configuration. Additionally, a plurality of thermally conductive cooling fins are mounted on the thermally conductive plate. The serpentine tube, which is preferably formed from a thermally conductive material, the thermally conductive plate, and the additional thermally conductive cooling fins each effect heat exchange between the refrigerant fluid and the external environment.

A heatsink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having successive elements or regions varying according to a fractal relationship. According to one embodiment, a noise spectrum due to fluid flow is wideband. According to another embodiment, surface boundary layers are disrupted to increase heat transfer. Flow-induced vortices may be generated at non-corresponding locations of the plurality of fractally varying heat exchange elements.

A radiator is provided having high heat dissipation performance while being compact and lightweight. A radiator 1 is configured from a base portion 4 having a heat receiving surface 2 abutting on a heat generating element, such as a semiconductor device and an electronic component, and a heat transfer surface 3 opposed to the heat receiving surface 2 and a fin 5 extending from the heat transfer surface 3 of the base portion 4. In the radiator 1 thus configured, the fin 5 is configured from a fin base 5a extending from the heat transfer surface 3 and a plurality of heat diffusing projections 8 and 9 formed on a surface of the fin base 5a.

A heat sink including a metal-formed body having a base board part and two or more fin parts standing on a surface of the base board part and arranged in a parallel manner to each other, and one or more filled bodies consisting of a plurality of coiled metal-wire materials filled in one or more groove parts formed between the fin parts of the metal-formed body; the heat sink in which the coiled metal-wire materials have a first outer diameter at one end part and a second outer diameter at the other end part which is different from the first outer diameter; and the coiled metal-wire materials are metallurgically joined at partially to at least one of an inner surface of the groove parts of the metal-formed body and the other coiled metal-wire materials.

Cooling device for cooling a separate object to be cooled, in particular a technical component, wherein the cooling device comprises at least one cooling-rib body comprising a plurality of cooling ribs, and at least one main body that is open on at least one side, in particular when viewed in cross section, and defines a receiving space configured to receive at least one cooling-rib body, wherein the at least one cooling-rib body comprises at least one fastening element, which is configured to interact with the at least one main-body-side fastening element to form a fastening between the at least one cooling-rib body received in the receiving space and the main body, and the main body comprises at least one fastening element, which is configured to interact with at least one cooling-rib-body-side fastening element to form a fastening between the at least one cooling-rib body received in the receiving space and the main body.