An electronic apparatus with a heat-dissipation system includes a heat-dissipation device including a base, a heat-dissipation structure rotatably disposed on the bottom base, and a drive mechanism configured to selectively rotate the heat-dissipation structure toward one of a plurality of predetermined orientations.

An electronic apparatus with a heat-dissipation system includes a heat-dissipation device including a base, a heat-dissipation structure rotatably disposed on the bottom base, and a drive mechanism configured to selectively rotate the heat-dissipation structure toward one of a plurality of predetermined orientations.

In an anisotropic flexible thermal interface pad, a heat-conduction layer on a dielectric layer is formed by using electroflocking to attach a plurality of thermally-conductive fibers, such as carbon fibers, on the dielectric layer and sealing the fibers with a sealing agent, such as silicone. The sealing agent is less thermally-conductive than the fibers. The plurality of fibers is aligned substantially-unidirectionally to achieve a predetermined inclination angle (e.g., 90) with respect to the dielectric layer for discouraging neighboring fibers to contact each other while maintaining efficient heat transmission along each fiber. Thus, heat is transmitted more efficiently along a direction perpendicular to the dielectric layer than along another direction in parallel thereto. The pad may include additional heat-conduction layers, each configured similar to the heat-conduction layer, stacked together thereon. Fibers in two neighboring heat-conduction layers are interconnected by partial overlapping to facilitate heat transfer between the two neighboring layers.

A cooling apparatus is disclosed. The cooling apparatus comprises a housing, a first liquid and a second liquid located within the housing. The first liquid has a higher density and lower boiling point than the second liquid. The cooling apparatus further comprises a heat exchanging apparatus to transfer heat to the first liquid to evaporate the first liquid to form a first liquid vapour. The cooling apparatus also comprises a plurality of independent energy dissipating members that extend through the housing. These members move in response to a fluid flow created by the interaction of the first liquid vapour and the second liquid and transfer heat to a volume external to the housing. The cooling apparatus can cool a body whilst drawing minimal or even no electrical power. As such the cooling apparatus is environmentally friendly and cheaper to operate.

A heat exchanger, the heat exchanger including flat tubes and fins. The flat tubes are provided at intervals along the thickness direction of the flat tubes. The flat tubes are internally provided with fluid channels extending along the longitudinal direction of the flat tubes. The fins are provided between adjacent flat tubes. A plurality of fins between adjacent flat tubes are provided at intervals along the transverse direction of the flat tubes. Each fin extends along the longitudinal direction of the flat tubes. Ventilation windows are provided on the fins.

A removable heatsink assembly adapted to removably receive a pipe. The removable heatsink assembly includes a first plurality of fins and a second plurality of fins having collar flanges sized to receive a pipe. The fins are received on first and second spacer rods, respectively and are hingedly connected by a hinge rod such that the first and second plurality of fins are pivotally movable about the hinge rod between an open position and a closed position. In the open position, the first and second plurality of fins are positionable over the pipe. In the closed position, the collar flanges of the first and second plurality of fins substantially surround the pipe. A fin clamp secures the first and second plurality of fins together in the closed position about the pipe.

A heat sink structure is provided having fins mechanically altered dynamically to change and optimize the heat sink's performance based on certain environmental conditions. Specifically, the shape of fins of the heat sink structure is dynamically altered in response to environmental conditions that indicate the need for increased thermal performance by spreading the fins through a mechanical device dynamically, or by collapsing the fins to reduce pressure drop across a region when increased thermal performance is not needed.

A heat spreader apparatus, testing system, method may be used to test an electronic device. The heat spreader may include a hollow housing. The hollow housing may define an interior chamber. The hollow housing may include a contact surface. The heat spreader may include a working fluid. The working fluid may be included in the interior chamber. The hollow housing may be configured to be physically compliant. The hollow housing may be physically compliant such that the hollow housing conforms to the shape of a testing surface in response to an applied pressure. The testing surface may be a top surface of a semiconductor. The testing surface may be curved or otherwise lack uniformity. The hollow housing may conform to the curvature or lack of uniformity of the testing surface such that minimal gaps exist between the hollow housing and the surface.

A heat exchanger comprises a base, and a plurality of deformable fins connected to a surface of the base. Some deformable fins have a free end configured to move away from the surface of the base as a function of a local temperature increase of the base. The deformable fins are distributed on the surface of the base to be exposed to a coolant flowing over the surface of the base, wherein a distribution of the deformable fins on the surface of the base is non-uniform.

A heat rejection system that employs temperature sensitive shape memory materials to control the heat rejection capacity of a vehicle to maintain a safe vehicle temperature. The technology provides for a wide range of heat rejection rates by varying the shape and thus effective properties of the heat rejection system in response to temperature. When employed as a radiator for crewed spacecraft thermal control this permits the use of higher freezing point, non-toxic thermal working fluids in single-loop thermal control systems for crewed vehicles in space and other extraterrestrial environments.