Patent classifications
F28F2245/04
METHOD FOR USING SHEET SHAPED MEMBER
A method uses a sheet shaped member to separate two spaces from each other. The sheet shaped member includes a base having a first principal surface and a second principal surface, and a moisture permeable membrane provided on or close to the first principal surface of the base. The first principal surface of the base is arranged in one of the two spaces having a lower water vapor pressure when the two spaces separated from each other by the sheet-like member have different water vapor pressures.
Droplet ejecting coatings
Coating compositions are provided that eject droplets of condensed fluid from a surface. The coatings include a nanostructured coating layer and in some embodiments, also include a hydrophobic layer deposited thereon. The coating materials eject droplets from the surface in the presence of non-condensing gases such as air and may be deployed under conditions of supersaturation of the condensed fluid to be ejected. A heat exchanger design utilizing the coating is described herein.
SUPER WATER REPELLENT POLYMER HIERARCHICAL STRUCTURE, HEAT EXCHANGER HAVING SUPER WATER REPELLENCY, AND MANUFACTURING METHOD THEREFOR
Provided are a super water repellent polymer hierarchical structure, a heat exchanger having super water repellency, and a manufacturing method thereof A super water repellent polymer hierarchical structure can be simply and repeatedly manufactured by using only a method for utilizing a super water repellent hierarchical structure and mechanically molding a polymer material thereon. In addition, a heat exchanger having super water repellency can be provided by providing super water repellency on the fin surface of a heat exchanger by using a dip method and vacuum drying.
Supernucleating multiscale copper surfaces for high performance phase change heat transfer
A method is provided for forming a biphilic surface on a substrate comprising copper, such as a heat exchanger surface, wherein the method involves forming one or more hydrophilic areas on the surface by reacting those areas with at least one of hydrogen peroxide and ammonium hydroxide to form copper oxide and forming hydrophobic areas on the surface by reacting those areas with ammonium hydroxide solution to form copper hydroxide or by chemical etching with a combination of hydrochloric acid, hydrogen peroxide, and iron chloride. The functional surface can exhibit temporal biphilicity in response to one or more stimuli in high performance heat transfer applications.
Antimicrobial surfaces for flow path components
According to an aspect, a flow path component includes a flow path component body having a flow surface. The flow path component also includes a plurality of antimicrobial nanoparticles embedded in the flow surface and at least partially exposed external to the flow surface to provide an antimicrobial surface.
DYNAMIC CYCLE AIR CONDITIONER WITH INCREMENTAL DEHUMIDIFICATION INCORPORATING MULTIPLE CIRCUITS OF THE VOLUME OF AIR
Incremental dehumidification of a volume of air in an indirect evaporative cooler. Dehumidification processes are incorporated with the cooling processes, such that within each circuit a volume of air follows through the indirect evaporative cooler and includes dehumidification as well as cooling of the volume of air. Subsequent circuits of the volume of air, which commence at a lower starting temperature than the prior circuit, result in further dehumidification of the air.
DYNAMIC CYCLE AIR CONDITIONER WITH INCREMENTAL DEHUMIDIFICATION AND STORED WATER MAINTAINED AT A TEMPERATURE LOWER THAN THE ENVIRONMENT
Water temperature conservation for increasing efficiency of an indirect evaporative cooling apparatus. A heat exchanger of the indirect evaporative cooling apparatus includes a dry passage separated from a wet passage by a membrane, the dry passage including an intake portion, an outlet portion, and a loop portion. Water captured from condensation during a dehumidification process can be stored and/or used to wet the wet passage of the heat exchanger to enhance evaporative function. Stored water can be maintained at a relatively lower temperature than the environment, helping to maintain a lower internal apparatus temperature and to further cool circulating air.
DYNAMIC CYCLE AIR CONDITIONER WITH INCREMENTAL DEHUMIDIFICATION INCORPORATING A WET PASSAGE AND A DRY PASSAGE
Incrementally cooling and dehumidifying a volume of air that is substantially at its dew point. Developing a pressure differential within an indirect evaporative cooler between a dry passage and ambient air and/or a wet passage and ambient air, to evaporate liquid outside the dry passage and condense liquid within the wet passage. A pressure differential can be developed by selectively pushing and/or blocking air at predetermined portions of the wet and dry passages.
DYNAMIC CYCLE AIR CONDITIONER WITH INCREMENTAL DEHUMIDIFICATION IN AN INDIRECT EVAPORATIVE COOLER
Dynamically cycling of air in an indirect evaporative cooler. A heat exchanger includes a dry passage separated from a wet passage by a membrane, the dry passage including an intake portion, an outlet portion, and a loop portion. By selectively passing intake air from the intake portion and/or recirculation air from the loop portion using a mixing valve, air is moved into and through the loop portion. The air within the heat exchanger can be selectively passed outside through the outlet portion and/or recirculated by the mixing valve. In this manner air is able to be circulated a number of loop circuits through the loop portion, enabling cooling and/or dehumidifying of air.
DUAL MATERIAL VAPOR CHAMBER AND UPPER SHELL THEREOF
In a dual material vapor chamber and an upper shell thereof, the dual material vapor chamber includes an upper shell, a copper lower shell, and a working fluid. The upper shell includes an aluminum substrate and plural aluminum fins. The aluminum substrate has an outer surface and an inner wall. The aluminum fins individually extend from the outer surface and are formed integrally. A copper deposition layer is coated on the inner wall. The copper lower shell is sealed to the upper shell correspondingly. A chamber is formed between the upper shell and the copper lower shell. The working fluid is filled in the chamber. Therefore, the weight and material cost of the whole vapor chamber can be reduced, and the packing combination between the upper shell and the copper lower shell can be simplified.