Polymer-based selective radiative cooling structures are provided which include a selectively emissive layer of a polymer or a polymer matrix composite material. Exemplary selective radiative cooling structures are in the form of a sheet, film or coating. Also provided are methods for removing heat from a body by selective thermal radiation using polymer-based selective radiative cooling structures, and a cold collection system comprising a plurality of the polymer-based selective radiative cooling structures.

A system and method for operating a selective emitter is provided. One embodiment comprises a heat sink that absorbs heat from an ambient environment, a heat pipe comprising a cooling portion thermally coupled to the heat sink, a wick portion and a heat dissipation portion, and a selective emitter that is thermally coupled to the cooling portion of the heat pipe. The selective emitter converts absorbed heat into radiative energy that is emitted out through the Earth's atmosphere.

Various aspects as described herein are directed to a radiative cooling apparatuses and methods for cooling an object. As consistent with one or more embodiments, a radiative cooling apparatus includes an arrangement of a plurality of different material located at different depths along a depth dimension relative to the object. The plurality of different material includes a solar spectrum reflecting portion configured and arranged to suppress light modes, thereby inhibiting coupling of the incoming electromagnetic radiation, of at least some wavelengths in the solar spectrum, to the object at a range of angles of incidence relative to the depth dimension. Further, the plurality of material includes a thermally-emissive arrangement configured and arranged to facilitate, simultaneously with the inhibiting coupling of the incoming electromagnetic radiation, the thermally-generated electromagnetic emissions from the object at the range of angles of incidence and in mid-IR wavelengths.

The present disclosure relates to a radiative cooling device which is sensitive to the ambient temperature and in which the emissivity changes depending on the infrared wavelength range and emission angle, and a method of cooling an object using the radiative cooling device.

The present disclosure relates to a technical idea of reducing the surface temperature of a material or temperature under a material by emitting heat under a device to the outside by absorbing and emitting long-wavelength infrared light corresponding to the wavelength range of the atmospheric window while minimizing absorption of light of the solar spectrum. More particularly, the present disclosure relates to a technology for providing a radiative cooling device having a multilayer structure that is capable of increasing sunlight reflection through differences in the refractive indexes of the device-forming materials while performing selective emission over the wavelength range of the atmospheric window using a radiative cooling device having a multilayer structure composed of polymers and inorganic materials.

A composite heat dissipation device includes an electromagnetic radiation dissipation pile including a polar dielectric material assembly including a plurality of polar dielectric material units. The polar dielectric material assembly is configured to interact with solar radiation. Surfaces of the polar dielectric material units each are configured to interact with the solar radiation to generate scattering of light. The polar dielectric material units each include an optical phonon configured to interact with thermal radiation to increase strength of the thermal radiation.

A radiation device or the like has a structure for selectively converting thermal energy into an electromagnetic wave. The radiation device has a conductor layer, a semiconductor layer, and a plurality of conductor disks. The plurality of conductor disks are arranged on the semiconductor layer so that the same arrangement pattern is constituted in each of a plurality of unit constituent regions each having a rectangular shape with a side of 4.5 to 5.5 μm. The arrangement pattern of individual unit components includes nine conductor disks so as to correspond to a 3×3 matrix, and the nine conductor disks include four or more kinds of conductor disks having diameters different from each other. As a result, a two-dimensional periodic structure of the arrangement pattern is formed on the semiconductor layer.

Using thermal radiation to supply occupant comfort has long existed in the heating domain, and to a lesser scale in the cooling domain. Cooling power of radiant cooling systems is limited by the risk of condensation on the panel itself, as well as adjacent surfaces. Similarly, convective system losses to the ambient air prevent maintaining a large temperature difference from the surface and the surroundings. The disclosed approach combats these common pitfalls of radiant cooling systems in the building domain, increasing the power and therefore applicability of radiant cooling.

The present disclosure relates to a laminate for radiational cooling including a substrate layer containing a matrix of an infrared light-radiating polymer containing polycarbonate-based polyurethane and particles of a visible light-reflecting inorganic material, and an ultraviolet light-reflecting coating layer formed on the substrate layer and containing an expanded fluorine-based polymer, wherein the ultraviolet light-reflecting coating layer is porous.

A laminate for radiative cooling includes a porous base layer including a visible-ray reflective polymer and having nano-sized pores formed in the visible-ray reflective polymer, and a coating layer formed on one face of the porous base layer and including an infrared-ray emissive polymer.