A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

A heat dissipation unit and a heat dissipation device using same are disclosed. The heat dissipation device includes a base and one or more heat dissipation units. The base has a first side and an opposite second side; and the heat dissipation units respectively include at least one radiation fin correspondingly provided on the first side of the base. The radiation fin is formed by correspondingly closing a first plate member and a second plate member to each other, such that a plurality of independent flow channels is defined between the closed first and second plate member. And, the independent flow channels respectively have an amount of working fluid filled therein.

The present disclosure may disclose cooling devices, including a cooling plate. One or more cooling pipelines may be formed inside the cooling plate. The cooling pipelines may include an inlet pipe, an outlet pipe and one or more connecting pipes. The inlet pipe and the outlet pipe may traverse the cooling plate along a first direction and one end of each of the inlet pipe and the outlet pipe may be blocked. The one or more connecting pipes may traverse the cooling plate along a second direction and both ends of each of the one or more connecting pipes may be blocked, and the inlet pipe and the outlet pipe may be interconnected with two end portions of each of the one or more connecting pipes, respectively, so that a coolant may flow in the cooling device.

A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base, at least one heat dissipation fin, and at least one fluid replenisher. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet. The at least one fluid replenisher is connected to at least one internal channel.

In accordance with the present invention refrigerant compositions are disclosed. The compositions comprise a refrigerant mixture consisting essentially of HFC-32, HFO-1234yf, and CO.sub.2. The compositions are useful as refrigerants in processes to produce cooling and heating, in methods for replacing refrigerant R-410A, and in refrigeration, air conditioning or heat pump systems. These inventive compositions match cooling capacity for R-410A within ±10% with GWP less than 350 or less than 300.

In one general aspect, a microchannel heat exchanger is disclosed. It includes a cover, a base, and thermally conductive sheets between the cover and the base that each define a series of side-by-side lanes aligned with a flow direction. The lanes each include aligned slots that define microchannel segments and are separated by cross ribs. The sheets are stacked between the base and cover so as to cause at least some of the ribs to be offset from each other and allow the microchannel segments in the same lane in adjacent sheets to communicate with each other along the flow direction to define a plurality of microchannels in the heat exchanger.

This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

A heat exchanger includes a core comprising a single piece continuous boundary having a first surface defining a first labyrinth, and an opposing second surface defining a second labyrinth; a first inlet manifold connected to the first labyrinth and configured to supply a first fluid to the first labyrinth; and a second inlet manifold connected to the second labyrinth and configured to supply a second fluid to the second labyrinth; wherein the core comprises a plurality of identical three dimensional unit cell structures replicated in three orthogonal spatial dimensions.

The disclosed embodiments relate to a system that provides a polymer heat exchanger with internal microscale flow passages. The system includes a set of plates comprised of a polymer that includes internal microscale flow passages, which are configured to carry a liquid. The set of plates is organized into a stack, wherein consecutive plates in the stack are separated by fins to form intervening air passages. The system includes a liquid flow pathway, which flows from a liquid inlet, through the internal microscale flow passages in the stack of plates, to a liquid outlet. It also includes an airflow pathway, which flows from an airflow inlet, through the intervening air passages between the consecutive plates in the stack of plates, to an airflow outlet. The liquid flow pathway flows in a direction opposite to a direction of the airflow pathway to provide a counterflow design that optimizes heat transfer between the liquid flow pathway and the airflow pathway.

A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.