A fluid-based cooling device for cooling at least two distinct first heat-generating elements of a heat source assembly is provided. The heat source assembly is in thermal contact with the fluid-based cooling device. The fluid-based cooling device comprises a first plate, a heat sink structure and a second plate. The first plate is configured for thermally contacting the heat source assembly. The heat sink structure is arranged on or in the first plate. The second plate is configured for directing a flow of a cooling fluid to the heat sink structure. The second plate is arranged on the heat sink structure. The heat sink structure comprises at least two heat sink structure portions each corresponding to an associated one of the at least two distinct first heat-generating elements. The second plate comprises at least two fluid inlet opening regions, wherein each of the fluid inlet opening regions is associated with a corresponding heat sink structure portion of the at least two heat sink structure portions.

A cross-over fluid coupling includes a first coupling end and a second coupling end. A plurality of first conduits have inner ends disposed toward the first coupling end and outer ends spaced apart from the inner end toward the second coupling end and being outboard of the inner end. A plurality of second conduits have outer ends that are disposed toward the first coupling end and positioned laterally outboard of the inner end of at least one of the first conduits, and inner ends that are spaced apart from the outer end toward the second coupling end in the axial direction and is laterally inboard of the outer end of the at least one of the first conduits.

A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

A component, and a method of forming a component, including a plurality of representative volume elements, each of the representative volume elements abutting at least one other representative volume element to form the component. Each of the representative volume elements includes at least one dividing structure bound by surfaces offset from a parting surface. The shape and contour of the parting surface defined by a mathematical expression that equals a non-zero constant, the mathematical expression selected to define a triply periodic surface when the expression equals zero.

A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

A method of forming a component includes defining a component volume discretized by a target mesh formed by a plurality of volume elements, each volume element defined, at least in part, by a shape function. The method further includes defining a parting surface within a representative volume element and discretizing the parting surface using a surface mesh that includes a plurality of surface elements and a plurality of surface nodes. The method further includes mapping the surface mesh into each volume element of the target mesh according to the quartic, or higher order, shape functions of the target mesh and forming a component based on the component surface structure produced by the mapped surface mesh.

The application provides a heat exchanger with two opposite airflows, comprises a first partition plate, a fin plate and a second partition plate which are stacked. the fin plate is bent to form a plurality of first peaks and first troughs on the front surface and a plurality of second peaks and second troughs on the back surface; the first peaks are connected to the first partition plate, and the first troughs and the first partition plate define a plurality of first channel for passing gas, the first partition plate is provided with a first through hole communicating with the first channels; the second peaks are connected to the second partition plate, and the second troughs and the second partition plate define a plurality of second channels for passing gas, the second partition plate is provided with a second through hole communicating with the second channels.

A stacked heat exchanger including a core portion having a plurality of plates stacked on each other to define a flat refrigerant passage and a flat heat medium passage. A first connection member that provides an inlet and an outlet for allowing the refrigerant to flow into the refrigerant passage. A second connection member that provides an inlet and an outlet for allowing the heat medium to flow into the heat medium passage, in which the inlet and the outlet are configured in a state where the heat medium flowing into the heat medium passage flows in an opposite direction to that of the refrigerant flowing in the refrigerant passage. The core portion includes an offset fin disposed in at least the refrigerant passage.

Embodiments relate to a system with a primary body in communication with at least one heat source. A chamber housed within the primary body includes a boundary to separate the heat source from fluid contact and a secondary body housed in the chamber. The secondary body includes a conduit and a cover in communication with the conduit wherein the cover has a fluid flow inlet extending into the conduit and the conduit includes a series of convection ports to exhaust fluid into the chamber. Upon surging through the convection ports, the fluid comes in contact with the plenum of the primary body and dissipates the heat generated from the heat source and transferred to the primary body. An outlet, separate from the inlet, removes the fluid from the chamber.

A method of forming a component includes defining a component volume discretized by a target mesh formed by a plurality of volume elements, each volume element defined, at least in part, by a shape function. The method further includes defining a parting surface within a representative volume element and discretizing the parting surface using a surface mesh that includes a plurality of surface elements and a plurality of surface nodes. The method further includes mapping the surface mesh into each volume element of the target mesh according to the quartic, or higher order, shape functions of the target mesh and forming a component based on the component surface structure produced by the mapped surface mesh.