A heat dissipation device includes two connected components and a flexible metal conduit. Each connected component is selected from a manifold, a quick connector, an evaporator, a condenser or a pump. The two connected components are in communication with each other through the flexible metal conduit. The use of the flexible metal conduit is effective to absorb the designing tolerance. In addition, the flexible metal conduit is recyclable.

The present disclosure provides a heat transferring device and a heat transferring component thereof. The heat transferring device includes a heat transferring component, a lower plate and a positioning component. The heat transferring component is in a shape of pouch and includes at least one input end and at least one output end to allow a fluid to be inputted and outputted. The lower plate includes at least one first perforation. The positioning component is disposed on an exterior of the heat transferring component. An end of the positioning component is connected to the lower plate.

A variable fin stack for cooling components in a chassis of a portable information handling system. The variable fin stack comprises a first array of fins coupled to a first conduit and a second array of fins coupled to a second conduit. When the chassis is in a compact configuration for use in a mobile mode, fins in the second array of fins are positioned between fins in the first array of fins and the chassis maintains a form factor. When the chassis is in an expanded configuration for use in a workstation mode, the second array of fins is withdrawn from the first array of fins and the increased surface area provides increased cooling of components operating at higher power levels.

A heat transfer system includes a first vapor chamber, a second vapor chamber spaced from the first vapor chamber, and a flexible thermal strap disposed between and coupled to both the first vapor chamber and the second vapor chamber. The flexible thermal strap permits the second vapor chamber to rotate relative to the first vapor chamber.

A disclosed loop heat pipe includes an evaporator configured to absorb heat from outside by a wall to evaporate a working fluid from a liquid phase to a gas phase; a condenser configured to condense a gas phase working fluid introduced from the evaporator into a liquid phase; an elastic wick configured to contact an inner wall of the evaporator by an elastic force from the elastic wick; and a wick deformation member configured to deform the elastic wick increase a contact pressure of the elastic wick against the inner wall of the evaporator.

A hot water appliance includes a housing defining an inner space; a heat source arranged in the inner space of the housing and comprising at least one burner; a flue gas discharge arranged in the inner space of the housing and configured to discharge combustion gases of the at least one burner therethrough; and a heat exchanger arranged in the inner space of the housing and associated with the flue gas discharge. The combustion gases of the at least one burner form a first heat exchanging fluid of the heat exchanger associated with the flue gas discharge. A flue gas discharge for a hot water appliance and a method for heating a fluid are also described.

The invention provides in one embodiment a heat exchanger module (1) comprising a) a flexible support (100); b) at least one tubular member (200) having its main axis substantially parallel with the plane of the flexible support (100); c) a conductive flexible matrix (300) embedding the at least one tubular member (200); and d) a flexible case (400) enwrapping the flexible support (100), the at least one tubular member (200) and the conductive flexible matrix (300). A coating for a built environment comprising a plurality of heat exchanger modules (1) can be implemented, as well as a system further including pumping means (600). The invention also foresees a method for providing heat exchange processes between the heat exchanger module (1), the coating or the system of the invention and a built environment.

A cooling plate (10) for the temperature control of at least one battery cell, especially for a traction battery, comprising a frame (12) with flow ducts (16) designed for the flowing of a coolant through them and a flexibly configured cover (14), which bounds the flow ducts (16) in fluid-tight manner and is provided for the thermal contacting of the at least one battery cell. It is proposed that the flow ducts (16) comprise at least one perturbing contour (28), which is provided to increase the turbulence in the coolant flowing through the flow ducts (16).

A cold plate apparatus includes a top wall and a bottom wall that enclose a plenum for fluid flow; an inlet and an outlet each formed in one of the top wall or the bottom wall; a first active area within the plenum; a second active area within the plenum; and a partition that extends between the top wall and the bottom wall within the plenum and that separates the first active area from the second active area so that a portion of fluid flowing from the inlet to the outlet through the plenum flows through either the first active area or the second active area but not through both active areas.

Provided is a laminated graphitic layer as an elastic heat spreader, the layer comprising: (A) a plurality of graphitic or graphene films prepared from (i) graphitization of a polymer film or pitch film, (ii) aggregation or bonding of graphene sheets, or (iii) a combination of (i) and (ii), wherein the graphitic or graphene film has a thermal conductivity of at least 200 W/mK, an electrical conductivity no less than 3,000 S/cm, and a physical density from 1.5 to 2.25 g/cm.sup.3; and (B) a conducting polymer network adhesive that bonds together the graphitic or graphene films to form the laminated graphitic layer; wherein the conductive polymer network adhesive is in an amount from 0.001% to 30% by weight and wherein the laminated graphitic layer preferably has a fully recoverable tensile elastic strain from 1% to 50% and an in-plane thermal conductivity from 100 W/mK to 1,750 W/mK.