An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.

A thermal rectifier includes a first panel, a second panel, and a switching mechanism. The switching mechanism includes a first thermally conductive portion thermally connected to the first panel and a second thermally conductive portion thermally connected to the second panel. The switching mechanism switches, as at least one of the first thermally conductive portion or the second thermally conductive portion changes their shape or dimensions, from a heat radiation state to a heat insulation state, or vice versa. The heat radiation state is a state where the first thermally conductive portion and the second thermally conductive portion are thermally coupled together. The heat insulation state is a state where the first thermally conductive portion and the second thermally conductive portion are thermally isolated from each other.

A pressure cap structure for a cooling system having variable opening pressure, which is applied to a cooling system for circulating cooling water to radiate heat generated by an engine of a vehicle, and maintains the inside pressure of the cooling system in a predetermined range, the pressure cap may include a positive pressure spring mounted in a valve body, and operated to connect the cooling system to the outside when the pressure of the cooling system rises, and a shape memory member restored to the initial shape when reaching a predetermined temperature, and mounted between the positive pressure spring and a spring guard supporting the positive pressure spring.

A heat exchanger includes a flow channel operatively connecting a channel inlet to a channel outlet to channel fluid to flow therethrough. The flow channel is defined at least partially by a shape change material. The shape change material changes the shape of the flow channel based on the temperature of the shape change material. The shape change material can include a shape-memory alloy, for example. The shape-memory alloy can include at least one of a nickel-titanium alloy (NiTi), CuAl(X), CuSn, CuZn(X), InTi, NiAl, FePt, MnCu, or FeMnSi.

Embodiments are directed to a temperature calibration system that includes a closed fluidic system, such as a thermosiphon or a heat pipe. The closed fluidic system includes a valve for fluidly separating components therein from each other. In one embodiment, the closed fluidic system is a thermosiphon (or a heat pipe) and the valve is configured, in a closed state, to cover a port of the condenser to fluidly separate the condenser from other components of the thermosiphon. The valve may be a passively activated valve or an electrically actuated valve. In some embodiments, the valve is thermally actuated such that the valve changes state in response to changes in temperature.

The invention relates to a cooling module for a vehicle control unit, comprising a cooling element, connections for conducting a coolant through the cooling element, a turbulence insert placed in the cooling element comprising at least first cooling fins, and at least one first bimetal located in the cooling element, wherein the at least one first bimetal is placed such that it displaces the at least one group of first cooling fins depending on a temperature-dependent shape change of the at least one first bimetal. The invention also relates to a vehicle control unit with a cooling module and a method for water cooling a vehicle control unit.

A socket includes a housing configured to receive a removable Data Storage Device (DSD) and a Thermal Interface Material (TIM). An assembly of the socket is attached to the housing and configured to expand due to heat. In a thermally expanded state, the assembly causes the TIM to come into contact with the removable DSD to draw heat away from the removable DSD. According to another aspect, a retaining strip or assembly is attached to a housing in a configuration such that the retaining strip or assembly expands due to heat to increase a resistance to removal of the removable DSD from the housing when the retaining strip or assembly is in a thermally expanded state.

A beverage container cooling unit has: (a) a housing having a slot for receiving a container therein, (b) a cooling element having a cold supply, (c) a heat conductive panel enabling heat transfer between a container provided in the slot and the cold supply; wherein the heat conductive panel has two material layers fixed against one another: (I) a first material layer defining a cooling surface facing the container receiving slot and an opposed surface, said first layer made of a material having a thermal expansion coefficient of X.sub.1; (ii) a second material layer having a contact surface facing positioned against the opposed surface of the first material layer and a second opposed surface, the second material layer having a thermal expansion coefficient of X.sub.2, different from X.sub.1, the difference in thermal expansion causing the conductive panel to bulge at a change in temperature.

Embodiments of the present disclosure provide techniques and configurations for a semiconductor package with thermal fins, in accordance with some embodiments. In embodiments, a package assembly includes a die and a mold compound disposed on the die, to encapsulate the die. The package may further include a thermal solution including one or more thermal fins attached to the mold compound at their respective ends. The thermal fins may be disposed substantially flat on a top surface of the mold compound at a first temperature, and rise away from the top surface of the mold compound in response to a change of temperature to a second temperature, to reach an enclosure that surrounds the package assembly, to provide direct heat conductivity between the die and the enclosure. The second temperature may be greater than the first temperature. Other embodiments may be described and/or claimed.

A heat exchanger includes a flow channel operatively connecting a channel inlet to a channel outlet to channel fluid to flow therethrough. The flow channel is defined at least partially by a shape change material. The shape change material changes the shape of the flow channel based on the temperature of the shape change material. The shape change material can include a shape-memory alloy, for example. The shape-memory alloy can include at least one of a nickel-titanium alloy (NiTi), CuAl(X), CuSn, CuZn(X), InTi, NiAl, FePt, MnCu, or FeMnSi.