Patent classifications
F28F2255/06
Manufacturing method for a finished product of a heat sink composite having heat dissipation function
The invention relates to a manufacturing process for a heat dissipation heat sink composite having heat dissipation function and a manufacturing method for a finished product thereof. It comprises the steps of rolling a first heat conductive material and a substrate to adhere the first heat conductive material to the substrate for fixation; adhering a second heat conductive material to the substrate for combination; and rolling the second heat conductive material and the substrate for firmly combination and fixation to complete the manufacturing of a composite material.
Manufacture of heat exchangers via hybrid welding
A method for forming a hybrid heat exchanger is provided. The method includes laser-texturing a metal surface to create a plurality of microstructures and subsequently melt-bonding a plastic component to the plurality of microstructures. During melt-bonding, plastic material penetrates the plurality of microstructures and conforms to the plastic component to the metal surface. After hardening inside the microstructures, the plastic component adheres to the metal surface as a hybrid component. As a result, a fastener or snap connection is not required, and the plastic-metal joint provides a barrier to water, glycol-based fluids, air, and other fluids.
Radiative cooling device having multilayer structure
The present disclosure relates to a technical idea of reducing the surface temperature of a material or temperature under a material by emitting heat under a device to the outside by absorbing and emitting long-wavelength infrared light corresponding to the wavelength range of the atmospheric window while minimizing absorption of light of the solar spectrum. More particularly, the present disclosure relates to a technology for providing a radiative cooling device having a multilayer structure that is capable of increasing sunlight reflection through differences in the refractive indexes of the device-forming materials while performing selective emission over the wavelength range of the atmospheric window using a radiative cooling device having a multilayer structure composed of polymers and inorganic materials.
Induction Welding Using a Heat Sink and/or Cooling
A heat sink for use in induction welding includes a number of tiles, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm2/sec. A joint flexibly joins the tiles together.
ENCAPSULATION OF THERMAL ENERGY STORAGE MEDIA
In one embodiment, a phase change material is encapsulated by forming a phase change material pellet, coating the pellet with flexible material, heating the coated pellet to melt the phase change material, wherein the phase change materials expands and air within the pellet diffuses out through the flexible material, and cooling the coated pellet to solidify the phase change material.
Net shape moldable thermally conductive materials
A method of making a heat exchanger with a net shape moldable highly thermally conductive polymer composite includes mixing a polymer and a thermally conductive filler material and molding the polymer composite into heat exchanger components. The heat exchanger can be tailored to varying heating and cooling needs with moldable geometries.
METALLIC THERMAL INTERFACE MATERIALS AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS
A heat-transfer component defines a thermal-interface surface and has a composite thermal-interface material bonded to the thermal-interface surface. The composite thermal-interface material comprises a particulate filler material dispersed within a metallic carrier material having a solid-to-liquid phase-change temperature between about 60° C. and about 90° C. With a thermal-interface material bonded to the thermal-interface surface, the thermal-contact resistance between the thermal-interface material and the heat-transfer component can be reduced or substantially eliminated compared to conventional thermal-interface materials, including conventional metallic thermal-interface materials. The particulate filler material can have a higher bulk thermal conductivity than that of the metallic carrier material and can be wetted by the metallic carrier material, providing a bulk thermal conductivity of the composite thermal-interface material that is higher than that of the carrier material without the particulate filler material. Also disclosed are electrical devices having a heat generating component cooled by such a heat-transfer component.
COMPOSITE MATERIAL, HEAT SPREADER AND SEMICONDUCTOR PACKAGE
A composite material includes a plurality of first layers and a plurality of second layers. The total number of the first and second layers is 5 or more. The first and second layers are stacked alternately in the thickness direction of the composite material, such that the first layer is located at each of the first and second surfaces. The first layers are formed from a metal material containing copper as a main component. The second layer includes a molybdenum plate and a coper filler. The molybdenum plate has first and second faces that are each an end face in the thickness direction, and a plurality of openings extending through the molybdenum plate from the first face to the second face.
Heat dissipation plate and method for manufacturing the same
A method for manufacturing a heat dissipation device that includes stamping a composite plate including a welding material to form a first plate having a plurality of angled grooves, depositing powder in the plurality of angled grooves of the first plate, contacting the first plate to a second plate, and welding the first plate and the second plate together, and sintering powder to obtain a capillary structure.
Induction welding using a heat sink and/or cooling
A heat sink for use in induction welding includes a number of tiles, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm2/sec. A joint flexibly joins the tiles together.